Abstract: Programmable devices and methods of operation are disclosed. In some embodiments, a programmable device may include programmable logic selectively coupled to a plurality of input/output (I/O) interface circuits by a programmable interconnect fabric and a network-on-chip (NoC) interconnect system. The programmable logic may include configurable logic elements, programmable interconnects, and dedicated circuitry. The programmable interconnects may form part of the programmable interconnect fabric. In some embodiments, the programmable interconnect fabric selectively routes non-packetized data between the programmable logic and a first group of I/O interface circuits, and the NoC interconnect system selectively routes packetized data between the programmable logic and a second group of I/O interface circuits. The NoC interconnect system may operate according to a data packet protocol, and the second group of I/O interface circuits may include memory controllers compatible with the data packet protocol.

Abstract: A programmable logic device with fabric regularity is disclosed. For example, the programmable logic device may include a plurality of similar heterogeneous logic blocks. A user's design may be implemented within a first group of heterogeneous logic blocks. The user's design may be moved or copied to a second group of heterogeneous logic blocks. More specifically, routing, timing, and/or placement information associated with the implementation of the users design in the first group of heterogeneous logic blocks may be used to implement the user's design in the second group of heterogeneous logic blocks.

Abstract: An apparatus includes an integrated circuit with a clock network in an array of circuit blocks. The clock network includes routing tracks, distribution spines, and clock leaves. The routing tracks and the distribution spines are bidirectional.

Abstract: A method and apparatus to test the inter-die interface between two or more semiconductor die in die stacking applications, where a mismatch exists between the number of input and output pads on a base die and the number of input and output pads on a stacked die. In a first embodiment, a number of through-die vias (TDVs) may be used to implement inter-die signal paths using standard or flexible design rules to maintain statistical TDV yield despite the lack of continuity verification of the inter-die signals paths. In alternate embodiments, programmable multiplexers may be utilized to share one or more inter-die connections between the base die and the one or more stacked die so as to facilitate testing and normal operation of each inter-die connection. In other embodiments, spare TDVs are utilized only during test operations, so as to accommodate the mismatch.

Abstract: A programmable integrated circuit (IC) with mirrored interconnect structure. The IC includes a plurality of arrangements, which are horizontally arranged. Each arrangement includes a first logic column, an interconnect column, and a second logic column. Each interconnect column includes programmable interconnect blocks (148), and each of the first and second logic columns includes programmable logic blocks. Each programmable interconnect block provides a plurality of first input and output ports on a first side and a plurality of second input and output ports on a second side. The first ports and the first side of each of the programmable interconnect blocks physically mirror the second ports and the second side of the programmable interconnect block. The ports of the programmable interconnect blocks are coupled to the ports of the programmable logic blocks in the first and second logic columns.

Abstract: Circuits and methods for facilitating distribution of gated clocks in a programmable integrated circuit such as a field programmable gate array (FPGA) are described. Dynamic power savings are achieved in a FPGA by providing gated clock driver circuitry at various places in a hierarchical clock distribution network. The gated clock circuitry provides a clock signal gated by an enable signal to clocked elements. Configurable logic blocks (CLBs) comprising the clocked elements and programmable interconnect tiles are disposed in the gate array. Clock signals are distributed to the CLBs via a clock distribution network. Clock enable signals are provided corresponding to some of the clock signals. Clock buffers or drivers are provided within the clock distribution network that drive gated clock signals to CLBs. By disabling certain clocked elements using one or more embodiments of the invention when portions of the FPGA are inactive, dynamic power consumption is reduced.

Abstract: A programmable integrated circuit (IC) with mirrored interconnect structure. The IC includes a plurality of arrangements, which are horizontally arranged. Each arrangement includes a first logic column, an interconnect column, and a second logic column. Each interconnect column includes programmable interconnect blocks (148), and each of the first and second logic columns includes programmable logic blocks. Each programmable interconnect block provides a plurality of first input and output ports on a first side and a plurality of second input and output ports on a second side. The first ports and the first side of each of the programmable interconnect blocks physically mirror the second ports and the second side of the programmable interconnect block. The ports of the programmable interconnect blocks are coupled to the ports of the programmable logic blocks in the first and second logic columns.

Abstract: A method of modeling two IC dies using the same software model, although the two dies include physical differences. A first programmable logic device (PLD) die includes first and second portions, and is encoded to render the first portion operational and the second portion non-operational. At a boundary between the two portions, interconnect lines traversing the boundary include a first section in the first portion and a second section in the second portion. The second PLD die includes the first portion of the first PLD die, while omitting the second portion. The interconnect lines extending to the edge of the second die are coupled together in pairs. A software model for both die includes a termination model that omits the pair coupling, adds an RC load compensating for the omitted connection, and (for bidirectional interconnect lines) flags one interconnect line in each pair as being invalid for use by routing software.

Abstract: A columnar programmable device (PD) design converted to a columnar application specific integrated circuit-like (ASIC-like) design is described. A user design is instantiated in a PD having a columnar architecture associated with the columnar PD design. The columnar architecture has adjacent columns of circuitry, and one or more of the columns of circuitry as associated with instantiation of the user design in the PD are identified. At least a portion of one or more of the identified columns are swapped with application specific circuitry for implementing all or part of the user design for converting the columnar PD design to the columnar ASIC-like design.

Abstract: Signal distribution of a regional signal is described. An integrated circuit includes a global signal distribution network, a regional signal distribution network and a regional buffer. The regional buffer has an output coupled at an end of the regional signal distribution network. The regional signal distribution network is coupled to a configurable logic block via an interconnect tile. The regional buffer is coupled to a regional clock capable input/output block. Additionally described is a source synchronous interface for regional signal distribution.

Abstract: Structures and methods of avoiding hold time violations in a design implemented in a PLD. In a programmable device, the delay of a signal path varies, e.g., depending on the separation between the source and destination of the signal. An optional delay element is provided between a programmable interconnect structure and a destination logic element having a clock skew relative to the source. The optional delay element is programmed by the implementation software to introduce a delay on the signal path when necessary to meet the hold time requirements for the destination logic element. The optional delay is designed to be large enough to overcome hold-time violations even for the largest possible clock skew and the smallest possible signal delay. When no hold time violation occurs, the optional delay element is configured to bypass the additional delay, to avoid imposing a large setup requirement on the signal.

Abstract: Methods of manufacturing a family of packaged integrated circuits (ICs) having at least two different logic capacities. A first IC die includes two different portions, of which at least one portion can be deliberately rendered non-operational in some manner (e.g., non-functional, inaccessible, and/or non-programmable) within the package. A first set of the first IC dies are packaged such that both portions of the dies are operational. A second set of the first IC dies are packaged such that only the first portion of each die is operational. Once the first and second sets are packaged and the second set of ICs has been evaluated, a decision is made whether or not to manufacture a second IC die that includes the first portion of the first die, while excluding the second portion.

Abstract: An integrated circuit die (e.g., a programmable logic device (PLD) die) is manufactured that has the capability of being configured as at least two differently-sized family members. The IC die is tested prior to packaging. If a first portion of the IC die is fully functional, but a second portion includes a localized defect, then the IC die is packaged with a product selection code that configures the IC die to operate as only the first portion of the die. The second portion of the die is deliberately rendered non-operational. Therefore, the IC die can still be sold as a fully functional packaged IC.

Abstract: A columnar programmable logic device (PLD) design converted to a columnar application specific integrated circuit-like (ASIC-like) design is described. A user design is instantiated in a PLD having a columnar architecture associated with the columnar PLD design. The columnar architecture has adjacent columns of circuitry, and one or more of the columns of circuitry as associated with instantiation of the user design in the PLD are identified. At least a portion of one or more of the identified columns are swapped with application specific circuitry for implementing all or part of the user design for converting the columnar PLD design to the columnar ASIC-like design.

Abstract: A method of modeling two IC dies using the same software model, although the two dies include physical differences. A first programmable logic device (PLD) die includes first and second portions, and is encoded to render the first portion operational and the second portion non-operational. At a boundary between the two portions, interconnect lines traversing the boundary include a first section in the first portion and a second section in the second portion. The second PLD die includes the first portion of the first PLD die, while omitting the second portion. The interconnect lines extending to the edge of the second die are coupled together in pairs. A software model for both die includes a termination model that omits the pair coupling, adds an RC load compensating for the omitted connection, and (for bidirectional interconnect lines) flags one interconnect line in each pair as being invalid for use by routing software.

Abstract: A method of providing a family of integrated circuits (ICs) includes applying a first product selection code (PSC) to a first IC die, applying a second PSC to a second IC die, and providing a third packaged IC die. The first IC die includes first and second portions, both of which are operational based on the first PSC. The second IC die is a duplicate of the first die, but the second portion is rendered non-operational by the second PSC. The third IC die is substantially similar to the first portion of the first die. The second and third packages can be the same and the packaged dies can be interchangeable in a system. When the dies are programmable logic device (PLD) dies, the second and third dies use the same configuration bit stream, which may be smaller than the configuration bit stream for the first IC die.

Abstract: A programmable logic block provides two lookup table (LUT) output signals to a general interconnect structure in an integrated circuit (IC), one output terminal of the logic block being dedicated to a first LUT output signal, and the other output terminal having a selectable input that can provide either of the two LUT output signals to the general interconnect structure. An IC includes an interconnect structure (e.g., a programmable interconnect structure) and a programmable logic block coupled to the interconnect structure. The programmable logic block includes a LUT having two output terminals. A first LUT output terminal is non-programmably coupled to the interconnect structure via a first output terminal of the logic block. Both the first and the second LUT output terminals are programmably coupled to the interconnect structure via a second output terminal of the logic block, e.g., via a programmable multiplexer selecting between the two LUT output terminals.

Abstract: Signal distribution of a regional signal is described. A programmable logic device includes a global signal distribution network, a regional signal distribution network and a regional buffer. The regional buffer has an output coupled at an end of the regional signal distribution network. The regional signal distribution network is coupled to a configurable logic block via an interconnect tile. The regional buffer is coupled to a regional clock capable input/output block. Additionally described is a source synchronous interface for regional signal distribution.

Abstract: A multi-product integrated circuit die includes at least two different portions, of which at least one portion can be deliberately rendered non-operational in some manner (e.g., non-functional, inaccessible, and/or non-programmable) within the package. A selection code storage circuit stores a product selection code. A first value of the product selection code selects the option where both the first and second portions of the first die are operational. A second value of the product selection code selects the option where only the first portion of the first die is operational. The selection code storage circuit can include non-volatile memory or a fuse structure, or the product selection code can be configured as a package bonding option. The product selection code can also enable boundary scan for the operational portion of the die, and omit from the boundary scan chain any portions of the die that are deliberately rendered non-operational.

Abstract: Structures and methods of avoiding hold time violations in a design implemented in a PLD. In a programmable device, the delay of a signal path varies, e.g., depending on the separation between the source and destination of the signal. An optional delay element is provided between a programmable interconnect structure and a destination logic element having a clock skew relative to the source. The optional delay element is programmed by the implementation software to introduce a delay on the signal path when necessary to meet the hold time requirements for the destination logic element. The optional delay is designed to be large enough to overcome hold-time violations even for the largest possible clock skew and the smallest possible signal delay. When no hold time violation occurs, the optional delay element is configured to bypass the additional delay, to avoid imposing a large setup requirement on the signal.