Abstract: An external chassis wall liquid cooling system includes a chassis defining a chassis housing. A chassis wall is located on the chassis and includes a first surface that is located adjacent the chassis housing and a second surface that is located opposite the chassis wall from the first surface and that provides an outer surface of the chassis. A liquid cooling channel is defined by the chassis wall and extends through the chassis wall between the first surface and the second surface. A liquid is located in the liquid cooling channel, and a pump is coupled to the liquid cooling channel and configured to move the liquid through the liquid cooling channel. A fan system in the chassis housing may move air past heat producing components to transfer heat produced by those heat producing components, and the liquid may further dissipate that heat out of the chassis.

Abstract: An external chassis wall liquid cooling system includes a chassis defining a chassis housing. A chassis wall is located on the chassis and includes a first surface that is located adjacent the chassis housing and a second surface that is located opposite the chassis wall from the first surface and that provides an outer surface of the chassis. A liquid cooling channel is defined by the chassis wall and extends through the chassis wall between the first surface and the second surface. A liquid is located in the liquid cooling channel, and a pump is coupled to the liquid cooling channel and configured to move the liquid through the liquid cooling channel. A fan system in the chassis housing may move air past heat producing components to transfer heat produced by those heat producing components, and the liquid may further dissipate that heat out of the chassis.

Abstract: Multi-component shared cooling systems include a chassis housing a first heat exchanger device and a second heat exchanger device. A first component such as, for example, a system processor, is housed in the chassis, includes a first thermal connection to the first heat exchanger device, and includes a second thermal connection to the second heat exchanger device. A second component such as, for example, a graphics processor, is housed in the chassis and includes a third thermal connection to the first heat exchanger device. The first heat exchanger device is configured to dissipate heat that is produced by the second component and transmitted by the third thermal connection. The second heat exchanger device is configured to dissipate the heat that is produced by the second component and transmitted by the third thermal connection, the first heat exchanger device, the first thermal connection, the first component, and the second thermal connection.

Abstract: An information handling system (IHS) cooling system includes a multi-IHS chassis having at least one fan system that produces an airflow. An IHS is positioned in the multi-IHS chassis. The IHS includes an IHS chassis that houses a processing system and a memory system. An airflow channel is defined within the IHS chassis and is configured to receive at least a portion of the airflow produced by the at least one fan system. An airflow impedance element is positioned in the airflow channel, and includes a first orientation in which the airflow impedance element extends into the airflow channel to impede airflow through the airflow channel. The airflow impedance element is configured to change shape as a function of temperature into at least one second orientation that reduces the impedance of airflow through the airflow channel. In some embodiments, the airflow impedance element is a bimetallic plate.

Abstract: An information handling system (IHS) cooling system includes a multi-IHS chassis having at least one fan system that produces an airflow. An IHS is positioned in the multi-IHS chassis. The IHS includes an IHS chassis that houses a processing system and a memory system. An airflow channel is defined within the IHS chassis and is configured to receive at least a portion of the airflow produced by the at least one fan system. An airflow impedance element is positioned in the airflow channel, and includes a first orientation in which the airflow impedance element extends into the airflow channel to impede airflow through the airflow channel. The airflow impedance element is configured to change shape as a function of temperature into at least one second orientation that reduces the impedance of airflow through the airflow channel. In some embodiments, the airflow impedance element is a bimetallic plate.

Abstract: Multi-component shared cooling systems include a chassis housing a first heat exchanger device and a second heat exchanger device. A first component such as, for example, a system processor, is housed in the chassis, includes a first thermal connection to the first heat exchanger device, and includes a second thermal connection to the second heat exchanger device. A second component such as, for example, a graphics processor, is housed in the chassis and includes a third thermal connection to the first heat exchanger device. The first heat exchanger device is configured to dissipate heat that is produced by the second component and transmitted by the third thermal connection. The second heat exchanger device is configured to dissipate the heat that is produced by the second component and transmitted by the third thermal connection, the first heat exchanger device, the first thermal connection, the first component, and the second thermal connection.

Abstract: The present disclosure includes a method for regenerating power in an information handling system. The method includes circulating a cooling fluid through a fluid flow loop connecting a thermosiphon, a turbine, and a condenser. The method further includes removing heat from a heated component of the information handling system, converting the cooling fluid from a liquid state to a gaseous state in the thermosiphon, and extracting energy from the cooling fluid in the gaseous state in the turbine. The method additionally includes removing thermal energy from the cooling fluid in the condenser, converting the cooling fluid from a gaseous state to a liquid state as the thermal energy is removed from the cooling fluid, and returning the cooling fluid in the liquid state to the thermosiphon. The disclosure also includes associated systems and apparatuses.

Abstract: A Hard Disk Drive (HDD) temperature control system includes an HDD including a temperature sensor. An Operating System (OS) driver is coupled to the temperature sensor and includes a temperature data retrieval engine that is operable to retrieve HDD temperature data from the temperature sensor and transmit the HDD temperature data. A shared data storage is coupled to the OS driver and operable to store the HDD temperature data transmitted from the temperature data retrieval engine. A fan speed controller is coupled to the shared data storage and operable to use the HDD temperature data stored in the shared data storage to adjust the speed of a fan.

Abstract: A power regeneration system for use with an information handling system is disclosed. The power regeneration system may include a thermosiphon in thermal communication with a heated component of the information handling system, a turbine, a condenser, and a fluid flow loop. The thermosiphon may be configured to convert a cooling fluid from a liquid to a gaseous state as the cooling fluid absorbs heat from the heated component of the information handling system. The turbine may be configured to extract energy from the cooling fluid in the gaseous state after it leaves the thermosiphon. The condenser may be configured to remove thermal energy from the cooling fluid after it leaves the turbine, the condenser fluid converting the cooling fluid from a gaseous state to a liquid state as thermal energy is removed. The fluid flow loop may connect the thermosiphon, the turbine, and the condenser in order so that the cooling fluid flows in a closed loop through the power regeneration system.

Abstract: A Hard Disk Drive (HDD) temperature control system includes an HDD including a temperature sensor. An Operating System (OS) driver is coupled to the temperature sensor and includes a temperature data retrieval engine that is operable to retrieve HDD temperature data from the temperature sensor and transmit the HDD temperature data. A shared data storage is coupled to the OS driver and operable to store the HDD temperature data transmitted from the temperature data retrieval engine. A fan speed controller is coupled to the shared data storage and operable to use the HDD temperature data stored in the shared data storage to adjust the speed of a fan.