Patents by Inventor Toshiyuki Fukamachi

Toshiyuki Fukamachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200181334
    Abstract: An organic silicon compound represented by the following general formula (1). An organic silicon compound that can fill a heat conductive filler at the high density and can be used in a curable thermal conductive silicone composition capable of suppressing the strength degradation of the curable thermal conductive silicone composition even when the heat conductive filler is densely filled. (In the formula, R1 represents an alkyl group having 1 to 6 carbon atoms, R2 represents independently a hydrogen atom or a nonsubstituted or substituted monovalent hydrocarbon group, R3 and R4 each represents independently a nonsubstituted or substituted monovalent hydrocarbon group, and R5 represents a hydrogen atom or an alkenyl group, and m represents an integer of 1 to 30, and n represents an integer of 3 to 4.
    Type: Application
    Filed: June 22, 2018
    Publication date: June 11, 2020
    Inventors: Yasuhisa ISHIHARA, Takumi FUKAMACHI, Toshiyuki OZAI, Akihiro ENDO
  • Patent number: 5132806
    Abstract: Disclosed is a novel semiconductor integrated circuit device for use in a color VTR (Video Tape Recorder). Concretely, the semiconductor integrated circuit device comprises a substantially rectangular semiconductor chip which has a principal surface, a luminance signal processing unit and a color signal processing unit which are disposed at the positions of the principal surface opposing to each other, and a semiconductor region which is provided in the interspace of the principal surface between the luminance signal and color signal processing units opposing to each other and which is supplied with a bias stable A.C.-wise. Further, the semiconductor region is located substantially at the central portion of the semiconductor chip and is extended so as to intersect with one set of opposing sides of the rectangular semiconductor chip.
    Type: Grant
    Filed: June 15, 1990
    Date of Patent: July 21, 1992
    Assignees: Hitachi, Ltd., Hitachi Microcomputer
    Inventors: Yukinori Kitamura, Setsuo Ogura, Shiro Mayuzumi, Shunji Mori, Toshiyuki Fukamachi, Yuji Kobayashi, Kouichi Yamazaki, Makoto Furihata, Kazuyuki Kamegaki