Patents by Inventor Toyohiko Fujisawa

Toyohiko Fujisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200347229
    Abstract: Provided is a curable organopolysiloxane composition which has a particularly excellent effect of improving initial adhesiveness in small amounts and a thin layer with respect to various base materials, in addition to being able to achieve particularly excellent adhesive durability and high adhesive strength after curing. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per one molecule; (B) a trialcoxysilyl containing siloxane having one silicon atom-bonded hydrogen atom and at least one trialcoxysilyl group per one molecule; (C) a chain or cyclic organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per one molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per one molecule; (E) a catalyst for a hydrosilylation reaction; (F) a catalyst for a condensation reaction; and (G) an adhesion promoter.
    Type: Application
    Filed: August 24, 2017
    Publication date: November 5, 2020
    Inventors: Toyohiko FUJISAWA, Masayuki ONISHI
  • Publication number: 20200270499
    Abstract: Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof.
    Type: Application
    Filed: July 11, 2018
    Publication date: August 27, 2020
    Inventors: Kenji OTA, Toyohiko FUJISAWA
  • Publication number: 20200123417
    Abstract: A liquid curable silicone adhesive composition is provided. The composition is generally storage stable as a one-part composition at room temperature, can primarily cure at room temperature in the presence of moisture, and can secondarily cure at high temperatures, and can form a strong adhesive layer on a substrate or member. The liquid curable silicone adhesive composition comprises: a curable reactive organopolysiloxane which has a radical reactive group and a condensation reactive group in the same molecule or throughout the mixture; a condensation reaction catalyst; an organic peroxide; an adhesion imparting agent; and a crosslinkable silane. Herein, regarding the storage modulus (G?1) of a cured product obtained by primarily curing the composition in the presence of moisture approximately at room temperature, along with the storage elastic modulus (G?2) of a cured pro duct obtained by curing the composition, the increase rate (?) of the storage elastic modulus is at least 50%.
    Type: Application
    Filed: March 19, 2018
    Publication date: April 23, 2020
    Inventors: Harumi KODAMA, Toyohiko FUJISAWA, Yoshito USHIO
  • Patent number: 10604612
    Abstract: Disclosed is a curable organopolysiloxane composition, comprising: (A) a curing reactive organopolysiloxane component formed by curing or semi-curing and reacting at least two or more types of organopolysiloxanes in the presence of one or more types of catalysts; and (B) a peroxide. The composition is a non-fluid at 25° C., and the melt viscosity at 100° C. is 8000 Pa·s or lower. A sealing agent comprising the curable organopolysiloxane composition and a cured product of the curable organopolysiloxane composition are also disclosed, along with a method of molding a cured product and a semiconductor device comprising the cured product.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: March 31, 2020
    Assignee: Dow Toray Co., Ltd.
    Inventors: Toyohiko Fujisawa, Nohno Toda, Ryosuke Yamazaki
  • Publication number: 20190345291
    Abstract: A single-fluid curable thermally conductive silicone grease composition having long-term storage stability at room temperature is provided. The single-fluid curable thermally conductive silicone grease comprises: an organopolysiloxane, having an aliphatic unsaturated hydrocarbon group per single molecule, with a viscosity at 25° C. between 50 and 100,000 mPa·s; an organohydrogen siloxane that includes hydrogen atoms bonded to at least two silicon atoms per single molecule; a thermally conductive filler that includes particle diameters with an average particle diameter between 0.01 and 200 ?m; a microparticle catalyst, with an average particle diameter of between 0.01 and 10 ?m, comprising a thermoplastic resin with a softening point between 40° C. and 200° C., wherein a platinum-based catalyst is included at no less than 0.01 mass %, as platinum metal atoms; and a curing control agent. The complex modulus of elasticity after curing of the composition is between 0.01 MPa and 20 MPa at 25° C.
    Type: Application
    Filed: October 5, 2017
    Publication date: November 14, 2019
    Inventors: Tomoko KATO, Toyohiko FUJISAWA, Harumi KODAMA, Masayuki ONISHI
  • Patent number: 10358542
    Abstract: An adhesion promoter that can achieve excellent initial adhesion improvement effects towards various types of substrates, a curable organopolysiloxane composition containing the adhesion promoter, and a protective agent or adhesive composition for electric and electronic components, are provided. The adhesion promoter comprises the following components (A) to (C) in a specific weight ratio: (A) a reaction mixture of an organoalkoxysilane having an amino group and an organoalkoxysilane having an epoxy group; (B) an organic compound having at least two alkoxysilyl groups in a molecule and having a bond other than a silicone-oxygen bond between these silyl groups; and (C) a silane containing an epoxy group or a partially hydrolyzed condensate thereof.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: July 23, 2019
    Assignee: DOW TORAY CO., LTD.
    Inventors: Toyohiko Fujisawa, Harumi Kodama
  • Patent number: 10077339
    Abstract: A curable organopolysiloxane composition that can achieve excellent initial adhesion improvement effects towards various types of substrates, and a protective agent or adhesive composition for electric and electronic components, are provided. The curable organopolysiloxane composition comprises (A) either i) (a1) an organopolysiloxane having a specific alkoxysilyl-containing group and at least an average of 0.5 alkenyl groups, or ii) a mixture of (a1) and (a2) an organopolysiloxane that has at least two alkenyl groups in a molecule, and that does not have the aforementioned group having an alkoxysilyl group. In the mixture, the amount of component (a1) is 10 to less than 100 mass %. The curable organopolysiloxane composition further comprises (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule, (C) a catalyst for a hydrosilylation reaction, and (D) a catalyst for a condensation reaction.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: September 18, 2018
    Assignee: Dow Corning Toray Co., Ltd.
    Inventors: Toyohiko Fujisawa, Tomoko Kato, Harumi Kodama, Masayuki Onishi
  • Patent number: 9947858
    Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: April 17, 2018
    Assignees: DOW CORNING CORPORATION, DOW CORNING TORAY CO., LTD.
    Inventors: Toyohiko Fujisawa, Hiroshi Fukui, Haruhiko Furukawa, Peter Cheshire Hupfield, Hong Sub Kim, Eiji Kitaura, Kent R. Larson, Wataru Nishiumi, Takuya Ogawa, Masayuki Onishi, Kouichi Ozaki, Keiji Wakita
  • Publication number: 20170355804
    Abstract: Disclosed is a curable organopolysiloxane composition, comprising: (A) a curing reactive organopolysiloxane component formed by curing or semi-curing and reacting at least two or more types of organopolysiloxanes in the presence of one or more types of catalysts; and (B) a peroxide. The composition is a non-fluid at 25° C., and the melt viscosity at 100° C. is 8000 Pa·s or lower. A sealing agent comprising the curable organopolysiloxane composition and a cured product of the curable organopolysiloxane composition are also disclosed, along with a method of molding a cured product and a semiconductor device comprising the cured product.
    Type: Application
    Filed: December 17, 2015
    Publication date: December 14, 2017
    Inventors: Toyohiko FUJISAWA, Nohno TODA, Ryosuke YAMAZAKI
  • Publication number: 20170121462
    Abstract: A curable organopolysiloxane composition that can achieve excellent initial adhesion improvement effects towards various types of substrates, and a protective agent or adhesive composition for electric and electronic components, are provided. The curable organopolysiloxane composition comprises (A) either i) (a1) an organopolysiloxane having a specific alkoxysilyl-containing group and at least an average of 0.5 alkenyl groups, or ii) a mixture of (a1) and (a2) an organopolysiloxane that has at least two alkenyl groups in a molecule, and that does not have the aforementioned group having an alkoxysilyl group. In the mixture, the amount of component (a1) is 10 to less than 100 mass %. The curable organopolysiloxane composition further comprises (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule, (C) a catalyst for a hydrosilylation reaction, and (D) a catalyst for a condensation reaction.
    Type: Application
    Filed: March 26, 2015
    Publication date: May 4, 2017
    Applicant: Dow Corning Toray Co., Ltd.
    Inventors: Toyohiko FUJISAWA, Tomoko KATO, Harumi KODAMA, Masayuki ONISHI
  • Publication number: 20170058103
    Abstract: An adhesion promoter that can achieve excellent initial adhesion improvement effects towards various types of substrates, a curable organopolysiloxane composition containing the adhesion promoter, and a protective agent or adhesive composition for electric and electronic components, are provided. The adhesion promoter comprises the following components (A) to (C) in a specific weight ratio: (A) a reaction mixture of an organoalkoxysilane having an amino group and an organoalkoxysilane having an epoxy group; (B) an organic compound having at least two alkoxysilyl groups in a molecule and having a bond other than a silicone-oxygen bond between these silyl groups; and (C) a silane containing an epoxy group or a partially hydrolyzed condensate thereof.
    Type: Application
    Filed: March 26, 2015
    Publication date: March 2, 2017
    Inventors: Toyohiko FUJISAWA, Harumi KODAMA
  • Patent number: 9403982
    Abstract: A curable silicone composition comprises at least (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a hydrosilylation reaction catalyst, (D) an approximately spherical silica fine powder having an average particle diameter of 50 ?m or less and (E) glass fibers having an average fiber length of 1,000 ?m or less and an average fiber diameter of 30 ?m or less. A cured product produced by curing the curable silicone composition is also disclosed.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: August 2, 2016
    Assignee: DOW CORNING CORPORATION
    Inventors: Toyohiko Fujisawa, Kazusato Shibata
  • Patent number: 9227183
    Abstract: The present invention relates to microparticles comprising: at least one type of a platinum-based catalyst; and a thermoplastic polyolefin resin with a Z-average (Mz) of a weight average molecular weight (Mw) of at least 2500 and Mz/Mw of not more than 2.0, wherein the platinum-based catalyst is dispersed in the thermoplastic polyolefin resin. The microparticles make it possible to obtain a one-component curable organopolysiloxane composition having characteristics such as excellent storage stability.
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: January 5, 2016
    Assignees: DOW CORNING TORAY CO., LTD., DOW CORNING CORPORATION
    Inventors: Manabu Sutoh, Kouichi Ozaki, Toru Imaizumi, Dorab Edul Bhagwagar, Toyohiko Fujisawa
  • Publication number: 20150380636
    Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.
    Type: Application
    Filed: December 26, 2013
    Publication date: December 31, 2015
    Inventors: Toyohiko Fujisawa, Hiroshi Fukui, Haruhiko Furukawa, Peter Cheshire Hupfield, Hong Sub Kim, Eiji Kitaura, Kent R. Larson, Wataru Nishiumi, Takuya Ogawa, Masayuki Onishi, Kouichi Ozaki, Keiji Wakita
  • Publication number: 20150246349
    Abstract: The present invention relates to microparticles comprising: at least one type of a platinum-based catalyst; and a thermoplastic polyolefin resin with a Z-average (Mz) of a weight average molecular weight (Mw) of at least 2500 and Mz/Mw of not more than 2.0, wherein the platinum-based catalyst is dispersed in the thermoplastic polyolefin resin. The microparticles make it possible to obtain a one-component curable organopolysiloxane composition having characteristics such as excellent storage stability.
    Type: Application
    Filed: July 26, 2013
    Publication date: September 3, 2015
    Inventors: Manabu Sutoh, Kouichi Ozaki, Toru Imaizumi, Dorab Edul Bhagwagar, Toyohiko Fujisawa
  • Publication number: 20150210853
    Abstract: A curable silicone composition comprises at least (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a hydrosilylation reaction catalyst, (D) an approximately spherical silica fine powder having an average particle diameter of 50 ?m or less and (E) glass fibers having an average fiber length of 1,000 ?m or less and an average fiber diameter of 30 ?m or less. A cured product produced by curing the curable silicone composition is also disclosed.
    Type: Application
    Filed: September 5, 2013
    Publication date: July 30, 2015
    Applicant: DOW CORNING TORAY CO., LTD.
    Inventors: Toyohiko Fujisawa, Kazusato Shibata
  • Patent number: 8729195
    Abstract: An objective of the present invention is to provide a curable silicone composition of the present invention exhibiting superior adhesive properties with respect to a poor-adhesive resin such as PPS, even if the composition is cured at a relatively low temperature for a short period. The aforementioned objective of the present invention is achieved by a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a hydrosilylation-reaction catalyst, and (D) an acid anhydride having an alkoxy group bonding to a silicon atom or an alkoxyalkoxy group bonding to a silicon atom.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: May 20, 2014
    Assignee: Dow Corning Toray Co., Ltd.
    Inventors: Yoshinori Taniguchi, Toyohiko Fujisawa, Yasushi Sugiura
  • Publication number: 20120309921
    Abstract: An objective of the present invention is to provide a curable silicone composition of the present invention exhibiting superior adhesive properties with respect to a poor-adhesive resin such as PPS, even if the composition is cured at a relatively low temperature for a short period. The aforementioned objective of the present invention is achieved by a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a hydrosilylation-reaction catalyst, and (D) an acid anhydride having an alkoxy group bonding to a silicon atom or an alkoxyalkoxy group bonding to a silicon atom.
    Type: Application
    Filed: December 20, 2010
    Publication date: December 6, 2012
    Inventors: Yoshinori Taniguchi, Toyohiko Fujisawa, Yasushi Sugiura
  • Patent number: 8093333
    Abstract: A hot-melt silicone adhesive comprising: (A) an organopolysiloxane resin with a softening point in the range of 40 to 250° C.; (B) an organopolysiloxane that at 25° C. is liquid or in the state of a crude rubber, which contains in one molecule at least two alkenyl groups; (C) a composition selected from a mixture of (i) an organopolysiloxane that contains silicon-bonded hydrogen atoms and (ii) an organic silicon compound that contains a silicon-bonded alkoxy group; or (iii) an organopolysiloxane that contains silicon-bonded hydrogen atoms and a silicon-bonded alkoxy group; (D) a hydrosilylation catalyst; and (E) a hydrosilylation-reaction inhibitor, demonstrates good gap-filling ability during thermo-compressive bonding to adherends with high surface roughness, even at low pressures, and that provides strong adhesion to the adherend after cross-linking.
    Type: Grant
    Filed: March 27, 2006
    Date of Patent: January 10, 2012
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Toyohiko Fujisawa, Yoshito Ushio, Manabu Sutoh, Yoshinori Taniguchi, Koji Nakanishi
  • Publication number: 20110224344
    Abstract: A liquid die bonding agent comprising (A) an organopolysiloxane that has at least 2 alkenyl groups in one molecule, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms in one molecule, (C) a hydrosilylation reaction action catalyst, (D) a hydrosilylation reaction inhibitor, and (E) an organic solvent that can dissolve components (A), (B), and (D), that is liquid, and that has a boiling point of 180° C. to 400° C. Also, the preceding liquid die bonding agent that additionally comprises (F) an organosilicon compound-based adhesion promoter.
    Type: Application
    Filed: September 16, 2009
    Publication date: September 15, 2011
    Inventors: Toyohiko Fujisawa, Daesup Hyun, Junji Nakanishi