Patents by Inventor Tsukasa Mukaida

Tsukasa Mukaida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DEPOSITION MASK PACKAGE AND DEPOSITION MASK PACKAGING METHOD
    Publication number: 20210362474
    Abstract: A deposition mask package according to the present embodiment includes a receiving portion, a lid portion that faces the receiving portion, a deposition mask that is arranged between the receiving portion and the lid portion and has an effective region in which a plurality of through-holes is formed. The receiving portion has a first opposing surface facing the lid portion and a concave portion provided on the first opposing surface. The concave portion is covered by a first flexible film. The effective region of the deposition mask is arranged on the concave portion with the first flexible film interposed therebetween.
    Type: Application
    Filed: August 4, 2021
    Publication date: November 25, 2021
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao Ikenaga, Takumi Oike, Tsukasa Mukaida, Takeru Watanabe
  • Deposition mask package and deposition mask packaging method
    Patent number: 11148397
    Abstract: A deposition mask package according to the present embodiment includes a receiving portion, a lid portion that faces the receiving portion, a deposition mask that is arranged between the receiving portion and the lid portion and has an effective region in which a plurality of through-holes is formed. The receiving portion has a first opposing surface facing the lid portion and a concave portion provided on the first opposing surface. The concave portion is covered by a first flexible film. The effective region of the deposition mask is arranged on the concave portion with the first flexible film interposed therebetween.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: October 19, 2021
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao Ikenaga, Takumi Oike, Tsukasa Mukaida, Takeru Watanabe
  • DEPOSITION MASK PACKAGE AND DEPOSITION MASK PACKAGING METHOD
    Publication number: 20190237349
    Abstract: A deposition mask package according to the present embodiment includes a receiving portion, a lid portion that faces the receiving portion, a deposition mask that is arranged between the receiving portion and the lid portion and has an effective region in which a plurality of through-holes is formed. The receiving portion has a first opposing surface facing the lid portion and a concave portion provided on the first opposing surface. The concave portion is covered by a first flexible film. The effective region of the deposition mask is arranged on the concave portion with the first flexible film interposed therebetween.
    Type: Application
    Filed: March 13, 2019
    Publication date: August 1, 2019
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Chikao Ikenaga, Takumi Oike, Tsukasa Mukaida, Takeru Watanabe