Patents by Inventor Toshiyuki Takada

Toshiyuki Takada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210373159
    Abstract: A ToF distance sensor comprises a light-emitting element configured to emit pulsed light; a first light collector configured to collect the pulsed light emitted from the light-emitting element; a light-receiving element; and a cover provided with a first region configured to output the pulsed light collected by the first light collector to an outside, and a second region configured to cause the pulsed light reflected by a target measurement object to be incident toward the light-receiving element, wherein the first region is a scattering region configured to scatter the pulsed light.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 2, 2021
    Inventors: Norikazu OKADA, KOUJI IWAMORI, TOSHIYUKI TAKADA
  • Patent number: 11092465
    Abstract: An optical encoder includes first, second, and third light receiving elements (A, B, C) that are sequentially disposed and adjacent to each other; and a detection signal generation unit (50) that outputs a detection trigger (Ts) when an output level of the second light receiving element (B) that receives incident light after the first light receiving element (A) is higher than an output level of the first light receiving element A, and outputs a non-detection trigger (Te) when an output level of the third light receiving element (C) that receives incident light after the second light receiving element (B) is higher than the output level of the second light receiving element (B).
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: August 17, 2021
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Norikazu Okada, Masaki Tsuji, Toshiyuki Takada, Katsunori Satoh, Takashi Takaoka
  • Publication number: 20210217795
    Abstract: An image capturing device unit capable of reducing noise generated in image signals due to power supply. A pixel portion of an image capturing device has pixels arranged in a matrix in first and second directions perpendicular to each other. Output lines are arranged in parallel to the second direction, for reading out pixel signals in the second direction for each of groups of pixels arranged in the first direction. A power supply wiring is arranged on a substrate surface different from a surface on which the image capturing device is mounted and supplies power to the device, and includes a draw-out wiring portion arranged to be routed along the second direction in a pixel portion area which overlaps the pixel portion when the device is projected onto the substrate in a third direction perpendicular to the first and the second directions.
    Type: Application
    Filed: January 7, 2021
    Publication date: July 15, 2021
    Inventors: Toshiyuki TAKADA, Naoyuki NAKAGAWARA, Yui TADA
  • Patent number: 10541760
    Abstract: A radio communication apparatus configured to perform frequency conversion on a first transmission signal modulated at a frequency in a specific frequency band into a second transmission signal having a frequency in a transmission frequency band, in which the apparatus includes: a circuit configured to generate a first calibration signal having a frequency higher than a highest frequency in the specific frequency band, and a second calibration signal having a frequency lower than a lowest frequency of the specific frequency band; a circuit configured to add the first and second calibration signals to the first transmission signal; a circuit configured to estimate a phase at a center frequency in the specific frequency band of the first transmission signal, and output a phase correction coefficient corresponding to the estimated phase; and a circuit configured to correct the phase of the first transmission signal, based on the phase correction coefficient.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: January 21, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Akihiko Komatsuzaki, Shinichiro Kobayashi, Ryo Koizumi, Toshiyuki Takada, Yumihiko Annaka, Hiroshi Yasui
  • Patent number: 10359310
    Abstract: A directional characteristic of light that is incident on a light-receiving unit is adjusted in accordance with whether a proximity-illumination sensor is caused to act as a proximity sensor or to act as an illumination sensor. The proximity-illumination sensor (50) includes a light-receiving area selection unit (101) that selects light-receiving sensitivity of which of a first light-receiving area and a second light-receiving area is made higher in accordance with whether the proximity-illumination sensor (50) is caused to act as the proximity sensor or to act as the illumination sensor.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: July 23, 2019
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Takahiro Inoue, Toshiyuki Takada
  • Publication number: 20190199454
    Abstract: A radio communication apparatus configured to perform frequency conversion on a first transmission signal modulated at a frequency in a specific frequency band into a second transmission signal having a frequency in a transmission frequency band, in which the apparatus includes: a circuit configured to generate a first calibration signal having a frequency higher than a highest frequency in the specific frequency band, and a second calibration signal having a frequency lower than a lowest frequency of the specific frequency band; a circuit configured to add the first and second calibration signals to the first transmission signal; a circuit configured to estimate a phase at a center frequency in the specific frequency band of the first transmission signal, and output a phase correction coefficient corresponding to the estimated phase; and a circuit configured to correct the phase of the first transmission signal, based on the phase correction coefficient.
    Type: Application
    Filed: November 30, 2018
    Publication date: June 27, 2019
    Applicant: FUJITSU LIMITED
    Inventors: Akihiko Komatsuzaki, Shinichiro Kobayashi, Ryo KOIZUMI, Toshiyuki Takada, Yumihiko ANNAKA, HIROSHI YASUI
  • Publication number: 20180073920
    Abstract: A directional characteristic of light that is incident on a light-receiving unit is adjusted in accordance with whether a proximity-illumination sensor is caused to act as a proximity sensor or to act as an illumination sensor. The proximity-illumination sensor (50) includes a light-receiving area selection unit (101) that selects light-receiving sensitivity of which of a first light-receiving area and a second light-receiving area is made higher in accordance with whether the proximity-illumination sensor (50) is caused to act as the proximity sensor or to act as the illumination sensor.
    Type: Application
    Filed: April 12, 2016
    Publication date: March 15, 2018
    Inventors: TAKAHIRO INOUE, TOSHIYUKI TAKADA
  • Patent number: 9915995
    Abstract: An image capturing apparatus comprises: an image capturing unit configured to generate image data; an adding unit configured to add additional information every predetermined amount of pixel data in the image data; a transmission unit configured to transmit image data by the amount of pixel data to which the additional information is added; an image processing unit configured to perform image processing on the image data; and a power control unit configured to control power supply when the transmission unit transmits the pixel data, based on the additional information, wherein the power control unit restricts the power supply to less than a predetermined power amount in a case where the additional information indicates a predetermined state, and performs power supply at the predetermined power amount in a case where the additional information does not indicate the predetermined state.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: March 13, 2018
    Assignee: Canon Kabushiki Kaisha
    Inventor: Toshiyuki Takada
  • Publication number: 20170199272
    Abstract: An optical reflection sensor includes a light emitting element that irradiates a distance measuring target with light, a light receiving optical system that condenses reflected light from the distance measuring target, a light receiving element that receives light condensed by the light receiving optical system and outputs a photoelectric current signal corresponding to a light receiving position, and a signal processing circuit that obtains light receiving position information on the light receiving element and time-of-flight information of the light, which is a duration from when the light is emitted by the light emitting element to when the light is reflected by the distance measuring target and received by the light receiving element, on the basis of the photoelectric current signal output from the light receiving element.
    Type: Application
    Filed: May 21, 2015
    Publication date: July 13, 2017
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Takashi TAKAOKA, Norikazu OKADA, Toshiyuki TAKADA, Masaki TSUJI, Katsunori SATOH
  • Patent number: 9666776
    Abstract: A semiconductor light emitting device that is excellent in radiating heat and that can be molded into a sealing shape having intended optical characteristics by die molding is provided. The semiconductor light emitting device includes: a lead frame including a plate-like semiconductor light emitting element mounting portion having an LED chip mounted on a main surface, and a plate-like metal wire connecting portion extending over a same plane as the semiconductor light emitting element mounting portion; a metal wire electrically connecting the LED chip and the metal wire connecting portion; a thermosetting resin molded by die molding or dam-sheet molding so as to completely cover the LED chip and the metal wire; and a resin portion provided to surround the lead frame and having the thickness not greater than the thickness of the lead frame.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: May 30, 2017
    Assignee: SHARP KABUSHIKI KAISHA
    Inventor: Toshiyuki Takada
  • Patent number: 9627428
    Abstract: An image sensor includes a first semiconductor chip, a second semiconductor chip and connecting portions configured to connect the first semiconductor chip and the second semiconductor chip. The first semiconductor chip includes a photoelectric conversion portion, a capacitor, a reset transistor, and an amplification transistor. The second semiconductor chip includes a transfer transistor, and a row selecting transistor. The connecting portions connect the photoelectric conversion portion to the transfer transistor, the transfer transistor to the capacitor, and the amplification transistor to the row selecting transistor respectively.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: April 18, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventor: Toshiyuki Takada
  • Publication number: 20170045381
    Abstract: An optical encoder includes first, second, and third light receiving elements (A, B, C) that are sequentially disposed and adjacent to each other; and a detection signal generation unit (50) that outputs a detection trigger (Ts) when an output level of the second light receiving element (B) that receives incident light after the first light receiving element (A) is higher than an output level of the first light receiving element A, and outputs a non-detection trigger (Te) when an output level of the third light receiving element (C) that receives incident light after the second light receiving element (B) is higher than the output level of the second light receiving element (B).
    Type: Application
    Filed: February 20, 2015
    Publication date: February 16, 2017
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Norikazu OKADA, Masaki TSUJI, Toshiyuki TAKADA, Katsunori SATOH, Takashi TAKAOKA
  • Publication number: 20160044238
    Abstract: An image capturing apparatus comprises: an image capturing unit configured to generate image data; an adding unit configured to add additional information every predetermined amount of pixel data in the image data; a transmission unit configured to transmit image data by the amount of pixel data to which the additional information is added; an image processing unit configured to perform image processing on the image data; and a power control unit configured to control power supply when the transmission unit transmits the pixel data, based on the additional information, wherein the power control unit restricts the power supply to less than a predetermined power amount in a case where the additional information indicates a predetermined state, and performs power supply at the predetermined power amount in a case where the additional information does not indicate the predetermined state.
    Type: Application
    Filed: August 6, 2015
    Publication date: February 11, 2016
    Inventor: Toshiyuki Takada
  • Patent number: 9257779
    Abstract: An intermediate connection electrical connector includes a plurality of blades and a supporting member for supporting the blades arranged in an arrangement direction. The supporting member includes a surrounding wall portion for surrounding the blades and a regulating portion for positioning the blades. The surrounding wall portion includes a side wall portion and an edge wall portion. The side wall portion is at least partially formed of an electromagnetic wave absorbing material. The regulating portion is disposed inside the surrounding wall portion to define a blade accommodating space for accommodating the blades.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: February 9, 2016
    Assignee: Hirose Electric Co., Ltd.
    Inventors: Nobuhiro Tamai, Toshiyuki Takada, Kunia Aihara, Jeremy Huang, Masakazu Nagata
  • Patent number: 9224930
    Abstract: A semiconductor light emitting device that is excellent in radiating heat and that can be molded into a sealing shape having intended optical characteristics by die molding is provided. The semiconductor light emitting device includes: a lead frame including a plate-like semiconductor light emitting element mounting portion having an LED chip mounted on a main surface, and a plate-like metal wire connecting portion extending over a same plane as the semiconductor light emitting element mounting portion; a metal wire electrically connecting the LED chip and the metal wire connecting portion; a thermosetting resin molded by die molding or dam-sheet molding so as to completely cover the LED chip and the metal wire; and a resin portion provided to surround the lead frame and having the thickness not greater than the thickness of the lead frame.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: December 29, 2015
    Assignee: SHARP KABUSHIKI KAISHA
    Inventor: Toshiyuki Takada
  • Publication number: 20150236063
    Abstract: An image sensor includes a first semiconductor chip, a second semiconductor chip and connecting portions configured to connect the first semiconductor chip and the second semiconductor chip. The first semiconductor chip includes a photoelectric conversion portion, a capacitor, a reset transistor, and an amplification transistor. The second semiconductor chip includes a transfer transistor, and a row selecting transistor. The connecting portions connect the photoelectric conversion portion to the transfer transistor, the transfer transistor to the capacitor, and the amplification transistor to the row selecting transistor respectively.
    Type: Application
    Filed: February 18, 2015
    Publication date: August 20, 2015
    Inventor: Toshiyuki Takada
  • Publication number: 20150054022
    Abstract: A semiconductor light emitting device that is excellent in radiating heat and that can be molded into a sealing shape having intended optical characteristics by die molding is provided. The semiconductor light emitting device includes: a lead frame including a plate-like semiconductor light emitting element mounting portion having an LED chip mounted on a main surface, and a plate-like metal wire connecting portion extending over a same plane as the semiconductor light emitting element mounting portion; a metal wire electrically connecting the LED chip and the metal wire connecting portion; a thermosetting resin molded by die molding or dam-sheet molding so as to completely cover the LED chip and the metal wire; and a resin portion provided to surround the lead frame and having the thickness not greater than the thickness of the lead frame.
    Type: Application
    Filed: October 14, 2014
    Publication date: February 26, 2015
    Inventor: Toshiyuki TAKADA
  • Publication number: 20140295702
    Abstract: An intermediate connection electrical connector includes a plurality of blades and a supporting member for supporting the blades arranged in an arrangement direction. The supporting member includes a surrounding wall portion for surrounding the blades and a regulating portion for positioning the blades. The surrounding wall portion includes a side wall portion and an edge wall portion. The side wall portion is at least partially formed of an electromagnetic wave absorbing material. The regulating portion is disposed inside the surrounding wall portion to define a blade accommodating space for accommodating the blades.
    Type: Application
    Filed: March 26, 2014
    Publication date: October 2, 2014
    Applicant: Hirose Electric Co., Ltd.
    Inventors: Nobuhiro TAMAI, Toshiyuki TAKADA, Kunia AIHARA, Jeremy HUANG, Masakazu NAGATA
  • Patent number: 8415681
    Abstract: A semiconductor light emitting device that is excellent in radiating heat and that can be molded into a sealing shape having intended optical characteristics by die molding is provided. The semiconductor light emitting device includes: a lead frame including a plate-like semiconductor light emitting element mounting portion having an LED chip mounted on a main surface, and a plate-like metal wire connecting portion extending over a same plane as the semiconductor light emitting element mounting portion; a metal wire electrically connecting the LED chip and the metal wire connecting portion; a thermosetting resin molded by die molding or dam-sheet molding so as to completely cover the LED chip and the metal wire; and a resin portion provided to surround the lead frame and having the thickness not greater than the thickness of the lead frame.
    Type: Grant
    Filed: March 12, 2008
    Date of Patent: April 9, 2013
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Toshiyuki Takada
  • Patent number: 8357013
    Abstract: The present invention involves connectors for reducing Far-End Crosstalk (FEXT) through the use of novel polarity swapping to negate the cumulative effect of FEXT. Skew adjustment is used to improve the FEXT cancellation from polarity swapping. The polarity reversal location or locations among FEXT sources are optimized to achieve maximum FEXT cancellation. The novelty polarity swapping technique can be applied to a wide variety of connectors, such as mezzanine connectors, backplane connectors, and any other connectors that can benefit from FEXT reduction.
    Type: Grant
    Filed: November 5, 2009
    Date of Patent: January 22, 2013
    Assignee: Hirose Electric Co., Ltd.
    Inventors: Tatsuya Arai, Ching-Chao Huang, Clement Kam Lam Luk, Jeremy Buan, Tsutomu Matsuo, Toshiyuki Takada, Masakazu Nagata