Abstract: A guidance system for remote guidance of a remote platform(s) towards a target destination is disclosed. The guidance system includes a light module including a light source operable for beam to illuminating the remote platform, and a spatial light modulator (SLM) placed in the optical path of the light beam emitted from the light source. The guidance system includes a controller operable for obtaining data indicative of guidance information for navigating the remote platform towards the target destination. The controller operates the SLM to encode the guidance information in the light beam. The guidance information may be encoded in light pattern including at least one of the following: a spatial light pattern formed in a cross-section of the light beam, a temporal light pattern in the light beam, and a spatiotemporal light pattern.

Abstract: A guidance system for remote guidance of a remote platform(s) towards a target destination is disclosed. The guidance system includes a light module including a light source operable for beam to illuminating the remote platform, and a spatial light modulator (SLM) placed in the optical path of the light beam emitted from the light source. The guidance system includes a controller operable for obtaining data indicative of guidance information for navigating the remote platform towards the target destination. The controller operates the SLM to encode the guidance information in the light beam. The guidance information may be encoded in light pattern including at least one of the following: a spatial light pattern formed in a cross-section of the light beam, a temporal light pattern in the light beam, and a spatiotemporal light pattern.

Abstract: An optical inspection tool can automatically perform analysis/operations after the tool has generated data identifying defects (e.g. a defect list) from an inspection run of an object such as a semiconductor wafer. The tool can decouple post-inspection tasks from performing inspection runs so that one or more post-inspection tasks are performed on defect data from a previous inspection run while another inspection run is in progress. This can significantly improve the throughput of the tool when multiple inspections are performed, since the inspection run time effectively is shortened to include only the time the tool is actually used to acquire defect data. One or more post-inspection tasks can be performed, including, but not limited to, merging inspection runs, removing duplicate defects, removing straight-line false alarms, and characterizing defects.

Abstract: An optical inspection system or tool can be configured to inspect objects using dynamic illumination where one or more characteristics of the illumination is/are adjusted to meet the inspection needs of different areas. For example, the illumination intensity may be increased or decreased as the tool inspects areas of memory and periphery features in a wafer die. In some embodiments, the adjustment can be based on data obtained during a pre-inspection setup sequence in which images taken based on illumination with varying characteristics are evaluated for suitability in the remainder of the inspection process.

Abstract: An optical inspection tool can automatically perform analysis/operations that after the tool has generated data identifying defects (e.g. a defect list) from an inspection run of an object such as a semiconductor wafer. The tool can decouple post-inspection tasks from performing inspection runs so that one or more post-inspection tasks are performed on defect data from a previous inspection run while another inspection run is in progress. This can significantly improve the throughput of the tool when multiple inspections are performed, since the inspection run time effectively is shortened to include only the time the tool is actually used to acquire defect data. One or more post-inspection tasks can be performed, including, but not limited to, merging inspection runs, removing duplicate defects, removing straight-line false alarms, and characterizing defects.

Abstract: An optical inspection system or tool can be configured to inspect objects using dynamic illumination where one or more characteristics of the illumination is/are adjusted to meet the inspection needs of different areas. For example, the illumination intensity may be increased or decreased as the tool inspects areas of memory and periphery features in a wafer die. In some embodiments, the adjustment can be based on data obtained during a pre-inspection setup sequence in which images taken based on illumination with varying characteristics are evaluated for suitability in the remainder of the inspection process.