Abstract: A protective film applying apparatus includes a protective film forming and cleaning unit for forming a protective film on a surface of a wafer and cleaning the protective film away. A coverage state detector detects a coverage state of the protective film, and a controller determines whether or not the protective film has a film thickness falling within a predetermined range. If the controller decides that the thickness of the protective film does not fall in the predetermined range, the controller operates the protective film forming and cleaning unit to clean away the protective film, performs a pretreating process selected depending on the film thickness on the surface, and operates the protective film forming and cleaning unit to form a protective film again on the surface of the wafer.

Abstract: A protective film applying apparatus includes a protective film forming and cleaning unit for forming a protective film on a surface of a wafer and cleaning the protective film away. A coverage state detector detects a coverage state of the protective film, and a controller determines whether or not the protective film has a film thickness falling within a predetermined range. If the controller decides that the thickness of the protective film does not fall in the predetermined range, the controller operates the protective film forming and cleaning unit to clean away the protective film, performs a pretreating process selected depending on the film thickness on the surface, and operates the protective film forming and cleaning unit to form a protective film again on the surface of the wafer.

Abstract: Disclosed herein is a wafer processing method in which laser processing is carried out on a wafer along streets. The wafer processing method includes a step of holding the wafer by a chuck table, a protective film forming step of forming a water-soluble protective film on a surface of the wafer, a laser beam irradiating step of irradiating the wafer with a laser beam along the streets after the protective film forming step, a step of supplying a chemical having an amino group to the wafer, and a removing step of cleaning and removing a compound that is generated by the supplying of the chemical having an amino group and contains phosphorus.

Abstract: Disclosed herein is a method of dividing rectangular plate-shaped workpieces into individual device chips including a detecting step wherein an annular frame to which a plurality of rectangular plate-shaped workpieces are stuck is held on a chuck table and the positions and angles of the projected dicing lines on each of the plate-shaped workpieces are detected, and a dividing step wherein a laser beam having a wavelength which is absorbable by the plate-shaped workpieces is applied from a laser beam applying unit to the plate-shaped workpieces while the chuck table and the laser beam applying unit are being relatively processing-fed and finely adjusted for each of the plate-shaped workpieces on the basis of the positions and angles detected in the detecting step, thereby dividing the plate-shaped workpieces into a plurality of device chips along the projected dicing lines.

Abstract: A wafer processing method includes a wafer holding step of holding a wafer having devices formed on the front side, a protective film forming step of forming a water-soluble protective film on the front side of the wafer, a laser beam applying step of applying a laser beam to the wafer along streets, a cleaning step of cleaning the wafer to then remove the protective film, and a foreign matter removing step of removing foreign matter from the wafer when a predetermined period of time has elapsed after cleaning. This period of time is set as a period of time until a phosphorus containing reaction product produced at a laser processed portion is evaporated to react with water in the air, thereby producing the foreign matter containing phosphorus on bumps formed on each device.

Abstract: Disclosed herein is a method of dividing rectangular plate-shaped workpieces into individual device chips including a detecting step wherein an annular frame to which a plurality of rectangular plate-shaped workpieces are stuck is held on a chuck table and the positions and angles of the projected dicing lines on each of the plate-shaped workpieces are detected, and a dividing step wherein a laser beam having a wavelength which is absorbable by the plate-shaped workpieces is applied from a laser beam applying unit to the plate-shaped workpieces while the chuck table and the laser beam applying unit are being relatively processing-fed and finely adjusted for each of the plate-shaped workpieces on the basis of the positions and angles detected in the detecting step, thereby dividing the plate-shaped workpieces into a plurality of device chips along the projected dicing lines.

Abstract: Disclosed herein is a wafer processing method in which laser processing is carried out on a wafer along streets. The wafer processing method includes a step of holding the wafer by a chuck table, a protective film forming step of forming a water-soluble protective film on a surface of the wafer, a laser beam irradiating step of irradiating the wafer with a laser beam along the streets after the protective film forming step, a step of supplying a chemical having an amino group to the wafer, and a removing step of cleaning and removing a compound that is generated by the supplying of the chemical having an amino group and contains phosphorus.

Abstract: A wafer processing method includes a wafer holding step of holding a wafer having devices formed on the front side, a protective film forming step of forming a water-soluble protective film on the front side of the wafer, a laser beam applying step of applying a laser beam to the wafer along streets, a cleaning step of cleaning the wafer to then remove the protective film, and a foreign matter removing step of removing foreign matter from the wafer when a predetermined period of time has elapsed after cleaning. This period of time is set as a period of time until a phosphorus containing reaction product produced at a laser processed portion is evaporated to react with water in the air, thereby producing the foreign matter containing phosphorus on bumps formed on each device.

Abstract: A boot housing device includes: a body having an upper end and a lower end, the body including two leg parts arranged with a specific gap therebetween on its lower end side so as to allow a toe of a boot to be arranged in the gap; and an elevating member including a support pole supported by the body and a shoe receiving part that is attached to an upper end of the support pole and is arranged above the body, the elevating member being provided movably in an axial direction of the support pole.

Abstract: The present invention relates to a crosslinked gelatin support, in which a surface of a crosslinked gelatin is negatively charged and has a zeta potential in ethanol of from ?3 to ?50 mV, and a support for controlled release of a physiologically active substance, including: the crosslinked gelatin support; and a physiologically active substance adsorbed and retained on and/or inside the crosslinked gelatin support.

Abstract: The invention provides a shoe storage apparatus capable of saving space when stored, wherein a shoe storage apparatus includes a leg to be disposed on an installation surface, and an upper panel which has a base end portion to be supported by the leg and a tip end portion on the side opposite to the base end portion, and is disposed at a distance from the installation surface in a state where the base end portion is supported by the leg, and on which one shoe of a pair of shoes can be placed, and the upper panel is constituted to be detachable from the leg.

Abstract: The invention provides a shoe storage apparatus capable of saving space when stored, wherein a shoe storage apparatus includes a leg to be disposed on an installation surface, and an upper panel which has a base end portion to be supported by the leg and a tip end portion on the side opposite to the base end portion, and is disposed at a distance from the installation surface in a state where the base end portion is supported by the leg, and on which one shoe of a pair of shoes can be placed, and the upper panel is constituted to be detachable from the leg.

Abstract: A boot housing device includes: a body having an upper end and a lower end, the body including two leg parts arranged with a specific gap therebetween on its lower end side so as to allow a toe of a boot to be arranged in the gap; and an elevating member including a support pole supported by the body and a shoe receiving part that is attached to an upper end of the support pole and is arranged above the body, the elevating member being provided movably in an axial direction of the support pole.

Abstract: A protective film agent for laser dicing according to the present invention comprises a solution having, dissolved therein, a water-soluble resin and at least one laser light absorber selected from the group consisting of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorber. The protective film agent is coated on a surface of a wafer, which is to be processed, and is then dried to form a protective film. Laser dicing through the protective film produces chips from the wafer. As a result, deposition of debris can be effectively prevented on the entire face of the chips, including their peripheral edge portions.

Abstract: A medical pressure-sensitive adhesive tape according to an embodiment of the present invention includes, a film base material; a first pressure-sensitive adhesive layer; and a release liner releasably laminated to cover the first pressure-sensitive adhesive layer in the stated order, wherein: the release liner is divided into a first divided piece and a second divided piece; the first divided piece is placed at a widthwise-direction end on one side of the first pressure-sensitive adhesive layer to cover part of the first pressure-sensitive adhesive layer; the second divided piece is placed to cover a portion of the first pressure-sensitive adhesive layer that is not covered with the first divided piece; and the second divided piece has a folding portion extending toward a widthwise-direction end.