Patents by Inventor TOSHIYUKI HIGASHIDA

TOSHIYUKI HIGASHIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10450405
    Abstract: A resin composition contains an epoxy resin, and a curing agent including a first acid anhydride and a second acid anhydride. An unsaturated bond concentration in the second acid anhydride is not higher than 0.7%. The unsaturated bond concentration is represented by following formula (1). The ratio of the number of acid anhydride equivalents of the first acid anhydride to the number of epoxy equivalents of the epoxy resin is between 0.05 and 0.5 (inclusive). The ratio of the total number of acid anhydride equivalents of the first acid anhydride and the second acid anhydride to the number of epoxy equivalents is between 0.5 and 1.1 (inclusive).
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: October 22, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Daisuke Nii, Hidetsugu Motobe, Toshiyuki Higashida
  • Publication number: 20170226276
    Abstract: A resin composition contains an epoxy resin, and a curing agent including a first acid anhydride and a second acid anhydride. An unsaturated bond concentration in the second acid anhydride is not higher than 0.7%. The unsaturated bond concentration is represented by following formula (1). The ratio of the number of acid anhydride equivalents of the first acid anhydride to the number of epoxy equivalents of the epoxy resin is between 0.05 and 0.5 (inclusive). The ratio of the total number of acid anhydride equivalents of the first acid anhydride and the second acid anhydride to the number of epoxy equivalents is between 0.5 and 1.1 (inclusive).
    Type: Application
    Filed: August 25, 2015
    Publication date: August 10, 2017
    Inventors: DAISUKE NII, HIDETSUGU MOTOBE, TOSHIYUKI HIGASHIDA
  • Patent number: 9681541
    Abstract: Resin composition of the present disclosure includes: an epoxy resin; and a hardener, in which the hardener contains a styrene-maleic anhydride copolymer (SMA) and an anhydride having only one anhydride group in a molecule. An acid value of the SMA is in a range from 300 to 550, inclusive. A ratio of an anhydride equivalent number of the anhydride with respect to an epoxy group equivalent number of the epoxy resin is in a range from 0.05 to 0.5, inclusive. A ratio of the total number of the equivalent numbers of the anhydride groups of the anhydride and the SMA with respect to the epoxy group equivalent number is a range from 0.5 to 1.2, inclusive.
    Type: Grant
    Filed: April 16, 2016
    Date of Patent: June 13, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Toshiyuki Higashida, Hidetsugu Motobe, Daisuke Nii
  • Publication number: 20160234934
    Abstract: Resin composition of the present disclosure includes: an epoxy resin; and a hardener, in which the hardener contains a styrene-maleic anhydride copolymer (SMA) and an anhydride having only one anhydride group in a molecule. An acid value of the SMA is in a range from 300 to 550, inclusive. A ratio of an anhydride equivalent number of the anhydride with respect to an epoxy group equivalent number of the epoxy resin is in a range from 0.05 to 0.5, inclusive. A ratio of the total number of the equivalent numbers of the anhydride groups of the anhydride and the SMA with respect to the epoxy group equivalent number is a range from 0.5 to 1.2, inclusive.
    Type: Application
    Filed: April 16, 2016
    Publication date: August 11, 2016
    Inventors: TOSHIYUKI HIGASHIDA, HIDETSUGU MOTOBE, DAISUKE NII