Abstract: A high frequency module includes an insulating substrate, an upper layer plated pattern (a signal line) formed on a main surface of the insulating substrate and electrically connected to a high frequency circuit to transmit a high frequency signal, a mounted part (an electronic component) mounted on the main surface of the insulating substrate and connected to the upper layer plated pattern, a metal heat sink plate (a heat sink plate) on a back surface of the insulating substrate, and a hole pattern (a heat transfer member) provided in a portion of the insulating substrate under the upper layer plated pattern. The hole pattern is formed in a hole having one end inside the insulating substrate.