Patents by Inventor Tse-Hsien Liao

Tse-Hsien Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11812389
    Abstract: A thermal management method is applicable to a wireless communication apparatus. The wireless communication apparatus includes at least a wireless communication module, a heat source set, a thermally conductive assembly, a heat-dissipating fin assembly, and a cooling fan. The thermally conductive assembly is connected to the wireless communication module and the heat source set. The heat-dissipating fin assembly is connected to the thermally conductive assembly and arranged corresponding to the heat source set or the wireless communication module. The cooling fan normally operates at a first rotational speed for cooling to the heat-dissipating fin assembly. Upon the raising of a temperature value of the wireless communication apparatus, the method is to raise the first rotational speed to a second rotational speed, switch down the power consumption of the heat source set, and execute an event trigger, so as to maintain the temperature value within a proper temperature range.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: November 7, 2023
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Ching-Hsun Huang, Tse-Hsien Liao, Po-Jen Shih
  • Publication number: 20230205459
    Abstract: A control method applied in a storage device for dynamically adjusting a ratio of single-level cell (SLC) blocks and three-level cells (TLC) blocks is provided. A selection input is received. The number of SLC blocks and TLC blocks of a flash memory are adjusted according to the selection input. In response to the storage device being reset, the number of SLC blocks and TLC blocks of the flash memory are re-adjusted.
    Type: Application
    Filed: May 25, 2022
    Publication date: June 29, 2023
    Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Ching-Hsun HUANG, Tse-Hsien LIAO
  • Patent number: 11612050
    Abstract: A heat dissipation device includes a heat conductor. The heat conductor includes a heat dissipation side and a heat absorption side opposite to each other. The heat absorption side is formed by at least two contact planes. The at least two contact planes are arranged in parallel to each other, and a height difference exists between the at least two contact planes.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: March 21, 2023
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Hung-Cheng Chen, Tse-Hsien Liao
  • Patent number: 11431078
    Abstract: A data processing system includes a display device, a proximity sensor, a wireless data processing apparatus, and an external antenna. The display device and the wireless data processing apparatus are connected. The display device is equipped with an internal antenna indirectly connected to a wireless communication module of the wireless data processing apparatus. The external antenna is electrically connected to the wireless communication module. A data processing circuit of the wireless data processing apparatus normally controls the wireless communication module to set signal transmission strengths of the antennas by using a first antenna control mode. When the proximity sensor detects an object located close to proximity sensor, the data processing circuit controls the wireless communication module to set the signal transmission strengths by using a second antenna control mode that includes at least decreasing the signal transmission strength of the internal antenna.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: August 30, 2022
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Ching-Hsun Huang, Tse-Hsien Liao
  • Patent number: 11323141
    Abstract: A control method of a multi-antenna module includes the following. Antennas generating signals in at least a first frequency band and a second frequency band are provided. The antennas are divided into a first group and a second group by detecting performance of the antennas in the first frequency band and the second frequency band. Antennas of the first group have better performance in the first frequency band than in the second frequency band, and antennas of the second group are antennas other than the antennas of the first group. The number of the antennas of each of the first group and the second group is at least greater than or equal to 2. The first group is instructed to generate the signals in the first frequency band, and the second group is instructed to generate the signals in the second frequency band.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: May 3, 2022
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Ching-Hsun Huang, Tse-Hsien Liao
  • Patent number: 11262914
    Abstract: A solid-state drive and a performance optimization method for the solid-state drive are provided. The performance optimization method for the solid-state drive includes the following steps: detecting a queue depth of the solid-state drive to determine a use proportion of the queue depth; determining whether an access speed of the solid-state drive is raisable when the use proportion of the queue depth is higher than a first threshold proportion, so as to raise the access speed of the solid-state drive; and determining whether the access speed of the solid-state drive is reduceable when the use proportion of the queue depth is lower than a second threshold proportion, so as to reduce the access speed of the solid-state drive.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: March 1, 2022
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Hung-Cheng Chen, Tse-Hsien Liao
  • Patent number: 11226863
    Abstract: A solid-state disk and a startup method are provided. The solid-state disk includes a control circuit, a firmware switching circuit, a first firmware storage unit, and a second firmware storage unit. The firmware switching circuit is coupled to the control circuit. The first firmware storage unit is coupled to the firmware switching circuit and stores a first firmware. The second firmware storage unit is coupled to the firmware switching circuit and stores a second firmware. The control circuit reads the first firmware storage unit or the second firmware storage unit according to whether the firmware switching circuit is triggered so as to startup according to the first firmware or the second firmware.
    Type: Grant
    Filed: December 13, 2020
    Date of Patent: January 18, 2022
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Hung-Cheng Chen, Tse-Hsien Liao
  • Publication number: 20210377874
    Abstract: A control method of a multi-antenna module includes the following. Antennas generating signals in at least a first frequency band and a second frequency band are provided. The antennas are divided into a first group and a second group by detecting performance of the antennas in the first frequency band and the second frequency band. Antennas of the first group have better performance in the first frequency band than in the second frequency band, and antennas of the second group are antennas other than the antennas of the first group. The number of the antennas of each of the first group and the second group is at least greater than or equal to 2. The first group is instructed to generate the signals in the first frequency band, and the second group is instructed to generate the signals in the second frequency band.
    Type: Application
    Filed: March 15, 2021
    Publication date: December 2, 2021
    Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.
    Inventors: Ching-Hsun Huang, Tse-Hsien Liao
  • Publication number: 20210373621
    Abstract: A stacked computer system includes a main machine module and expansion modules detachably stacked with each other. Each of the expansion modules is electrically connected to the main machine module. Each of the main machine module and the expansion modules includes a first connector located at an upper position and a second connector located at a lower position. In any two of the main machine module and the expansion modules adjacent to each other, the first connector of a lower one is connected to the second connector of the other one. Each of the first connector and the second connector includes at least two of a data transmission control interface, a power supply interface, a display signal transmission interface and a detection interface.
    Type: Application
    Filed: March 8, 2021
    Publication date: December 2, 2021
    Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.
    Inventors: Ching-Hsun Huang, Tse-Hsien Liao, Chin-Hui Chen, Erh-Chia Joung, Yuan-Liang Chen, Chun-Chien Lee, Po-Jen Shih
  • Publication number: 20210376447
    Abstract: A data processing system includes a display device, a proximity sensor, a wireless data processing apparatus, and an external antenna. The display device and the wireless data processing apparatus are connected. The display device is equipped with an internal antenna indirectly connected to a wireless communication module of the wireless data processing apparatus. The external antenna is electrically connected to the wireless communication module. A data processing circuit of the wireless data processing apparatus normally controls the wireless communication module to set signal transmission strengths of the antennas by using a first antenna control mode. When the proximity sensor detects an object located close to proximity sensor, the data processing circuit controls the wireless communication module to set the signal transmission strengths by using a second antenna control mode that includes at least decreasing the signal transmission strength of the internal antenna.
    Type: Application
    Filed: March 24, 2021
    Publication date: December 2, 2021
    Inventors: Ching-Hsun Huang, Tse-Hsien Liao
  • Publication number: 20210377869
    Abstract: A thermal management method is applicable to a wireless communication apparatus. The wireless communication apparatus includes at least a wireless communication module, a heat source set, a thermally conductive assembly, a heat-dissipating fin assembly, and a cooling fan. The thermally conductive assembly is connected to the wireless communication module and the heat source set. The heat-dissipating fin assembly is connected to the thermally conductive assembly and arranged corresponding to the heat source set or the wireless communication module. The cooling fan normally operates at a first rotational speed for cooling to the heat-dissipating fin assembly. Upon the raising of a temperature value of the wireless communication apparatus, the method is to raise the first rotational speed to a second rotational speed, switch down the power consumption of the heat source set, and execute an event trigger, so as to maintain the temperature value within a proper temperature range.
    Type: Application
    Filed: March 24, 2021
    Publication date: December 2, 2021
    Inventors: Ching-Hsun Huang, Tse-Hsien Liao, Po-Jen Shih
  • Patent number: 11157048
    Abstract: A memory module with a screen includes a memory substrate, a power conversion module, a screen control module, and a screen. The memory substrate includes a plurality of memory components and a connection interface. The power conversion module is disposed on the memory substrate and electrically connected to the connection interface. The screen control module is disposed on the memory substrate and electrically connected to the connection interface and the power conversion module. The screen is disposed on the memory substrate, and the screen is electrically connected to the power conversion module and the screen control module to receive a voltage output from the power conversion module and a display signal output from the screen control module. A motherboard module including a memory module with a screen is also provided.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: October 26, 2021
    Assignee: GAGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Hung-Cheng Chen, Tse-Hsien Liao, Chun-Chien Lee, Chen-Te Hsu
  • Publication number: 20210303402
    Abstract: A solid-state disk and a startup method are provided. The solid-state disk includes a control circuit, a firmware switching circuit, a first firmware storage unit, and a second firmware storage unit. The firmware switching circuit is coupled to the control circuit. The first firmware storage unit is coupled to the firmware switching circuit and stores a first firmware. The second firmware storage unit is coupled to the firmware switching circuit and stores a second firmware. The control circuit reads the first firmware storage unit or the second firmware storage unit according to whether the firmware switching circuit is triggered so as to startup according to the first firmware or the second firmware.
    Type: Application
    Filed: December 13, 2020
    Publication date: September 30, 2021
    Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.
    Inventors: Hung-Cheng Chen, Tse-Hsien Liao
  • Patent number: 11134553
    Abstract: A lighting memory device and a memory module are provided. A lighting control circuit receives at least one lighting mode selection signal through lighting mode control pins and controls luminous characteristics of a plurality of light sources according to a lighting control mode corresponding to the lighting mode selection signal.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: September 28, 2021
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Hung-Cheng Chen, Tse-Hsien Liao
  • Publication number: 20210274640
    Abstract: A heat dissipation device includes a heat conductor. The heat conductor includes a heat dissipation side and a heat absorption side opposite to each other. The heat absorption side is formed by at least two contact planes. The at least two contact planes are arranged in parallel to each other, and a height difference exists between the at least two contact planes.
    Type: Application
    Filed: December 7, 2020
    Publication date: September 2, 2021
    Inventors: Hung-Cheng Chen, Tse-Hsien Liao
  • Patent number: 10869384
    Abstract: A circuit board heat dissipation assembly includes a circuit board, a heat sink, a metal back plate, a heat pipe, and a pressing member. The circuit board has a front side and a rear side, and the front side has at least one heat generating area. The heat sink is disposed in the heat generating area. The metal back plate is disposed at a spacing from the rear side of the circuit board. The heat pipe has a first end, a bend segment, and a second end. The first end is connected to the heat sink. The second end is in contact with the metal back plate. The bend segment connects the first end and the second end at a side edge of the circuit board. The pressing member is fixed on the metal back plate and presses the second end onto the metal back plate.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: December 15, 2020
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Hung-Cheng Chen, Tse-Hsien Liao
  • Publication number: 20200383191
    Abstract: A lighting memory device and a memory module are provided. A lighting control circuit receives at least one lighting mode selection signal through lighting mode control pins and controls luminous characteristics of a plurality of light sources according to a lighting control mode corresponding to the lighting mode selection signal.
    Type: Application
    Filed: April 23, 2020
    Publication date: December 3, 2020
    Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.
    Inventors: Hung-Cheng Chen, Tse-Hsien Liao
  • Publication number: 20200356279
    Abstract: A solid-state drive and a performance optimization method for the solid-state drive are provided. The performance optimization method for the solid-state drive includes the following steps: detecting a queue depth of the solid-state drive to determine a use proportion of the queue depth; determining whether an access speed of the solid-state drive is raisable when the use proportion of the queue depth is higher than a first threshold proportion, so as to raise the access speed of the solid-state drive; and determining whether the access speed of the solid-state drive is reduceable when the use proportion of the queue depth is lower than a second threshold proportion, so as to reduce the access speed of the solid-state drive.
    Type: Application
    Filed: April 29, 2020
    Publication date: November 12, 2020
    Applicant: GIGA-BYTE TECHNOLOGY CO.,LTD.
    Inventors: Hung-Cheng Chen, Tse-Hsien Liao
  • Patent number: 10827645
    Abstract: A fan expansion card includes a first circuit board and at least one first fan. The first circuit board has at least one through-hole. The first circuit board includes a first connection port having a PCI-E interface. Each of the first fans is disposed at a position on the first circuit board corresponding to the through-hole. The first fan is electrically connected to the first circuit board, wherein an airflow generated by each of the first fans passes through the corresponding through-hole. A motherboard module having the above fan expansion card is further provided.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: November 3, 2020
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Hung-Cheng Chen, Tse-Hsien Liao, Chun-Chien Lee, Chih-Hua Ke
  • Publication number: 20200296819
    Abstract: A circuit board heat dissipation assembly includes a circuit board, a heat sink, a metal back plate, a heat pipe, and a pressing member. The circuit board has a front side and a rear side, and the front side has at least one heat generating area. The heat sink is disposed in the heat generating area. The metal back plate is disposed at a spacing from the rear side of the circuit board. The heat pipe has a first end, a bend segment, and a second end. The first end is connected to the heat sink. The second end is in contact with the metal back plate. The bend segment connects the first end and the second end at a side edge of the circuit board. The pressing member is fixed on the metal back plate and presses the second end onto the metal back plate.
    Type: Application
    Filed: March 5, 2020
    Publication date: September 17, 2020
    Inventors: Hung-Cheng Chen, Tse-Hsien Liao