Abstract: Provided are an excellently convenient ultraviolet-curable organopolysiloxane causing no surface curing inhibition even when cured in the atmosphere; a composition containing such organopolysiloxane; and a cured product of such composition. The organopolysiloxane is represented by the following formula (1): wherein each R1 independently represents a monovalent hydrocarbon group having 1 to 10 carbon atoms or a group represented by the following formula (2), each molecule has at least one group represented by the following formula (2), m is a number satisfying 1?m?10,000, wherein R2 represents a group having at least one of an acryloyl group, methacryloyl group, acryloyloxyalkyl group or methacryloyloxyalkyl group, R3 represents a divalent hydrocarbon group having 1 to 20 carbon atoms.

Abstract: Provided are a low-viscosity ultraviolet curable silicone composition capable of being used even in a surface exposure method and a lift-up method etc.; and a cured product superior in tensile strength and elongation at break.

Abstract: (A) an organopolysiloxane having, per molecule, two groups each represented by formula (1) (R1 represents a C1-20 monovalent hydrocarbon group, R2 represents an oxygen atom or the like, R3 represents an acryloyloxyalkyl group or the like, and p and a respectively represent numbers satisfying 0-10 and 1-3); (B) a monofunctional (meth)acrylate compound not including a siloxane structure; (C) an organopolysiloxane resin which comprises a unit (a) represented by formula (2) (R1, R2, R3, a, and p are identical to those described above), a R43SiO1/2 unit (b) (in the formula, R4 represents a monovalent hydrocarbon group having 1-10 carbon atoms), and a SiO4/2 unit (c), and in which the mole ratio of the total of units (a) and (b) to unit (c) is in a range of 0.4 to 1.2:1; and (D) a photoinitiator.

Abstract: Provided is an oxygen-curable silicone composition that cures at room temperature, the reaction being triggered by oxygen in the atmosphere, without requiring heat or UV irradiation at the time of use, and exhibits good mechanical strength after curing. A composition including (A) an organopolysiloxane (1) (R1 represents an alkyl group or the like but has at least one acryloyloxy group or the like in the molecule, R2 represents an oxygen atom or the like, and m and n represent numbers that satisfy 1?m+n?1,000.), (B) a silicone resin including (a) a unit of formula (2), (b) an R13SiO1/2 unit, and (c) an SiO4/2 unit, the molar ratio of [(a)+(b)]/(c) being 0.4-1.2, and the silicone resin having 0.005 mol/100 g or more Si—OH groups (R1 and R2 are the same as above. R3 represents an acryloyloxyalkyl group or the like, p represents 0-10, and 1 represents a number that satisfies 1-3.), and (C) an organoborane complex (3) (R4-R6 represent hydrocarbon groups.).

Abstract: An ultraviolet ray-curable silicone adhesive agent composition comprising (A) a polysiloxane represented by formula (1): (R1SiO3/2)a1(R13SiO1/2)b1(X1O1/2)c1 (wherein R1 represents a monovalent hydrocarbon group wherein a methyl group accounts for 20 mol % or more and an alkenyl group accounts for 0.1 to 50 mol %; X1 represents a hydrogen atom or the like; a1 represents 0.1 to 1; b1 represents 0 to 0.75; and c1 represents 0 to 0.1; and the requirement represented by the formula: a1+b1+c1=1 is satisfied), (B) a polysiloxane represented by formula (2): (R23SiO1/2)a2(R22SiO)b2 (wherein R2 represents a monovalent hydrocarbon group wherein a methyl group accounts for 20 mol % or more and an alkenyl group accounts for 0.01 to 25 mol %; a2 represents 0.001 to 0.67; b2 represents 0.33 to 0.

Abstract: Provided are a low-viscosity ultraviolet curable silicone composition capable of being used even in a surface exposure method and a lift-up method etc.; and a cured product superior in tensile strength and elongation at break.

Abstract: To provide an adhesive capable of realizing adhesion excellent in shear strength and impact resistance, a polysiloxane composition usable as a component contained in the adhesive, and respective methods for producing the adhesive and the polysiloxane composition. The polysiloxane composition is a copolymer of an adhesive monomer unit A including an organosiloxane unit containing a substituent RA2 containing a catechol group, and a flexible monomer unit B including an organosiloxane unit containing no catechol group.

Abstract: Provided are a low-viscosity ultraviolet curable silicone composition capable of being used even in a surface exposure method and a lift-up method etc.; and a cured product superior in tensile strength and elongation at break.

Abstract: Provided is an oxygen-curable silicone composition that cures at room temperature, the reaction being triggered by oxygen in the atmosphere, without requiring heat or UV irradiation at the time of use, and exhibits good mechanical strength after curing. A composition including (A) an organopolysiloxane (1) (R1 represents an alkyl group or the like but has at least one acryloyloxy group or the like in the molecule, R2 represents an oxygen atom or the like, and m and n represent numbers that satisfy 1?m+n 1,000.), (B) a silicone resin including (a) a unit of formula (2), (b) an R13SiO1/2 unit, and (c) an SiO4/2 unit, the molar ratio of [(a)+(b)]/(c) being 0.4-1.2, and the silicone resin having 0.005 mol/100 g or more Si-OH groups (R1 and R2 are the same as above. R3 represents an acryloyloxyalkyl group or the like, p represents 0-10, and 1 represents a number that satisfies 1-3.), and (C) an organoborane complex (3) (R4-R6 represent hydrocarbon groups.).

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A microstructure-transfer stamp component including a substrate and a silicone-based rubber film formed on the substrate, wherein a surface of the silicone-based rubber film facing away from the substrate has one or more recesses each being closed except for a surface opening. This provides a microstructure-transfer stamp component that can optimize temporary adhesive strength of the surface of the silicone-based rubber film stamp in a short period of time.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: An addition-curing silicone pressure-sensitive adhesive composition which contains no noncrosslinking organopolysiloxane resin and comprises 100 parts by mass of (A) an organopolysiloxane having, in the molecule, at least two alkenyl groups which combine with silicon atoms and having a 25° C. viscosity of 0.01-1,000 Pa·s, 5-500 parts by mass of (B) an organopolysiloxane resin having an alkenyl group, (C) an organohydrogenpolysiloxane having, in the molecule, two or more silicon-atom-bonded hydrogen atoms, the amount of (C) being such that the amount of the silicon-atom-bonded hydrogen atoms contained in the (C) component is 0.1-5.0 times by mole the total amount of all the silicon-atom-bonded alkenyl groups contained in the composition, and (D) a catalyst based on a platinum-group metal. The addition-curing silicone pressure-sensitive adhesive composition has excellent tackiness as a temporary fixer and gives cured objects with very little component migration.

Abstract: Provided is an ultraviolet curable silicone composition capable of being ejected via inkjet ejection. The ultraviolet curable silicone composition contains: (A) a one-end polymerizable organopolysiloxane represented by the following formula (1) wherein each of R1, R2, R3, R4 and R5 independently represents a linear or branched alkyl group having 1 to 20 carbon atoms, or an aryl-containing group having 6 to 10 carbon atoms; R6 represents a divalent organic group having 2 to 20 carbon atoms; R7 represents an alkylene group having 2 to 20 carbon atoms; R8 represents a hydrogen atom or a methyl group; n is a number of 1 to 500; X represents an alkylene group having 2 to 20 carbon atoms; Y represents —OCH2CH2—, —OCH(CH3)CH2— or —OCH2CH(CH3)—; p is a number of not smaller than 1; Z is —O— or —NH—; and (B) a photopolymerization initiator.

Abstract: A photocurable silicone composition, containing: (A) an organopolysiloxane having at least one specific structure having a (meth)acryl group in the molecule; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to a silicon atom in one molecule; (C) a photo-radical polymerization initiator; and (D) a platinum-group metal catalyst to be activated by light having a wavelength of 200 to 500 nm. The photocurable silicone composition has good storability, and good surface curability and deep-part curability in the air; an adhesive consisting of this photocurable silicone composition; and a cured material of this photocurable silicone composition.

Abstract: A curable composition which comprises (A) an organopolysiloxane represented by formula (1) (wherein R1 represents an alkyl group, R2 represents an alkyl or aryl group, R3 represents a hydrogen atom or methyl group, Me represents a methyl group, m is an integer of 1-10, and a and b are integers of 1 or larger, a+b being an integer of 3-120), (B) a photopolymerization initiator, and (C) a hydrosilylation catalyst and which has a surface tension at 23° C. of 23-30 mN/m and a viscosity at 23° C. of 5-80 mPa·s.

Abstract: A thermally conductive silicone potting composition that comprises, each in a preset amount, (A) an organopolysiloxane having at least two alkenyl groups per molecule and having a viscosity of 0.01-100 Pa·s at 25° C., (B) an organopolysiloxane one end of which is blocked with an alkoxysilyl group, etc., (C) a crystalline silica having an average particle size of 0.1 ?m or more and less than 5 ?m, (D) a crystalline silica having an average particle size of 5 ?m or more and less than 100 ?m, (E) an organohydrogen siloxane having at least two SiH groups per molecule, and (F) a hydrosilylation reaction catalyst, wherein the mass ratio of (C)/(D) is from 3/1 to 1/10.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate [30], and forming a plurality of die sized semiconductor structures [32] on the substrate [30]. The method also includes the steps of providing a receiving plate [42] having an elastomeric polymer layer [44], placing the substrate [30] and the receiving plate [42] in close proximity with a gap [101] therebetween, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate [30] to the semiconductor layer [50] at an interface with the substrate [30] to lift off the semiconductor structures [32] through the gap [101] onto the elastomeric polymer layer [44]. During the laser lift-off (LLO) process the elastomeric polymer layer [44] functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures [32] in place on the receiving plate [42].