Patents by Inventor Toshiyuki Yoshikawa

Toshiyuki Yoshikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230001974
    Abstract: Provided is a carrier including a handle and a load-carrying platform, which enables construction of a multi-tier assembly. A carrier includes caster mounting portions formed on a lower surface of a load-carrying platform, a handle that extends outward from a first side edge portion of the load-carrying platform and has an upper surface with an engaged portion being one of a recess and a through hole, and an engaging portion that projects downward from a lower surface of a second side edge portion opposed to the first side edge portion and is engageable with the engaged portion. Connection of a plurality of carriers achieves an integral and flat placement surface composed of placement surfaces, each being the upper surface of the load-carrying platform of the carrier.
    Type: Application
    Filed: November 5, 2021
    Publication date: January 5, 2023
    Inventor: Toshiyuki Yoshikawa
  • Patent number: 11535755
    Abstract: There is provided a technique for producing a quinacridone solid solution pigment, the technique making it possible to obtain a quinacridone solid solution pigment which produces a colored product having high chroma and a bluish hue, more preferably which has controlled particle diameters.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: December 27, 2022
    Assignee: Dainichiseika Color & Chemicals Mfg. Co.. Ltd.
    Inventors: Naoto Kamata, Toshiyuki Hitotsuyanagi, Sachio Yoshikawa, Satoshi Minami
  • Publication number: 20220392805
    Abstract: A protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a light absorbent. The solution has an absorbance, i.e., an absorbance converted for a solution diluted 200 times, equal to 0.05 or more per an optical path length of 1 cm at a wavelength of 532 nm. Alternatively, the protective film substance for laser processing includes a solution including a water-soluble resin, an organic solvent, and a polyhydroxyanthraquinone derivative.
    Type: Application
    Filed: May 2, 2022
    Publication date: December 8, 2022
    Inventors: Senichi RYO, Yuki IKEDA, Yukinobu OHURA, Toshiyuki YOSHIKAWA
  • Publication number: 20220275214
    Abstract: There is provided a technique for producing a quinacridone solid solution pigment, the technique making it possible to obtain a quinacridone solid solution pigment which produces a colored product having high chroma and a bluish hue, more preferably which has controlled particle diameters.
    Type: Application
    Filed: May 16, 2022
    Publication date: September 1, 2022
    Inventors: Naoto KAMATA, Toshiyuki HITOTSUYANAGI, Sachio YOSHIKAWA, Satoshi MINAMI
  • Publication number: 20220270910
    Abstract: A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the annular frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to the back surface of the wafer, a frame unit carrying-out unit, and a reinforcing part removing unit that cuts and removes a ring-shaped reinforcing part from the wafer of a frame unit.
    Type: Application
    Filed: February 15, 2022
    Publication date: August 25, 2022
    Inventors: Yoshinori KAKINUMA, Yoshinobu SAITO, Yukiyasu MASUDA, Toshiyuki YOSHIKAWA, Toshio TSUCHIYA, Masanobu TAKENAKA, Tomoyuki HONGO
  • Publication number: 20220258474
    Abstract: An ejection apparatus includes an ejection head having an ejection port surface and configured to eject a liquid to a recording medium for recording, a wiper configured to wipe the surface, and a moving unit configured to relatively move the wiper and the head to move the wiper in a first direction along the surface with respect to the head. The apparatus performs a first mode for performing the wiping while relatively moving the wiper and the head at a first speed, and a second mode for performing the wiping while relatively moving the wiper and the head at a second speed higher than the first speed. When the apparatus performs the wiping after the recording and then performs subsequent recording, the apparatus performs the second mode. When the apparatus performs the wiping after the recording and then performs no subsequent recording, the apparatus performs the first mode.
    Type: Application
    Filed: January 28, 2022
    Publication date: August 18, 2022
    Inventors: Hirokazu Yoshikawa, Toshiyuki Chikuma, Kei Kosaka
  • Publication number: 20220250387
    Abstract: An ejection apparatus includes an ejection head, and a recessed portion, a wiper, an installation unit, and a moving unit configured to move the blade and the ejection head relative to each other, wherein the wiper performs a wiping operation for wiping the ejection head to wipe the ejection port after wiping the recessed portion, and wherein in the wiping operation, a first wiping operation is performed in a state where the ejection port surface and the installation unit on which the wiper is installed are at a first distance in a direction perpendicular to the ejection port surface, and a second wiping operation is performed in a state where the ejection port surface and the installation unit on which the wiper is installed are at a second distance in the direction perpendicular to the ejection port surface, the second distance being larger than the first distance.
    Type: Application
    Filed: January 27, 2022
    Publication date: August 11, 2022
    Inventors: Kei Kosaka, Hirokazu Yoshikawa, Toshiyuki Chikuma
  • Publication number: 20220108882
    Abstract: A processing method of a workpiece with a circular disc shape includes sticking a tape to one surface of the workpiece and integrating the workpiece and a frame through the tape, holding the workpiece by a holding unit with the interposition of the tape, and irradiating the other surface of the workpiece located on the opposite side to the one surface with a pulsed laser beam having such a wavelength as to be absorbed by the workpiece from the side of the other surface. In irradiating the laser beam, the other surface is annularly irradiated with the laser beam in the state in which the orientation of the laser beam is adjusted in such a manner that the laser beam has an angle of incidence formed due to inclination with respect to a normal to the other surface of the workpiece by a predetermined angle.
    Type: Application
    Filed: September 16, 2021
    Publication date: April 7, 2022
    Inventors: Toshio TSUCHIYA, Toshiyuki YOSHIKAWA, Tomoyuki HONGO
  • Patent number: 11251083
    Abstract: A method of processing a workpiece includes: a frame unit preparing step of preparing a frame unit including a tape affixed to an undersurface of the workpiece; a protective film forming step of forming a protective film on a top surface of the workpiece; a cutting step of cutting the workpiece by applying a laser beam; an interval expanding step of widening intervals between chips formed in the cutting step by expanding the tape outward in a radial direction; and an etching step of removing altered regions formed in the respective chips.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: February 15, 2022
    Assignee: DISCO CORPORATION
    Inventors: Kenta Nakano, Hideyuki Kawaguchi, Yuki Ikeda, Toshiyuki Yoshikawa, Senichi Ryo
  • Publication number: 20220020614
    Abstract: A processing apparatus includes a wafer conveying-out mechanism; a wafer table; a frame conveying-out mechanism; a frame table; a tape attaching mechanism that attaches a tape to a frame; a tape-attached frame conveying mechanism that conveys the tape-attached frame; a tape pressure bonding mechanism that pressure bonds the tape of the tape-attached frame to a back surface of a wafer; a frame unit conveying-out mechanism that conveys out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure bonded; a reinforcement section removing mechanism that cuts and removes a ring-shaped reinforcement section from the wafer; a ringless unit conveying-out mechanism that conveys out a ringless unit from which the reinforcement section has been removed; and a frame cassette table on which a frame cassette accommodating the ringless unit is to be placed.
    Type: Application
    Filed: July 9, 2021
    Publication date: January 20, 2022
    Inventors: Yukiyasu MASUDA, Yoshikuni MIGIYAMA, Takashi UCHIHO, Ryosuke KUROSAWA, Toshiyuki YOSHIKAWA, Toshio TSUCHIYA, Masanobu TAKENAKA, Tomoyuki HONGO, Takashi MORI, Yoshinori KAKINUMA, Yoshinobu SAITO, Jonghyun RYU
  • Publication number: 20210039197
    Abstract: A processing performance confirmation method for a laser processing apparatus that processes a workpiece with a laser beam of a wavelength having absorption in the workpiece. The method includes a holding step of holding the workpiece by a chuck table of the laser processing apparatus, a processing mark forming step of moving the workpiece and a condensing point of the laser beam relative to each other in a predetermined direction intersecting a thickness direction of the workpiece at right angles while changing the condensing point in height, thereby to form a processing mark on an upper surface of the workpiece, a imaging step of imaging a plurality of regions of the processing mark formed in the processing mark forming step, and a confirmation step of confirming processing performance of the laser processing apparatus based on images acquired in the imaging step.
    Type: Application
    Filed: August 3, 2020
    Publication date: February 11, 2021
    Inventor: Toshiyuki YOSHIKAWA
  • Publication number: 20200185277
    Abstract: A method of processing a workpiece includes: a frame unit preparing step of preparing a frame unit including a tape affixed to an undersurface of the workpiece; a protective film forming step of forming a protective film on a top surface of the workpiece; a cutting step of cutting the workpiece by applying a laser beam; an interval expanding step of widening intervals between chips formed in the cutting step by expanding the tape outward in a radial direction; and an etching step of removing altered regions formed in the respective chips.
    Type: Application
    Filed: December 5, 2019
    Publication date: June 11, 2020
    Inventors: Kenta NAKANO, Hideyuki KAWAGUCHI, Yuki IKEDA, Toshiyuki YOSHIKAWA, Senichi RYO
  • Patent number: 10648720
    Abstract: An ice-making container including a container body having an opening formed in its upper part and being flexible so as to be deformable by being grasped and an inner container configured to be insertable into and removable from the container body through the opening, in which an ice-making area for making ice is formed between an inner peripheral surface of the container body and an outer peripheral surface of the inner container, in the state where the inner container is placed in the container body, and the ice-making area is formed as an area where the ice made in the ice-making area is crushed in response to deformation of the container body being grasped.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: May 12, 2020
    Assignee: Kabushiki Kaisha Yoshikawakuni Kogyosho
    Inventor: Toshiyuki Yoshikawa
  • Publication number: 20190049165
    Abstract: There is provided an ice-making container including a container body having an opening formed in its upper part and being flexible so as to be deformable by being grasped and an inner container configured to be insertable into and removable from the container body through the opening, in which an ice-making area for making ice is formed between an inner peripheral surface of the container body and an outer peripheral surface of the inner container, in the state where the inner container is placed in the container body, and the ice-making area is formed as an area where the ice made in the ice-making area is crushed in response to deformation of the container body being grasped.
    Type: Application
    Filed: June 29, 2017
    Publication date: February 14, 2019
    Applicant: Kabushiki Kaisha Yoshikawakuni Kogyosho
    Inventor: Toshiyuki Yoshikawa
  • Patent number: 10086474
    Abstract: A protective film applying apparatus includes a protective film forming and cleaning unit for forming a protective film on a surface of a wafer and cleaning the protective film away. A coverage state detector detects a coverage state of the protective film, and a controller determines whether or not the protective film has a film thickness falling within a predetermined range. If the controller decides that the thickness of the protective film does not fall in the predetermined range, the controller operates the protective film forming and cleaning unit to clean away the protective film, performs a pretreating process selected depending on the film thickness on the surface, and operates the protective film forming and cleaning unit to form a protective film again on the surface of the wafer.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: October 2, 2018
    Assignee: Disco Corporation
    Inventors: Senichi Ryo, Kenta Nakano, Yukinobu Ohura, Toshiyuki Yoshikawa
  • Patent number: D881684
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: April 21, 2020
    Assignee: KABUSHIKI KAISHA YOSHIKAWAKUNI KOGYOSHO
    Inventor: Toshiyuki Yoshikawa
  • Patent number: D932185
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: October 5, 2021
    Inventor: Toshiyuki Yoshikawa
  • Patent number: D953677
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: May 31, 2022
    Assignee: KABUSHIKI KAISHA YOSHIKAWAKUNI KOGYOSHO
    Inventor: Toshiyuki Yoshikawa
  • Patent number: D960664
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: August 16, 2022
    Assignee: KABUSHIKI KAISHA YOSHIKAWAKUNI KOGYOSHO
    Inventor: Toshiyuki Yoshikawa
  • Patent number: D962719
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: September 6, 2022
    Assignee: Kabushiki Kaisha Yoshikawakuni Kogyosho
    Inventor: Toshiyuki Yoshikawa