Abstract: A nonvolatile memory device (101) includes a plurality of physical blocks, each of which is provide with a nonvolatile memory (103), a logic/physical address conversion table, a temporary block and a temporary table. The nonvolatile memory (103) includes a plurality of pages which are predetermined writing units, respectively. The logical-physical address conversion table (106) stores correspondence information between logic addresses and physical addresses of data to be stored in the physical blocks. The temporary block is a physical block to store data that are smaller in size than those of the page. The temporary table (107) stores correspondence information between logic addresses and physical addresses with respect to data to be stored in the temporary block.

Abstract: A novel antipruritic useful for the treatment of pruritus accompanying various diseases is disclosed. The antipruritic comprises a specific morphinan derivative having a nitrogen-containing cyclic group or the pharmaceutically acceptable acid addition salt thereof such as N-(17-cyclopropylmethyl-4,5?-epoxy-3,14-dihydroxy-morphinan-6?-yl)-phthalimide hydrochloric acid salt or N-(17-cyclopropylmethyl-4,5?-epoxy-3,14-dihydroxy-morphinan-6?-yl)-3,4,5,6-tetrahydrophthalimide tartaric acid salt.

Abstract: A nonvolatile memory device has a controller and flash memory. The flash memory stores user data and an error correcting code for correcting an error in the user data. When there is a read command from the outside, the user data and error correcting code are read from the flash memory. If there is any correctable error in the read user data, error correction is performed and then the data is outputted. If the there is uncorrectable error, the data is outputted directly without any correction.

Abstract: A nonvolatile storage device can be written and read data by receiving a logical address from a host. The nonvolatile storage device includes: a nonvolatile memory for writing and reading data by a physical address; a logical/physical conversion table for storing information on correspondence between the logical address and the physical address for each predetermined management unit area; a duplication table for storing information on correspondence between the logical address and the physical address of data arranged over a plurality of areas in the duplicate manner in the nonvolatile memory and having a size smaller than the size of the management unit area; and a controller for controlling operation of the nonvolatile storage device.

Abstract: A control method of a non-volatile memory apparatus, which can execute data writing normally after the next startup even when a process is interrupted because of the occurrences of abnormal conditions such as power shut down during data writing or data erasing is provided. The control method of a non-volatile memory apparatus of the present invention comprises: a first flag writing step of writing a fixed value, which indicates that data is written, on a first flag existing in a redundancy area on a first page of a physical block and indicating whether or not data is written on the first page; and a data writing step of writing data on the physical block, when the data is written on the non-volatile memory consisting of a plurality of physical blocks.

Abstract: An energy recovering system of a hydraulic lift device for a battery operated industrial truck. With the system, working oil can be supplied to other hydraulic actuators while energy recovering operation is performed by the hydraulic lift device, and energy recovering efficiency is increased. A hydraulic motor (6) is disposed in a fluid path for recovering pressurized working fluid from a lift cylinder (1) via a control valve (10) to a working fluid reservoir tank (8) so that the hydraulic motor (6) is driven by the pressurized working fluid returning from the lift cylinder (1). The hydraulic motor (6) is connected to an electric motor (4) for driving a hydraulic pump (3), which supplies pressurized fluid to the lift cylinder (1), by means of a one-way clutch (7) which performs torque transmission only from the hydraulic motor (6) to the electric motor (4).

Abstract: It is possible to eliminate the defect that a long time is required for writing into a semiconductor memory card by resulting from the fact, with enlargement of its capacity, that the external data management size is different from the internal data management size in the semiconductor memory card. A partial physical block corresponding to the size managed externally is used regardless of the size of the physical block in a non-volatile memory device. Data are written in the partial physical block unit and an erase block is assured in the physical block unit, thereby enabling the write rate to be increased.

Abstract: In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.

Abstract: The present invention provides an electromagnetic wave shielding material that has high electromagnetic wave shielding effects, excellent transparency, and excellent see-through property, and a simple and inexpensive production process for the electromagnetic wave shielding material. Specifically, the present invention provides a process for producing an electromagnetic wave shielding material, the process comprising screen-printing in a geometric pattern a conductive paste containing a particulate silver oxide, a tertiary fatty acid silver salt, and a solvent, onto a transparent porous layer surface of a transparent resin substrate having a transparent porous layer containing as a main component at least one member selected from the group consisting of oxide ceramics, non-oxide ceramics, and metals; and performing heat treatment to form a conductive region with a geometric pattern on the transparent porous layer surface; and an electromagnetic wave shielding material produced by the production process.

Abstract: A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

Abstract: In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.

Abstract: In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case body 41 so as to surround case body 41. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.

Abstract: A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.

Abstract: To provide an image pickup apparatus with excellent optical characteristics as well as high reliability and a method of manufacturing the same, capable of efficiently manufacturing the image pickup apparatus in large quantities. The image pickup apparatus of the present invention includes a support board 10, an image pickup device 20 mounted on the support board 10, and a lens component 30 provided on the light receiving region of the image pickup device 20, wherein the lens component 30 has a protrusion part 33 provided around the lens part 31, and the height of the protrusion part 33 from the surface of image pickup device 20 is greater than that of the top 31A of lens part 31 from the surface of the image pickup device 20.

Abstract: In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.

Abstract: A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.

Abstract: A ferroelectric memory has a plurality of memory cells each having a transistor and a ferroelectric capacitor arranged in a matrix. Plate lines run in the word line direction above the ferroelectric capacitors of memory cells adjacent to each other in the word line direction among the plurality of memory cells. Bit line contacts each for connecting a bit line and an active region of the transistor are placed in regions between the plate lines adjacent to each other in the bit line direction and between the ferroelectric capacitors adjacent to each other in the word line direction. Cuts are formed at positions of the plate lines near the bit line contacts. The active regions of the transistors of the plurality of memory cells extend in directions intersecting with the word line direction and the bit line direction.

Abstract: A camera module includes a module structure constituted by a lens unit to which an image pickup lens is attached and a package to which an imaging element is attached so as to be opposite to the image pickup lens. An optical filter is arranged between the imaging element and the image pickup lens. A portion of a flat surface of the optical filter is fixed to a filter fixing portion via an adhesive. The optical filter is adhered to the filter fixing portion in a state in which an end portion formed by a side surface of the optical filter and the flat surface is in noncontact with the filter fixing portion or the adhesive. Minute particles generated from a cut surface of the optical filter fall outside the filer fixing portion.

Abstract: A nonvolatile memory device has a controller and flash memory. The flash memory stores user data and an error correcting code for correcting an error in the user data. When there is a read command from the outside, the user data and error correcting code are read from the flash memory. If there is any correctable error in the read user data, error correction is performed and then the data is outputted. If the there is uncorrectable error, the data is outputted directly without any correction.

Abstract: A source block (B0) and the logical page number (“8”) of a write target page are identified from the logical address of the write target page. Data objects (DN8, DN9, . . . , DN12) to be written, which a host stores in a page buffer (2), are written into the data areas (DA) of the pages (Q0, Q1, . . . , Q4) of a destination block (Bn), starting from the top page (Q0) in sequence. The logical page number (“8”) of the write target page is written into the redundant area (RA) of the top page (Q0). The physical page number (“6=8?2”) of the write target page is identified, based on the logical page number (“8”) of the write target page and the page offset (“2”) of the source block (B0). When notified by the host of the end of the sending of the data objects (DN8, . . . , DN12), the data items (D13, . . . , D31, D0, D1, . . . , D7) in the source block (B0) are transferred to the pages (Q5, Q6, . . .