Patents by Inventor Tsjerk Hoekstra
Tsjerk Hoekstra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10455309Abstract: A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and either a side surface (10, 12) of the transducer package or a non-mating surface (29) of the cap element (23).Type: GrantFiled: December 4, 2015Date of Patent: October 22, 2019Assignee: Cirrus Logic, Inc.Inventors: Tsjerk Hoekstra, David Talmage Patten
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Patent number: 10405102Abstract: A MEMS transducer package is provided having a semiconductor die portion with a thickness bounded by a first surface and an opposite second surface. The package further has a transducer element incorporated in the second surface and a die back volume that extends through the thickness of the semiconductor die portion between the first surface and the transducer element. The package is completed by a cap portion that abuts the semiconductor die portion at the first surface.Type: GrantFiled: December 4, 2015Date of Patent: September 3, 2019Assignee: Cirrus Logic, Inc.Inventor: Tsjerk Hoekstra
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Patent number: 10334339Abstract: A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and a side surface (10, 12) of the transducer package.Type: GrantFiled: December 4, 2015Date of Patent: June 25, 2019Assignee: Cirrus Logic, Inc.Inventors: John Laurence Pennock, Tsjerk Hoekstra, David Talmage Patten
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Patent number: 10123129Abstract: This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic shock. The application describes a MEMS transducer having a flexible membrane (101) supported relative to a first surface of a substrate (105) which has one or more cavities therein, e.g. to provide an acoustic volume. A stop structure (401, 402) is positioned so as to be contactable by the membrane when deflected so as to limit the amount of deflection of the membrane. The stop structure defines one or more openings to the one or more substrate cavities and comprises at least one narrow support element (401, 402) within or between said one or more openings. The stop structure thus limits the amount of membrane deflection, thus reducing the stress experienced at the edges and prevents the membrane from contacting a sharp edge of a substrate cavity.Type: GrantFiled: January 4, 2017Date of Patent: November 6, 2018Assignee: Cirrus Logic, Inc.Inventors: Tsjerk Hoekstra, Mark Hesketh
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Patent number: 9994440Abstract: The application describes improvements to (MEMS) transducers (100) having a flexible membrane (301) with a membrane electrode (302), especially where the membrane is crystalline or polycrystalline and the membrane electrode is metal or a metal alloy. Such transducers may typically include a back-plate having at least one back-plate layer (304) coupled to a back-plate electrode (303), with a plurality of holes (314) in the back-plate electrode corresponding to a plurality back-plate holes (312) through the back-plate. In embodiments of the invention the membrane electrode has at least one opening (313) in the membrane electrode wherein, at least part of the area of the opening corresponds to the area of at least one back-plate hole, in a direction normal to the membrane, and there is no hole in the flexible membrane at said opening in the membrane electrode. There may be a plurality of such openings. The openings effectively allow a reduction in the amount of membrane electrode material, e.g.Type: GrantFiled: June 30, 2014Date of Patent: June 12, 2018Assignee: Cirrus Logic, Inc.Inventors: Colin Robert Jenkins, Tsjerk Hoekstra, Scott Cargill
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Publication number: 20180044167Abstract: The application describes improvements to (MEMS) transducers (100) having a flexible membrane (301) with a membrane electrode (302), especially where the membrane is crystalline or polycrystalline and the membrane electrode is metal or a metal alloy. Such transducers may typically include a back-plate having at least one back-plate layer (304) coupled to a back-plate electrode (303), with a plurality of holes (314) in the back-plate electrode corresponding to a plurality back-plate holes (312) through the back-plate. In embodiments of the invention the membrane electrode has at least one opening (313) in the membrane electrode wherein, at least part of the area of the opening corresponds to the area of at least one back-plate hole, in a direction normal to the membrane, and there is no hole in the flexible membrane at said opening in the membrane electrode. There may be a plurality of such openings. The openings effectively allow a reduction in the amount of membrane electrode material, e.g.Type: ApplicationFiled: October 24, 2017Publication date: February 15, 2018Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Colin Robert JENKINS, Tsjerk HOEKSTRA, Scott CARGILL
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Publication number: 20180035190Abstract: This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic shock. The application describes a MEMS transducer (400) having at least one membrane layer (101) supported so as to define a flexible membrane. A strengthening layer (401; 701) is mechanically coupled to the membrane layer and is disposed around the majority of a peripheral area of the flexible membrane but does not extend over the whole flexible membrane. The strengthening layer, which in some embodiments may be formed from the same material as the membrane electrode (102) being disposed in the peripheral area helps reduce stress in membrane at locations that otherwise may be highly stressed in acoustic shock situations. The membrane may be supported over a substrate cavity and the strengthening layer may be provided in an area of the membrane that could make contact with the edge (202) of the substrate cavity.Type: ApplicationFiled: October 11, 2017Publication date: February 1, 2018Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Tsjerk HOEKSTRA, Colin Robert JENKINS
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Publication number: 20170374441Abstract: A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and either a side surface (10, 12) of the transducer package or a non-mating surface (29) of the cap element (23).Type: ApplicationFiled: December 4, 2015Publication date: December 28, 2017Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Tsjerk HOEKSTRA, David Talmage PATTEN
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Publication number: 20170374473Abstract: A method of fabricating a micro-electrical-mechanical system (MEMS) transducer chip scale package. The method comprising: providing (101) a front side pre-fabricated semiconductor die wafer (1) comprising a plurality of individual die that each comprise at least a MEMS transducer. And back etching (104) the semiconductor die wafer (1) at the back side (4) of the semiconductor die wafer (1) by etching an acoustic die channel (5) through each respective die of the plurality of die and etching a die back volume (6) into each respective die of the plurality of die. The semiconductor die wafer (1) is capped with a cap wafer (16) such that a wafer level packaged MEMS transducer wafer is provided containing multiple MEMS transducer chip scale packages.Type: ApplicationFiled: December 4, 2015Publication date: December 28, 2017Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Tsjerk HOEKSTRA, David Talmage PATTEN
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Publication number: 20170374474Abstract: A MEMS transducer package (1) is provide having a semiconductor die portion (3) with a thickness bounded by a first surface (9) and an opposite second surface (11). The package further has a transducer element (13) incorporated in the second surface (11) and a die back volume (7) that extends through the thickness of the semiconductor die portion (3) between the first surface (9) and the transducer element (13). The package is completed by a cap portion (23) that abuts the semiconductor die portion (3) at the first surface (9).Type: ApplicationFiled: December 4, 2015Publication date: December 28, 2017Applicant: Cirrus Logic International Semiconductor Ltd.Inventor: Tsjerk HOEKSTRA
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Publication number: 20170374442Abstract: A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and a side surface (10, 12) of the transducer package.Type: ApplicationFiled: December 4, 2015Publication date: December 28, 2017Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: John Laurence PENNOCK, Tsjerk HOEKSTRA, David Talmage PATTEN
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Patent number: 9820025Abstract: This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic shock. The application describes a MEMS transducer (400) having at least one membrane layer (101) supported so as to define a flexible membrane. A strengthening layer (401; 701) is mechanically coupled to the membrane layer and is disposed around the majority of a peripheral area of the flexible membrane but does not extend over the whole flexible membrane. The strengthening layer, which in some embodiments may be formed from the same material as the membrane electrode (102) being disposed in the peripheral area helps reduce stress in membrane at locations that otherwise may be highly stressed in acoustic shock situations. The membrane may be supported over a substrate cavity and the strengthening layer may be provided in an area of the membrane that could make contact with the edge (202) of the substrate cavity.Type: GrantFiled: September 19, 2013Date of Patent: November 14, 2017Assignee: Cirrus Logic, Inc.Inventors: Tsjerk Hoekstra, Colin Robert Jenkins
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Publication number: 20170295434Abstract: This application describes methods and apparatus relating to packaging of MEMS transducers and to MEMS transducer packages. The application describes a MEMS transducer package (300) having a first integrated circuit die (200) which has an integrated MEMS transducer (202) and integrated electronic circuitry (203) for operation of the MEMS transducer. The package is arranged such that the footprint of the MEMS transducer package is substantially the same size as the footprint of the integrated circuit die. At least part of the first integrated circuit die (200) may form a sidewall of the package. The package may be formed by a first package cover (302) which overlies the MEMS transducer and a second package cover (301) on the other side of the first integrated circuit die.Type: ApplicationFiled: June 27, 2017Publication date: October 12, 2017Applicant: Cirrus Logic International Semiconductor Ltd.Inventor: Tsjerk HOEKSTRA
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Publication number: 20170121173Abstract: This application describes methods and apparatus relating to packaging of MEMS transducers and to MEMS transducer packages. The application describes a MEMS transducer package (300) having a first integrated circuit die (200) which has an integrated MEMS transducer (202) and integrated electronic circuitry (203) for operation of the MEMS transducer. The package is arranged such that the footprint of the MEMS transducer package is substantially the same size as the footprint of the integrated circuit die. At least part of the first integrated circuit die (200) may form a sidewall of the package. The package may be formed by a first package cover (302) which overlies the MEMS transducer and a second package cover (301) on the other side of the first integrated circuit die.Type: ApplicationFiled: June 9, 2015Publication date: May 4, 2017Applicant: Cirrus Logic International Semiconductor Ltd.Inventor: Tsjerk HOEKSTRA
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Publication number: 20170118561Abstract: This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic shock. The application describes a MEMS transducer having a flexible membrane (101) supported relative to a first surface of a substrate (105) which has one or more cavities therein, e.g. to provide an acoustic volume. A stop structure (401, 402) is positioned so as to be contactable by the membrane when deflected so as to limit the amount of deflection of the membrane. The stop structure defines one or more openings to the one or more substrate cavities and comprises at least one narrow support element (401, 402) within or between said one or more openings. The stop structure thus limits the amount of membrane deflection, thus reducing the stress experienced at the edges and prevents the membrane from contacting a sharp edge of a substrate cavity.Type: ApplicationFiled: January 4, 2017Publication date: April 27, 2017Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Tsjerk HOEKSTRA, Mark HESKETH
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Patent number: 9584903Abstract: This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic shock. The application describes a MEMS transducer having a flexible membrane (101) supported relative to a first surface of a substrate (105) which has one or more cavities therein, e.g. to provide an acoustic volume. A stop structure (401, 402) is positioned so as to be contactable by the membrane when deflected so as to limit the amount of deflection of the membrane. The stop structure defines one or more openings to the one or more substrate cavities and comprises at least one narrow support element (401, 402) within or between said one or more openings. The stop structure thus limits the amount of membrane deflection, thus reducing the stress experienced at the edges and prevents the membrane from contacting a sharp edge of a substrate cavity.Type: GrantFiled: September 19, 2013Date of Patent: February 28, 2017Assignee: Cirrus Logic, Inc.Inventors: Tsjerk Hoekstra, Mark Hesketh
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Publication number: 20160167946Abstract: The application describes improvements to (MEMS) transducers (100) having a flexible membrane (301) with a membrane electrode (302), especially where the membrane is crystalline or polycrystalline and the membrane electrode is metal or a metal alloy. Such transducers may typically include a back-plate having at least one back-plate layer (304) coupled to a back-plate electrode (303), with a plurality of holes (314) in the back-plate electrode corresponding to a plurality back-plate holes (312) through the back-plate. In embodiments of the invention the membrane electrode has at least one opening (313) in the membrane electrode wherein, at least part of the area of the opening corresponds to the area of at least one back-plate hole, in a direction normal to the membrane, and there is no hole in the flexible membrane at said opening in the membrane electrode. There may be a plurality of such openings. The openings effectively allow a reduction in the amount of membrane electrode material, e.g.Type: ApplicationFiled: June 30, 2014Publication date: June 16, 2016Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Colin Robert JENKINS, Tsjerk HOEKSTRA, Scott CARGILL
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Publication number: 20150256915Abstract: This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic shock. The application describes a MEMS transducer (400) having at least one membrane layer (101) supported so as to define a flexible membrane. A strengthening layer (401; 701) is mechanically coupled to the membrane layer and is disposed around the majority of a peripheral area of the flexible membrane but does not extend over the whole flexible membrane. The strengthening layer, which in some embodiments may be formed from the same material as the membrane electrode (102) being disposed in the peripheral area helps reduce stress in membrane at locations that otherwise may be highly stressed in acoustic shock situations. The membrane may be supported over a substrate cavity and the strengthening layer may be provided in an area of the membrane that could make contact with the edge (202) of the substrate cavity.Type: ApplicationFiled: September 19, 2013Publication date: September 10, 2015Inventors: Tsjerk Hoekstra, Colin Robert Jenkins
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Publication number: 20150256924Abstract: This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic shock. The application describes a MEMS transducer having a flexible membrane (101) supported relative to a first surface of a substrate (105) which has one or more cavities therein, e.g. to provide an acoustic volume. A stop structure (401, 402) is positioned so as to be contactable by the membrane when deflected so as to limit the amount of deflection of the membrane. The stop structure defines one or more openings to the one or more substrate cavities and comprises at least one narrow support element (401, 402) within or between said one or more openings. The stop structure thus limits the amount of membrane deflection, thus reducing the stress experienced at the edges and prevents the membrane from contacting a sharp edge of a substrate cavity.Type: ApplicationFiled: September 19, 2013Publication date: September 10, 2015Applicant: Cirrus Logic International (UK) Ltd.Inventors: Tsjerk Hoekstra, Mark Hesketh