Patents by Inventor Tsutomu Mitani

Tsutomu Mitani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7859855
    Abstract: A module that can not only achieve the reduction in size and manufacturing cost but also be impervious to noise due to electromagnetic waves, and a mounted structure using the same are provided. A module (1) includes a substrate (12) and a plurality of semiconductor packages (11a, 11b), each including a semiconductor chip (10), mounted on the substrate (12). Each of the plurality of semiconductor packages (11a, 11b) includes a first radio communication element (16) for transmitting and receiving a signal between the semiconductor chips (10) in the plurality of semiconductor packages (11a, 11b) by radio communication, and the first radio communication element (16) is constituted independently of the semiconductor chip (10).
    Type: Grant
    Filed: January 4, 2010
    Date of Patent: December 28, 2010
    Assignee: Panasonic Corporation
    Inventors: Seiichi Nakatani, Tsutomu Mitani
  • Publication number: 20100133664
    Abstract: A module that can not only achieve the reduction in size and manufacturing cost but also be impervious to noise due to electromagnetic waves, and a mounted structure using the same are provided. A module (1) includes a substrate (12) and a plurality of semiconductor packages (11a, 11b), each including a semiconductor chip (10), mounted on the substrate (12). Each of the plurality of semiconductor packages (11a, 11b) includes a first radio communication element (16) for transmitting and receiving a signal between the semiconductor chips (10) in the plurality of semiconductor packages (11a, 11b) by radio communication, and the first radio communication element (16) is constituted independently of the semiconductor chip (10).
    Type: Application
    Filed: January 4, 2010
    Publication date: June 3, 2010
    Applicant: PANASONIC CORPORATION
    Inventors: Seiichi Nakatani, Tsutomu Mitani
  • Patent number: 7667974
    Abstract: A module that can not only achieve the reduction in size and manufacturing cost but also be impervious to noise due to electromagnetic waves, and a mounted structure using the same are provided. A module (1) includes a substrate (12) and a plurality of semiconductor packages (11a, 11b), each including a semiconductor chip (10), mounted on the substrate (12). Each of the plurality of semiconductor packages (11a, 11b) includes a first radio communication element (16) for transmitting and receiving a signal between the semiconductor chips (10) in the plurality of semiconductor packages (11a, 11b) by radio communication, and the first radio communication element (16) is constituted independently of the semiconductor chip (10).
    Type: Grant
    Filed: January 20, 2005
    Date of Patent: February 23, 2010
    Assignee: Panasonic Corporation
    Inventors: Seiichi Nakatani, Tsutomu Mitani
  • Publication number: 20090047470
    Abstract: The shock absorbing sheet has a first surface subjected to an impact load, and is formed of first shock absorbing material and second shock absorbing material. The second shock absorbing material has a compressive elastic modulus larger than that of the first shock absorbing material and arranged in the first shock absorbing material. The second shock absorbing material is arranged so as to extend in the direction substantially orthogonal to the first surface. The cross-sectional area of the first shock absorbing material is equal to or larger than that of the second shock absorbing material in a cross-sectional area parallel to the first surface.
    Type: Application
    Filed: June 5, 2006
    Publication date: February 19, 2009
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Kuwajima, Tsutomu Mitani
  • Publication number: 20080048307
    Abstract: A module that can not only achieve the reduction in size and manufacturing cost but also be impervious to noise due to electromagnetic waves, and a mounted structure using the same are provided. A module (1) includes a substrate (12) and a plurality of semiconductor packages (11a, 11b), each including a semiconductor chip (10), mounted on the substrate (12). Each of the plurality of semiconductor packages (11a, 11b) includes a first radio communication element (16) for transmitting and receiving a signal between the semiconductor chips (10) in the plurality of semiconductor packages (11a, 11b) by radio communication, and the first radio communication element (16) is constituted independently of the semiconductor chip (10).
    Type: Application
    Filed: January 20, 2005
    Publication date: February 28, 2008
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiichi Nakatani, Tsutomu Mitani
  • Patent number: 7151306
    Abstract: A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element. Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 ?m or more and to 10.0 ?m or less and preferably to 1.0 ?m or more and to 5.0 ?m or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: December 19, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takashi Kitae, Tsutomu Mitani, Yukihiro Ishimaru, Hiroaki Takezawa
  • Publication number: 20050098338
    Abstract: A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element. Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 ?m or more and to 10.0 ?m or less and preferably to 1.0 ?m or more and to 5.0 ?m or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
    Type: Application
    Filed: December 13, 2004
    Publication date: May 12, 2005
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takashi Kitae, Tsutomu Mitani, Yukihiro Ishimaru, Hiroaki Takezawa
  • Patent number: 6853074
    Abstract: A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element. Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 ?m or more and to 10.0 ?m or less and preferably to 1.0 ?m or more and to 5.0 ?m or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
    Type: Grant
    Filed: December 27, 2000
    Date of Patent: February 8, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takashi Kitae, Tsutomu Mitani, Yukihiro Ishimaru, Hiroaki Takezawa
  • Patent number: 6814893
    Abstract: A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: November 9, 2004
    Assignee: Matsushita Electric Industiral Co., Ltd.
    Inventors: Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Tsutomu Mitani, Tousaku Nishiyama
  • Publication number: 20040212075
    Abstract: A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.
    Type: Application
    Filed: May 20, 2004
    Publication date: October 28, 2004
    Inventors: Tsukasa Shiraishi, Tsutomu Mitani, Kazuyoshi Amami, Yoshihiro Bessho
  • Patent number: 6756663
    Abstract: A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.
    Type: Grant
    Filed: January 8, 2003
    Date of Patent: June 29, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsukasa Shiraishi, Tsutomu Mitani, Kazuyoshi Amami, Yoshihiro Bessho
  • Patent number: 6749774
    Abstract: A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: June 15, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani
  • Patent number: 6749889
    Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: June 15, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Tsutomu Mitani, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda
  • Patent number: 6675474
    Abstract: An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100° C. to 300° C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: January 13, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsutomu Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki
  • Publication number: 20040005459
    Abstract: A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
    Type: Application
    Filed: July 7, 2003
    Publication date: January 8, 2004
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO.,LTD.
    Inventors: Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Tsutomu Mitani, Tousaku Nishiyama
  • Patent number: 6666994
    Abstract: The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: December 23, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama
  • Publication number: 20030207073
    Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
    Type: Application
    Filed: April 7, 2003
    Publication date: November 6, 2003
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hiroaki Takezawa, Tsutomu Mitani, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda
  • Patent number: 6620345
    Abstract: A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: September 16, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Tsutomu Mitani, Tousaku Nishiyama
  • Publication number: 20030127632
    Abstract: A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.
    Type: Application
    Filed: December 3, 2002
    Publication date: July 10, 2003
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani
  • Publication number: 20030116756
    Abstract: The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.
    Type: Application
    Filed: December 3, 2002
    Publication date: June 26, 2003
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama