Patents by Inventor Troy Wy Piew Chiang
Troy Wy Piew Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10802232Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.Type: GrantFiled: July 23, 2019Date of Patent: October 13, 2020Assignee: II-VI Delaware Inc.Inventors: Tat Ming Teo, John Hsieh, William H. Wang, Jinxiang Liu, Hon Siu Wee, Troy Wy Piew Chiang
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Publication number: 20200033541Abstract: A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.Type: ApplicationFiled: August 6, 2019Publication date: January 30, 2020Inventors: Troy Wy Piew Chiang, Julia Koh, Tat Ming Teo, William H. Wang
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Publication number: 20190346642Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.Type: ApplicationFiled: July 23, 2019Publication date: November 14, 2019Inventors: Tat Ming Teo, John Hsieh, William H. Wang, Jinxiang Liu, Hon Siu Wee, Troy Wy Piew Chiang
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Patent number: 10371909Abstract: A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.Type: GrantFiled: March 13, 2017Date of Patent: August 6, 2019Assignee: FINISAR CORPORATIONInventors: Troy Wy Piew Chiang, Julia Koh, Tat Ming Teo, William H. Wang
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Patent number: 10359586Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.Type: GrantFiled: October 2, 2015Date of Patent: July 23, 2019Assignee: FINISAR CORPORATIONInventors: Tat Ming Teo, John Hsieh, William H. Wang, Jinxiang Liu, Hon Siu Wee, Troy Wy Piew Chiang
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Publication number: 20170261711Abstract: A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.Type: ApplicationFiled: March 13, 2017Publication date: September 14, 2017Inventors: Troy Wy Piew Chiang, Julia Koh, Tat Ming Teo, William H. Wang
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Publication number: 20170097484Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.Type: ApplicationFiled: October 2, 2015Publication date: April 6, 2017Inventors: Tat Ming Teo, John Hsieh, William H. Wang, Jinxiang Liu, Hon Siu Wee, Troy Wy Piew Chiang
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Patent number: 9572283Abstract: An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that is disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly can transfer from the optical subassembly to the shell. The thermally conductive flexible member defines thermally conductive flexible member holes that correspond to pins extending from the optical subassembly. The pins pass through the thermally conductive flexible member holes enabling the thermally conductive flexible member to contact the optical subassembly.Type: GrantFiled: December 15, 2014Date of Patent: February 14, 2017Assignee: FINISAR CORPORATIONInventors: Tat Ming Teo, Troy Wy Piew Chiang, JianBing Zhao
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Publication number: 20150096732Abstract: An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that is disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly can transfer from the optical subassembly to the shell. The thermally conductive flexible member defines thermally conductive flexible member holes that correspond to pins extending from the optical subassembly. The pins pass through the thermally conductive flexible member holes enabling the thermally conductive flexible member to contact the optical subassembly.Type: ApplicationFiled: December 15, 2014Publication date: April 9, 2015Inventors: Tat Ming Teo, Troy Wy Piew Chiang, JianBing Zhao
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Patent number: 8913388Abstract: An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and to contact the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly can transfer from the optical subassembly to the shell. The thermally conductive flexible member defines thermally conductive flexible member holes that correspond to pins extending from the optical subassembly. The pins pass through the thermally conductive flexible member holes enabling the thermally conductive flexible member to contact the optical subassembly.Type: GrantFiled: January 18, 2012Date of Patent: December 16, 2014Assignee: Finisar CorporationInventors: Tat Ming Teo, Troy Wy Piew Chiang, JianBing Zhao
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Publication number: 20130182390Abstract: An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and to contact the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly can transfer from the optical subassembly to the shell. The thermally conductive flexible member defines thermally conductive flexible member holes that correspond to pins extending from the optical subassembly. The pins pass through the thermally conductive flexible member holes enabling the thermally conductive flexible member to contact the optical subassembly.Type: ApplicationFiled: January 18, 2012Publication date: July 18, 2013Applicant: FINISAR CORPORATIONInventors: Tat Ming Teo, Troy Wy Piew Chiang, Jianbing Zhao
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Patent number: 7955003Abstract: In one example, a bail release mechanism includes a bail and a de-latching member. The bail is configured to be attached to the shell of a module that includes a latch pin configured to engage a structure of a host device receptacle to secure the module within the receptacle. The bail is further configured to rotate about a first axis between a latched position and an unlatched position. The first axis is in a fixed position relative to the shell. The de-latching member is attached to the bail at a second axis that is offset from the first axis and is configured to rotate about the second axis. The second axis is movable relative to the shell. The de-latching member includes a first end configured to displace the structure of the receptacle during rotation of the de-latching member to disengage the latch pin from the structure.Type: GrantFiled: June 4, 2009Date of Patent: June 7, 2011Assignee: Finisar CorporationInventors: Tat Ming Teo, Troy Wy Piew Chiang
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Publication number: 20100142898Abstract: In one example, a bail release mechanism includes a bail and a de-latching member. The bail is configured to be attached to the shell of a module that includes a latch pin configured to engage a structure of a host device receptacle to secure the module within the receptacle. The bail is further configured to rotate about a first axis between a latched position and an unlatched position. The first axis is in a fixed position relative to the shell. The de-latching member is attached to the bail at a second axis that is offset from the first axis and is configured to rotate about the second axis. The second axis is movable relative to the shell. The de-latching member includes a first end configured to displace the structure of the receptacle during rotation of the de-latching member to disengage the latch pin from the structure.Type: ApplicationFiled: June 4, 2009Publication date: June 10, 2010Applicant: FINISAR CORPORATIONInventors: Tat Ming Teo, Troy Wy Piew Chiang