Abstract: There is provided a polymer composition using which a molded product having excellent balance between rigidity, wear resistance, viscoelastic properties, and heat resistance can be obtained. A polymer composition according to the disclosure includes (A) a conjugated diene rubber (where, a polymer corresponding to the following component (B) is excluded); and (B) a hydrogenated product of a polymer that satisfies the following (1) to (3), which is a polymer in which 80% or more of structural units derived from butadiene are hydrogenated: (1) being a copolymer of a conjugated diene compound containing butadiene and an aromatic vinyl compound, (2) including a polybutadiene block having a vinyl group content of 20% or less, and (3) including a block composed of a conjugated diene compound and an aromatic vinyl compound.

Abstract: A polymer composition includes a conjugated diene-based polymer (A) and a filler having a Mohs hardness of 5 or more (B), where the conjugated diene-based polymer (A) contains a polymer (A1) satisfying expression (i) when a composition ratio (molar ratio) of a structural unit represented by formula (1), a structural unit represented by formula (2), a structural unit represented by formula (3) and a structural unit represented by formula (4) in the polymer is p, q, r and s, respectively. 0.75?(p+(0.5×r))/(p+q+(0.5×r)+s)?0.

Abstract: A polymer composition includes a conjugated diene-based polymer (A) and a liquid polymer (B). The conjugated diene-based polymer (A) includes a polymer (A1) satisfying expression (i) when a composition ratio (molar ratio) of a structural unit represented by formula (1), a structural unit represented by formula (2), a structural unit represented by formula (3) and a structural unit represented by formula (4) in the polymer is p, q, r and s, respectively; a glass transition temperature of the polymer (A1) is ?40° C. or less; and the liquid polymer (B) is polybutadiene, polyisoprene, polyisobutylene, polybutene, or the like. 0.75(p+(0.5×r))/(p+q+(0.5×r)+s)?0.

Abstract: Provided is a block polymer including two or more polymer block As each having a value ? of 0.20 or less and a functional group F containing at least one element selected from a group consisting of nitrogen, silicon, oxygen, and sulfur in a part or all of terminals of the two or more polymer block As, in which the block polymer has a value ? of 0.75 or more, when p, q, r and s are defined as a component proportion (molar proportion) of a structural unit represented by Formula (1), a component proportion of a structural unit represented by Formula (2), a component proportion of a structural unit represented by Formula (3), and a component proportion of a structural unit represented by Formula (4), in the polymer, respectively.

Abstract: Provided is a block copolymer containing 10 mass % or more of a polymer (A1) having a multi-branched structure having four or more polymer chains, the polymer chain having a polymer block A containing 70 mass % or more of a structural unit derived from a conjugated diene compound and a polymer block B containing 70 mass % or more of a structural unit derived from an aromatic vinyl compound, the block copolymer having a functional group F containing at least one element selected from the group consisting of nitrogen, silicon, oxygen, and sulfur in a part or all of terminals of the four or more polymer chains, and the block copolymer having a value ? of 0.75 or more represented by the following equation (i), when p, q, r, and s are defined as component proportions (molar proportions) of structural unit represented by the following formula (1) to formula (4), in the polymer, respectively.

Abstract: A cross-linked product obtained through crosslinking a polymer composition that contains a rubber component, an inorganic filler and a cross-linking agent and that satisfies conditions (a) to (c): (a) the rubber component contains a conjugated diene-based polymer (A) having, when composition ratios (molar ratios) in the conjugated diene-based polymer (A) of structural units represented by formulae (1) to (4) are p, q, r, and s, respectively, a value ? represented by formula (i) of 0.80 or more and 0.97 or less; (b) a blending ratio of the conjugated diene-based polymer (A) is 10% by mass or more relative to a total amount of the rubber component; and (c) a blending ratio of the inorganic filler is 40 to 150 parts by mass relative to 100 parts by mass of the rubber component, wherein the Tg of the cross-linked product is ?25° C. or lower.

Abstract: A polymer composition includes a conjugated diene polymer (A) and a compound (B). The compound (B) is at least one compound selected from the group consisting of a polysiloxane compound and a fluorine-containing compound. The conjugated diene polymer (A) contains, when the composition ratios (molar ratios) in the polymer of the structural units represented by formulas (1) to (4) are p, q, r, and s, respectively, a polymer (A-1) satisfying formula (i). 0.75?(p+(0.5×r))/(p+q+(0.5×r)+s)?0.

Abstract: There is provided a polymer composition using which a molded product having excellent balance between rigidity, wear resistance, viscoelastic properties, and heat resistance can be obtained. A polymer composition according to the disclosure includes (A) a conjugated diene rubber (where, a polymer corresponding to the following component (B) is excluded); and (B) a hydrogenated product of a polymer that satisfies the following (1) to (3), which is a polymer in which 80% or more of structural units derived from butadiene are hydrogenated: (1) being a copolymer of a conjugated diene compound containing butadiene and an aromatic vinyl compound, (2) including a polybutadiene block having a vinyl group content of 20% or less, and (3) including a block composed of a conjugated diene compound and an aromatic vinyl compound.

Abstract: A semiconductor storage device includes a substrate having a wiring, a first semiconductor memory, a terminal portion, a holder surrounding the terminal portion, a case, and a first plate-shaped member. The first semiconductor memory is disposed on a first principal surface of the substrate and is connected to the wiring. The terminal portion is connected to the substrate at a first end portion of the substrate and has a terminal connected to the wiring. The case houses part of the holder, the substrate, and the first semiconductor memory. Between the first principal surface and a first wall portion of the case facing the first principal surface, the first plate-shaped member is disposed. The first plate-shaped member is connected to the holder and the first principal surface on a second end portion side of the substrate, and has thermal conductivity.

Abstract: According to an embodiment, an electronic device includes: a housing including a first face facing a first direction, a second face on an opposite side of the first face, and a third face adjacent to the first and second faces; a connector protruding from the third face; and a first cover connected to the housing, including a fourth face, and being pivotable between a first position where the fourth face faces the first direction and a second position where the fourth face faces the first face. The first cover includes a first stopper that, when the first cover pivots from the first position to the second position, contacts the connector and is elastically deformable in a direction that is a pivoting axial direction of the first cover and is a separating direction from the connector.

Abstract: According to an embodiment, an electronic device includes: a housing including a first face facing a first direction, a second face on an opposite side of the first face, and a third face adjacent to the first and second faces; a connector protruding from the third face; and a first cover connected to the housing, including a fourth face, and being pivotable between a first position where the fourth face faces the first direction and a second position where the fourth face faces the first face. The first cover includes a first stopper that, when the t cover pivots from the first position to the second position, contacts the connector and is elastically deformable in a direction that is a pivoting axial direction of the first cover and is a separating direction from the connector.

Abstract: A semiconductor storage device includes a substrate having a wiring, a first semiconductor memory, a terminal portion, a holder surrounding the terminal portion, a case, and a first plate-shaped member. The first semiconductor memory is disposed on a first principal surface of the substrate and is connected to the wiring. The terminal portion is connected to the substrate at a first end portion of the substrate and has a terminal connected to the wiring. The case houses part of the holder, the substrate, and the first semiconductor memory. Between the first principal surface and a first wall portion of the case facing the first principal surface, the first plate-shaped member is disposed. The first plate-shaped member is connected to the holder and the first principal surface on a second end portion side of the substrate, and has thermal conductivity.

Abstract: According to one embodiment, a semiconductor device includes a board, a controller chip, a semiconductor chip, a sealing portion, and a component. The board includes a first surface and a second surface opposite to the first surface, the first surface comprising a terminal. The controller chip is on the second surface of the board. The semiconductor chip is on the second surface of the board. The sealing portion integrally covers the controller chip and the semiconductor chip and does not cover a region of the second surface of the board. The component is on the region of the second surface of the board to perform an operation with respect to the outside of the semiconductor device.

Abstract: According to one embodiment, a semiconductor device includes a housing including a first wall and a second wall opposite to the first wall, a board in the housing, a first supporter provided on the first wall and configured to support an end of the board in a direction substantially parallel to the first wall, a stopper in the housing, the stopper configured to support the board, and a second supporter provided on the second wall and configured to support the stopper.

Abstract: According to one embodiment, a semiconductor device includes a board, a controller chip, a semiconductor chip, a sealing portion, and a component. The board includes a first surface and a second surface opposite to the first surface, the first surface comprising a terminal. The controller chip is on the second surface of the board. The semiconductor chip is on the second surface of the board. The sealing portion integrally covers the controller chip and the semiconductor chip and does not cover a region of the second surface of the board. The component is on the region of the second surface of the board to perform an operation with respect to the outside of the semiconductor device.

Abstract: According to one embodiment, a semiconductor device includes a housing including a first wall and a second wall opposite to the first wall, a board in the housing, a first supporter provided on the first wall and configured to support an end of the board in a direction substantially parallel to the first wall, a stopper in the housing, the stopper configured to support the board, and a second supporter provided on the second wall and configured to support the stopper.

Abstract: Provided is a thermal storage medium composition which contains 100 parts by mass of a hydrogenated diene copolymer and 50 to 4000 parts by mass of a linear paraffin compound having 12 to 50 carbon atoms, where the hydrogenated diene copolymer is a conjugated diene copolymer that is obtained by hydrogenating a block copolymer which includes a polymer block (A) that contains structural units (a-1) derived from a first conjugated diene compound and has a vinyl bond content of not more than 20 mol %, and a polymer block (B) that contains structural units (b-1) derived from a second conjugated diene compound and has a vinyl bond content of 30 to 95 mol %, the hydrogenation ratio with respect to the double bonds derived from the conjugated diene compounds being not less than 90%.

Abstract: A thermoplastic resin composition contains (i) a polylactic acid, (ii) a polyolefin, and (iii) a compatibilizer (functional group-containing polymer that includes a functional group selected from functional groups X including a carboxyl group, an acid anhydride group, an epoxy group, a (meth)acryloyl group, an amino group, an alkoxysilyl group, a hydroxyl group, an isocyanate group, and an oxazoline group). The thermoplastic resin composition contains (iii-1) a functional group-containing hydrogenated diene polymer and (iii-2) a functional group-containing olefin polymer as the component (iii).

Abstract: [Object] The invention provides a thermal storage medium composition capable of forming a thermal storage medium which is free from phase separation or liquid phase bleeding and is excellent in shape retention properties even at or above the maximum crystal transition temperature of a paraffin compound and further exhibits excellent fluidity when being shaped.

Abstract: A method for producing an amino group-containing conjugated diene polymer includes polymerizing a conjugated diene compound in the presence of a reaction product of 1,3-bis(diphenylethenyl)benzene or a derivative thereof and an organolithium compound to obtain a conjugated diene polymer, and reacting the conjugated diene polymer with a modifier.