Patents by Inventor Toshiyuki Yoshikawa

Toshiyuki Yoshikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190049165
    Abstract: There is provided an ice-making container including a container body having an opening formed in its upper part and being flexible so as to be deformable by being grasped and an inner container configured to be insertable into and removable from the container body through the opening, in which an ice-making area for making ice is formed between an inner peripheral surface of the container body and an outer peripheral surface of the inner container, in the state where the inner container is placed in the container body, and the ice-making area is formed as an area where the ice made in the ice-making area is crushed in response to deformation of the container body being grasped.
    Type: Application
    Filed: June 29, 2017
    Publication date: February 14, 2019
    Applicant: Kabushiki Kaisha Yoshikawakuni Kogyosho
    Inventor: Toshiyuki Yoshikawa
  • Patent number: 10086474
    Abstract: A protective film applying apparatus includes a protective film forming and cleaning unit for forming a protective film on a surface of a wafer and cleaning the protective film away. A coverage state detector detects a coverage state of the protective film, and a controller determines whether or not the protective film has a film thickness falling within a predetermined range. If the controller decides that the thickness of the protective film does not fall in the predetermined range, the controller operates the protective film forming and cleaning unit to clean away the protective film, performs a pretreating process selected depending on the film thickness on the surface, and operates the protective film forming and cleaning unit to form a protective film again on the surface of the wafer.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: October 2, 2018
    Assignee: Disco Corporation
    Inventors: Senichi Ryo, Kenta Nakano, Yukinobu Ohura, Toshiyuki Yoshikawa
  • Publication number: 20170368636
    Abstract: A protective film applying apparatus includes a protective film forming and cleaning unit for forming a protective film on a surface of a wafer and cleaning the protective film away. A coverage state detector detects a coverage state of the protective film, and a controller determines whether or not the protective film has a film thickness falling within a predetermined range. If the controller decides that the thickness of the protective film does not fall in the predetermined range, the controller operates the protective film forming and cleaning unit to clean away the protective film, performs a pretreating process selected depending on the film thickness on the surface, and operates the protective film forming and cleaning unit to form a protective film again on the surface of the wafer.
    Type: Application
    Filed: June 15, 2017
    Publication date: December 28, 2017
    Inventors: Senichi Ryo, Kenta Nakano, Yukinobu Ohura, Toshiyuki Yoshikawa
  • Patent number: 9748119
    Abstract: Disclosed herein is a wafer processing method in which laser processing is carried out on a wafer along streets. The wafer processing method includes a step of holding the wafer by a chuck table, a protective film forming step of forming a water-soluble protective film on a surface of the wafer, a laser beam irradiating step of irradiating the wafer with a laser beam along the streets after the protective film forming step, a step of supplying a chemical having an amino group to the wafer, and a removing step of cleaning and removing a compound that is generated by the supplying of the chemical having an amino group and contains phosphorus.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: August 29, 2017
    Assignee: Disco Corporation
    Inventors: Senichi Ryo, Hirokazu Matsumoto, Toshiyuki Yoshikawa, Yukinobu Ohura
  • Patent number: 9685378
    Abstract: Disclosed herein is a method of dividing rectangular plate-shaped workpieces into individual device chips including a detecting step wherein an annular frame to which a plurality of rectangular plate-shaped workpieces are stuck is held on a chuck table and the positions and angles of the projected dicing lines on each of the plate-shaped workpieces are detected, and a dividing step wherein a laser beam having a wavelength which is absorbable by the plate-shaped workpieces is applied from a laser beam applying unit to the plate-shaped workpieces while the chuck table and the laser beam applying unit are being relatively processing-fed and finely adjusted for each of the plate-shaped workpieces on the basis of the positions and angles detected in the detecting step, thereby dividing the plate-shaped workpieces into a plurality of device chips along the projected dicing lines.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: June 20, 2017
    Assignee: Disco Corporation
    Inventors: Toshiyuki Yoshikawa, Takashi Sampei
  • Patent number: 9620355
    Abstract: A wafer processing method includes a wafer holding step of holding a wafer having devices formed on the front side, a protective film forming step of forming a water-soluble protective film on the front side of the wafer, a laser beam applying step of applying a laser beam to the wafer along streets, a cleaning step of cleaning the wafer to then remove the protective film, and a foreign matter removing step of removing foreign matter from the wafer when a predetermined period of time has elapsed after cleaning. This period of time is set as a period of time until a phosphorus containing reaction product produced at a laser processed portion is evaporated to react with water in the air, thereby producing the foreign matter containing phosphorus on bumps formed on each device.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: April 11, 2017
    Assignee: Disco Corporation
    Inventors: Senichi Ryo, Hirokazu Matsumoto, Toshiyuki Yoshikawa, Yukinobu Ohura
  • Publication number: 20170076985
    Abstract: Disclosed herein is a method of dividing rectangular plate-shaped workpieces into individual device chips including a detecting step wherein an annular frame to which a plurality of rectangular plate-shaped workpieces are stuck is held on a chuck table and the positions and angles of the projected dicing lines on each of the plate-shaped workpieces are detected, and a dividing step wherein a laser beam having a wavelength which is absorbable by the plate-shaped workpieces is applied from a laser beam applying unit to the plate-shaped workpieces while the chuck table and the laser beam applying unit are being relatively processing-fed and finely adjusted for each of the plate-shaped workpieces on the basis of the positions and angles detected in the detecting step, thereby dividing the plate-shaped workpieces into a plurality of device chips along the projected dicing lines.
    Type: Application
    Filed: September 13, 2016
    Publication date: March 16, 2017
    Inventors: Toshiyuki Yoshikawa, Takashi Sampei
  • Publication number: 20170032985
    Abstract: Disclosed herein is a wafer processing method in which laser processing is carried out on a wafer along streets. The wafer processing method includes a step of holding the wafer by a chuck table, a protective film forming step of forming a water-soluble protective film on a surface of the wafer, a laser beam irradiating step of irradiating the wafer with a laser beam along the streets after the protective film forming step, a step of supplying a chemical having an amino group to the wafer, and a removing step of cleaning and removing a compound that is generated by the supplying of the chemical having an amino group and contains phosphorus.
    Type: Application
    Filed: July 26, 2016
    Publication date: February 2, 2017
    Inventors: Senichi Ryo, Hirokazu Matsumoto, Toshiyuki Yoshikawa, Yukinobu Ohura
  • Publication number: 20170025269
    Abstract: A wafer processing method includes a wafer holding step of holding a wafer having devices formed on the front side, a protective film forming step of forming a water-soluble protective film on the front side of the wafer, a laser beam applying step of applying a laser beam to the wafer along streets, a cleaning step of cleaning the wafer to then remove the protective film, and a foreign matter removing step of removing foreign matter from the wafer when a predetermined period of time has elapsed after cleaning. This period of time is set as a period of time until a phosphorus containing reaction product produced at a laser processed portion is evaporated to react with water in the air, thereby producing the foreign matter containing phosphorus on bumps formed on each device.
    Type: Application
    Filed: July 20, 2016
    Publication date: January 26, 2017
    Inventors: Senichi Ryo, Hirokazu Matsumoto, Toshiyuki Yoshikawa, Yukinobu Ohura
  • Patent number: 9376252
    Abstract: A boot housing device includes: a body having an upper end and a lower end, the body including two leg parts arranged with a specific gap therebetween on its lower end side so as to allow a toe of a boot to be arranged in the gap; and an elevating member including a support pole supported by the body and a shoe receiving part that is attached to an upper end of the support pole and is arranged above the body, the elevating member being provided movably in an axial direction of the support pole.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: June 28, 2016
    Assignee: Kabushiki Kaisha Yoshikawakuni Kogyosho
    Inventor: Toshiyuki Yoshikawa
  • Patent number: 9351934
    Abstract: The present invention relates to a crosslinked gelatin support, in which a surface of a crosslinked gelatin is negatively charged and has a zeta potential in ethanol of from ?3 to ?50 mV, and a support for controlled release of a physiologically active substance, including: the crosslinked gelatin support; and a physiologically active substance adsorbed and retained on and/or inside the crosslinked gelatin support.
    Type: Grant
    Filed: April 18, 2014
    Date of Patent: May 31, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shinji Sugawara, Chieko Miura, Tomoko Sudo, Masao Nakagawa, Toshiyuki Yoshikawa
  • Patent number: 9320354
    Abstract: The invention provides a shoe storage apparatus capable of saving space when stored, wherein a shoe storage apparatus includes a leg to be disposed on an installation surface, and an upper panel which has a base end portion to be supported by the leg and a tip end portion on the side opposite to the base end portion, and is disposed at a distance from the installation surface in a state where the base end portion is supported by the leg, and on which one shoe of a pair of shoes can be placed, and the upper panel is constituted to be detachable from the leg.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: April 26, 2016
    Assignee: KABUSHIKI KAISHA YOSHIKAWAKUNI KOGYOSHO
    Inventor: Toshiyuki Yoshikawa
  • Publication number: 20150289645
    Abstract: The invention provides a shoe storage apparatus capable of saving space when stored, wherein a shoe storage apparatus includes a leg to be disposed on an installation surface, and an upper panel which has a base end portion to be supported by the leg and a tip end portion on the side opposite to the base end portion, and is disposed at a distance from the installation surface in a state where the base end portion is supported by the leg, and on which one shoe of a pair of shoes can be placed, and the upper panel is constituted to be detachable from the leg.
    Type: Application
    Filed: December 10, 2014
    Publication date: October 15, 2015
    Inventor: Toshiyuki Yoshikawa
  • Publication number: 20150259133
    Abstract: A boot housing device includes: a body having an upper end and a lower end, the body including two leg parts arranged with a specific gap therebetween on its lower end side so as to allow a toe of a boot to be arranged in the gap; and an elevating member including a support pole supported by the body and a shoe receiving part that is attached to an upper end of the support pole and is arranged above the body, the elevating member being provided movably in an axial direction of the support pole.
    Type: Application
    Filed: November 19, 2014
    Publication date: September 17, 2015
    Applicant: Kabushiki Kaisha Yoshikawakuni Kogyosho
    Inventor: Toshiyuki Yoshikawa
  • Patent number: 9090783
    Abstract: A protective film agent for laser dicing according to the present invention comprises a solution having, dissolved therein, a water-soluble resin and at least one laser light absorber selected from the group consisting of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorber. The protective film agent is coated on a surface of a wafer, which is to be processed, and is then dried to form a protective film. Laser dicing through the protective film produces chips from the wafer. As a result, deposition of debris can be effectively prevented on the entire face of the chips, including their peripheral edge portions.
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: July 28, 2015
    Assignees: TOKYO OHKA KOGYO CO., LTD., DISCO CORPORATION
    Inventors: Hiroshi Takanashi, Atsushi Kawakami, Toshiyuki Yoshikawa, Nobuyasu Kitahara
  • Patent number: D747768
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: January 19, 2016
    Assignee: KABUSHIKI KAISHA YOSHIKAWAKUNI KOGYOSHO
    Inventor: Toshiyuki Yoshikawa
  • Patent number: D754961
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: May 3, 2016
    Assignee: Yoshikawakuni Plastics Co., Ltd.
    Inventor: Toshiyuki Yoshikawa
  • Patent number: D755497
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: May 10, 2016
    Assignee: Yoshikawakuni Plastics Co., Ltd.
    Inventor: Toshiyuki Yoshikawa
  • Patent number: D773864
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: December 13, 2016
    Assignee: KABUSHIKI KAISHA YOSHIKAWAKUNI KOGYOSHO
    Inventor: Toshiyuki Yoshikawa
  • Patent number: D781932
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: March 21, 2017
    Assignee: KABUSHIKI KAISHA YOSHIKAWAKUNI KOGYOSHO
    Inventor: Toshiyuki Yoshikawa