Patents by Inventor Toshiyuki Matsui

Toshiyuki Matsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10886389
    Abstract: There is provided a semiconductor device including a transistor portion and a diode portion. The transistor portion has a first-conductivity-type drift region formed inside a semiconductor substrate, a second-conductivity-type base region provided above the drift region inside the semiconductor substrate, and a second-conductivity-type collector region provided below the drift region inside the semiconductor substrate. The transistor portion has a second-conductivity-type well region provided inside the semiconductor substrate and extending downward beyond the base region and an injection amount restricting portion occupying at least a part of a region that is positioned below the well region and having a smaller second-conductivity-type carrier injection amount per unit area than the collector region.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: January 5, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Toshiyuki Matsui
  • Patent number: 10411449
    Abstract: Provided is an electrical junction box including a lower case and an upper case joined to the lower case, wherein the upper case includes an inner wall that opposes an inner surface of the lower case and an outer wall that opposes an outer surface of the lower case, the outer wall has a first wall portion that is in intimate contact with the outer surface of the lower case and a second wall portion that extends upward continuously from the first wall portion, and an upper end of the lower case is inserted between the inner wall and the second wall portion with clearances CL1 and CL2.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: September 10, 2019
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Toshiyuki Matsui
  • Publication number: 20190157437
    Abstract: There is provided a semiconductor device including a transistor portion and a diode portion. The transistor portion has a first-conductivity-type drift region formed inside a semiconductor substrate, a second-conductivity-type base region provided above the drift region inside the semiconductor substrate, and a second-conductivity-type collector region provided below the drift region inside the semiconductor substrate. The transistor portion has a second-conductivity-type well region provided inside the semiconductor substrate and extending downward beyond the base region and an injection amount restricting portion occupying at least a part of a region that is positioned below the well region and having a smaller second-conductivity-type carrier injection amount per unit area than the collector region.
    Type: Application
    Filed: January 21, 2019
    Publication date: May 23, 2019
    Inventor: Toshiyuki Matsui
  • Publication number: 20180337522
    Abstract: Provided is an electrical junction box including a lower case and an upper case joined to the lower case, wherein the upper case includes an inner wall that opposes an inner surface of the lower case and an outer wall that opposes an outer surface of the lower case, the outer wall has a first wall portion that is in intimate contact with the outer surface of the lower case and a second wall portion that extends upward continuously from the first wall portion, and an upper end of the lower case is inserted between the inner wall and the second wall portion with clearances CL1 and CL2.
    Type: Application
    Filed: May 16, 2016
    Publication date: November 22, 2018
    Inventor: Toshiyuki Matsui
  • Patent number: 9935437
    Abstract: An electrical connection box includes: a casing that has an opening portion open upwardly, a recessed portion recessed downwardly from an upper edge portion of a side wall; and a slidable cover configured to close the recessed portion. A first thin portion is formed at a side edge portion of the recessed portion of the casing. A second thin portion is formed on the slidable cover. The first thin portion and the second thin portion overlap each other when the slidable cover is fitted into the recessed portion. The first thin portion is includes a chamfered portion where a boundary between an opening edge portion of the first thin portion and the side edge portion is chamfered. A contact portion is configured to be brought into contact with the chamfered portion.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: April 3, 2018
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Toshiyuki Matsui
  • Patent number: 9915961
    Abstract: A semiconductor device drive method achieves a balance between a lifetime and a detection sensitivity which are required for a temperature detection diode formed via an insulating film on a substrate on which an active element is formed. The semiconductor device drive method includes energizing the temperature detection diode with a constant current, the constant current having a current density value between an upper limit defined based on the lifetime of the temperature detection diode, and a lower defined based on a variation allowable voltage of an output voltage of the temperature detection diode with respect to a standard deviation.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: March 13, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Toshiyuki Matsui, Hitoshi Abe, Noriaki Yao
  • Patent number: 9870923
    Abstract: A semiconductor device that includes a p-type region formed selectively along one principle surfaces of an n-type drift layer and having a resistance that is lower than that of the drift layer, and in which, when a depth R at which a vacancy-oxygen complex defect region is provided in the drift layer with a thickness t from a surface of a pn junction being a boundary of the p-type region in a thickness direction of the drift layer from a back surface of a semiconductor substrate, resistivity of the drift layer is ?, and width W of a depletion layer extending in the drift layer from the pn junction with a reverse bias voltage V to the pn junction is represented as W=0.54×?/(?×V), the vacancy-oxygen complex defect region is provided at the depth R represented by 0<R?t?W.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: January 16, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Toshiyuki Matsui
  • Publication number: 20170346266
    Abstract: An electrical connection box includes: a casing that has an opening portion open upwardly, a recessed portion recessed downwardly from an upper edge portion of a side wall; and a slidable cover configured to close the recessed portion. A first thin portion is formed at a side edge portion of the recessed portion of the casing. A second thin portion is formed on the slidable cover. The first thin portion and the second thin portion overlap each other when the slidable cover is fitted into the recessed portion. The first thin portion is includes a chamfered portion where a boundary between an opening edge portion of the first thin portion and the side edge portion is chamfered. A contact portion is configured to be brought into contact with the chamfered portion.
    Type: Application
    Filed: May 25, 2017
    Publication date: November 30, 2017
    Inventor: Toshiyuki Matsui
  • Patent number: 9748750
    Abstract: The present invention suppresses an increase in the number of components and simplifies an attachment task. An electrical connection box is configured such that multiple wire harnesses are connected thereto side-by-side vertically. The electrical connection box includes: a lower case having a lower placement portion on which a lower wire harness is to be placed; a harness support member having a lower holding portion that is latched to the lower placement portion and holds the lower wire harness, and having an upper placement portion on which an upper wire harness is to be placed; and an upper case that is mated to the lower case and has an upper holding portion that is latched to the upper placement portion and holds the upper wire harness.
    Type: Grant
    Filed: June 5, 2016
    Date of Patent: August 29, 2017
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Toshiyuki Matsui
  • Publication number: 20160365250
    Abstract: A semiconductor device that includes a p-type region formed selectively along one principle surfaces of an n-type drift layer and having a resistance that is lower than that of the drift layer, and in which, when a depth R at which a vacancy-oxygen complex defect region is provided in the drift layer with a thickness t from a surface of a pn junction being a boundary of the p-type region in a thickness direction of the drift layer from a back surface of a semiconductor substrate, resistivity of the drift layer is ?, and width W of a depletion layer extending in the drift layer from the pn junction with a reverse bias voltage V to the pn junction is represented as W=0.54×?/(?×V), the vacancy-oxygen complex defect region is provided at the depth R represented by 0<R?t?W.
    Type: Application
    Filed: August 25, 2016
    Publication date: December 15, 2016
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Toshiyuki MATSUI
  • Publication number: 20160359306
    Abstract: The present invention suppresses an increase in the number of components and simplifies an attachment task. An electrical connection box is configured such that multiple wire harnesses are connected thereto side-by-side vertically. The electrical connection box includes: a lower case having a lower placement portion on which a lower wire harness is to be placed; a harness support member having a lower holding portion that is latched to the lower placement portion and holds the lower wire harness, and having an upper placement portion on which an upper wire harness is to be placed; and an upper case that is mated to the lower case and has an upper holding portion that is latched to the upper placement portion and holds the upper wire harness.
    Type: Application
    Filed: June 5, 2016
    Publication date: December 8, 2016
    Inventor: Toshiyuki Matsui
  • Patent number: 9236460
    Abstract: A semiconductor device is disclosed. The semiconductor device is capable of obtaining a high reverse recovery resistant amount by allowing sheet resistance of a peripheral portion in a p type diffusion region that is in contact with a metal electrode through an insulating film on a surface to be as high as possible and reducing an increase in cost if possible. The semiconductor device includes: a p type diffusion region that is disposed in a surface layer of the one main surface of an n type semiconductor substrate; and a voltage-resistant region that surrounds the p type diffusion region.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: January 12, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Hiromi Koyama, Takashi Shiigi, Akihiro Fukuchi, Seiji Momota, Toshiyuki Matsui
  • Publication number: 20150378376
    Abstract: A semiconductor device drive method achieves a balance between a lifetime and a detection sensitivity which are required for a temperature detection diode formed via an insulating film on a substrate on which an active element is formed. The semiconductor device drive method includes energizing the temperature detection diode with a constant current, the constant current having a current density value between an upper limit defined based on the lifetime of the temperature detection diode, and a lower defined based on a variation allowable voltage of an output voltage of the temperature detection diode with respect to a standard deviation.
    Type: Application
    Filed: September 4, 2015
    Publication date: December 31, 2015
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Toshiyuki MATSUI, Hitoshi ABE, Noriaki YAO
  • Patent number: 9113562
    Abstract: A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming an electrolytic plated film on the portion of the electroless plated film exposed through the opening, removing the plating resist using a resist-removing solution containing an amine, reducing a thickness of a portion of the electroless plated film existing between adjacent portions of the electrolytic plated film by using the resist-removing solution, and forming a conductive pattern by removing the portion of the electroless plated film existing between the adjacent portions of the electrolytic plated film by using an etchant.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: August 18, 2015
    Assignee: IBIDEN CO., LTD.
    Inventors: Hideo Mizutani, Toshiyuki Matsui, Atsushi Deguchi
  • Patent number: 8965251
    Abstract: A powder container includes a container body for storing powder, the container body having an introduction port from which the powder is introduced; a transport member having one end provided, in a rotatable manner, on a side wall of the container body, at a position below the introduction port, and the other end serving as a free end that is displaced upward as the amount of powder recovered in the container body increases, the transport member transporting the powder from the one end to the other end by being rotated; and guide portions provided on the container body to guide the transport member in directions intersecting a direction in which the other end of the transport member is displaced as the transport member is displaced upward.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: February 24, 2015
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Taro Mitsui, Akihiro Ouchi, Koichi Sato, Yusuke Sakai, Hirohisa Hoshino, Toshiyuki Matsui
  • Publication number: 20140133890
    Abstract: A powder container includes a container body for storing powder, the container body having an introduction port from which the powder is introduced; a transport member having one end provided, in a rotatable manner, on a side wall of the container body, at a position below the introduction port, and the other end serving as a free end that is displaced upward as the amount of powder recovered in the container body increases, the transport member transporting the powder from the one end to the other end by being rotated; and guide portions provided on the container body to guide the transport member in directions intersecting a direction in which the other end of the transport member is displaced as the transport member is displaced upward.
    Type: Application
    Filed: May 14, 2013
    Publication date: May 15, 2014
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Taro MITSUI, Akihiro OUCHI, Koichi SATO, Yusuke SAKAI, Hirohisa HOSHINO, Toshiyuki MATSUI
  • Patent number: 8608394
    Abstract: An image-forming apparatus includes: a plural image-holding members, each image-holding member holding an image and being rotatable around a rotation shaft; a frame member that at least partially defines a space for accommodating the plural image-holding members therein; a cover provided to the frame member to open and close the space with respect to an outside, an inner side of the cover being formed with rotation shaft insertion holes each for receiving an end portion of the rotation shaft of a corresponding one of the image-holding members accommodated in the space; a supporting shaft that supports the cover such that the cover is pivotable with respect to the frame member, the supporting shaft being inserted into a supporting shaft insertion hole provided to the frame member or to the cover, the supporting shaft insertion hole being elongated in a direction having a vertical component when the cover closes the space; and a positioning mechanism that positions the cover with respect to the frame member whe
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: December 17, 2013
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Hiroki Ando, Toshiyuki Matsui, Satoshi Honobe, Tsuneo Fukuzawa, Tomonori Sato, Fumiaki Maekawa, Toshihiro Maruta
  • Publication number: 20130307019
    Abstract: A semiconductor device is disclosed. The semiconductor device is capable of obtaining a high reverse recovery resistant amount by allowing sheet resistance of a peripheral portion in a p type diffusion region that is in contact with a metal electrode through an insulating film on a surface to be as high as possible and reducing an increase in cost if possible. The semiconductor device includes: a p type diffusion region that is disposed in a surface layer of the one main surface of an n type semiconductor substrate; and a voltage-resistant region that surrounds the p type diffusion region.
    Type: Application
    Filed: May 16, 2013
    Publication date: November 21, 2013
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Hiromi KOYAMA, Takashi SHIIGI, Akihiro FUKUCHI, Seiji MOMOTA, Toshiyuki MATSUI
  • Patent number: 8554109
    Abstract: An image forming apparatus including plural image forming units each having an image-carrier includes: a cylindrical image-carrier body holding an image; a rotary shaft inserted in the image-carrier body, and rotatably supporting the image-carrier body; a coupling member fitted to an end portion of the rotary shaft, transmitting a rotational-drive-force to the rotary shaft; an engaging member projecting from a circumferential surface of the rotary shaft, being engaged to an engaged portion formed in the image-carrier body to disable relative rotation of the image-carrier body to the rotary shaft; and an attaching member continuously inserted into a first through hole formed in the coupling member and a second through hole formed in the rotary shaft and fixed thereto such that an angle formed between the engaging member and the attaching member is substantially 90 degrees as seen in an rotary shaft axial-direction, attaching the coupling member and the rotary shaft.
    Type: Grant
    Filed: December 6, 2010
    Date of Patent: October 8, 2013
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Tsuneo Fukuzawa, Hiroki Ando, Satoshi Honobe, Toshiyuki Matsui
  • Patent number: 8509671
    Abstract: A cleaner includes a cleaning member having a distal end in contact with an image carrier so as to remove developer attached to the image carrier, a cleaning container that stores the removed developer, a cleaning support body including a cleaning support portion extending from the distal end to a proximal end of the cleaning member so as to support the proximal end of the cleaning member, a bent portion bent from the cleaning support portion, and a supported portion supported by the cleaning container, a vibration-damping body in contact with an end of the bent portion opposite the cleaning support portion so as to regulate vibration of the cleaning support body, and a vibration-damping-body fixing member supported by the cleaning container and having a clamp portion that clamps the vibration-damping body between the vibration-damping-body fixing member and the end of the bent portion.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: August 13, 2013
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Akiko Kimura, Tomoya Ichikawa, Yuzo Ichikawa, Takahiro Shinkawa, Hirohisa Hoshino, Toshiyuki Matsui