Patents by Inventor Toshio NISHIWAKI

Toshio NISHIWAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9351396
    Abstract: A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: May 24, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Tetsuo Amano, Toshio Nishiwaki
  • Publication number: 20150068788
    Abstract: A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer.
    Type: Application
    Filed: September 12, 2014
    Publication date: March 12, 2015
    Applicant: IBIDEN Co., Ltd.
    Inventors: Tetsuo AMANO, Toshio Nishiwaki
  • Patent number: 8969732
    Abstract: A printed wiring board includes a core insulation layer having via conductors through the core layer, a first structure including an interlayer insulation layer on first surface of the core layer and having via conductors through the interlayer layer in the first structure, and a second structure including an interlayer insulation layer on second surface of the core layer and having via conductors through the interlayer layer in the second structure. The interlayer layers have dielectric constants set to be 4.0 or lower for signal transmission at frequency of 1 GHz, the core layer has thermal expansion coefficient at or below Tg set lower than thermal expansion coefficients of the interlayer layers at or below Tg, the coefficient of the core layer at or below Tg is set to be 75 ppm/° C. or lower, and the conductors in the interlayer layers are stacked on the conductors in the core layer.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: March 3, 2015
    Assignee: IBIDEN Co., Ltd.
    Inventors: Tetsuo Amano, Toshio Nishiwaki
  • Patent number: 8895873
    Abstract: A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: November 25, 2014
    Assignee: IBIDEN Co., Ltd.
    Inventors: Tetsuo Amano, Toshio Nishiwaki
  • Publication number: 20130075140
    Abstract: A printed wiring board includes a core insulation layer having via conductors through the core layer, a first structure including an interlayer insulation layer on first surface of the core layer and having via conductors through the interlayer layer in the first structure, and a second structure including an interlayer insulation layer on second surface of the core layer and having via conductors through the interlayer layer in the second structure. The interlayer layers have dielectric constants set to be 4.0 or lower for signal transmission at frequency of 1 GHz, the core layer has thermal expansion coefficient at or below Tg set lower than thermal expansion coefficients of the interlayer layers at or below Tg, the coefficient of the core layer at or below Tg is set to be 75 ppm/° C. or lower, and the conductors in the interlayer layers are stacked on the conductors in the core layer.
    Type: Application
    Filed: June 27, 2012
    Publication date: March 28, 2013
    Applicant: IBIDEN Co., Ltd.
    Inventors: Tetsuo AMANO, Toshio NISHIWAKI
  • Publication number: 20130075147
    Abstract: A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer.
    Type: Application
    Filed: June 28, 2012
    Publication date: March 28, 2013
    Applicant: IBIDEN Co., Ltd.
    Inventors: Tetsuo Amano, Toshio Nishiwaki