Patents by Inventor Tsutomu Mitani

Tsutomu Mitani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6569512
    Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: May 27, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Tsutomu Mitani, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda
  • Publication number: 20030094685
    Abstract: A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.
    Type: Application
    Filed: January 8, 2003
    Publication date: May 22, 2003
    Inventors: Tsukasa Shiraishi, Tsutomu Mitani, Kazuyoshi Amami, Yoshihiro Bessho
  • Patent number: 6524721
    Abstract: The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.
    Type: Grant
    Filed: July 3, 2001
    Date of Patent: February 25, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama
  • Patent number: 6525414
    Abstract: A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: February 25, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsukasa Shiraishi, Tsutomu Mitani, Kazuyoshi Amami, Yoshihiro Bessho
  • Patent number: 6521144
    Abstract: A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group; an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: February 18, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani
  • Patent number: 6512183
    Abstract: An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100° C. to 300° C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: January 28, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsutomu Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki
  • Patent number: 6510059
    Abstract: In mounting an electronic component using a conductive resin, a conductive resin containing a specific diluent component is used as the conductive resin, or a specific diluent component is applied to the conductive resin before being cured. This allows connection in a portion where an electrode (5) of an electronic component (4) and an electrode (2) of a circuit substrate (1) are opposed to each other to be provided via a resin (3a) containing a conductive filler as a main component, and allows connection at a lower surface of the electronic component (4) and connection in vicinities of the electrode (5) to be provided via a resin (3b, 3c) containing a binder resin as a main component that has oozed out of the conductive resin. The resin (3b, 3c) containing the binder resin as the main component increases junction strength.
    Type: Grant
    Filed: July 18, 2001
    Date of Patent: January 21, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsutomu Mitani, Yukihiro Ishimaru, Takashi Kitae, Hiroaki Takezawa
  • Publication number: 20020185306
    Abstract: In mounting an electronic component using a conductive resin, a conductive resin containing a specific diluent component is used as the conductive resin, or a specific diluent component is applied to the conductive resin before being cured. This allows connection in a portion where an electrode (5) of an electronic component (4) and an electrode (2) of a circuit substrate (1) are opposed to each other to be provided via a resin (3a) containing a conductive filler as a main component, and allows connection at a lower surface of the electronic component (4) and connection in vicinities of the electrode (5) to be provided via a resin (3b, 3c) containing a binder resin as a main component that has oozed out of the conductive resin. The resin (3b, 3c) containing the binder resin as the main component increases junction strength.
    Type: Application
    Filed: July 18, 2001
    Publication date: December 12, 2002
    Inventors: Tsutomu Mitani, Yukihiro Ishimaru, Takashi Kitae, Hiroaki Takezawa
  • Publication number: 20020158232
    Abstract: A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at least a part of the conductive filler has protrusions. A dendrite metal filler is especially preferred. When this adhesive is compressed, the resin component is squeezed out, while the conductive filler component remains inside. As a result, the concentration of the conductive filler component is raised inside, and this is useful in connecting the electrodes by scratching the surfaces of the electrodes. No solder is required in forming a conductive adhesive 3 on a substrate electrode 2 of a circuit substrate 1 and also for packaging an electronic element 4. Provided also are a package of an electronic element using the conductive adhesive with improved initial and long-term reliability, and a method of packaging the same.
    Type: Application
    Filed: March 26, 2002
    Publication date: October 31, 2002
    Inventors: Tsutomu Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki
  • Publication number: 20020062988
    Abstract: An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100° C. to 300° C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board.
    Type: Application
    Filed: June 27, 2001
    Publication date: May 30, 2002
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsutomu Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki
  • Publication number: 20020050643
    Abstract: A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
    Type: Application
    Filed: September 7, 2001
    Publication date: May 2, 2002
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hiroaki Takezawa, Yukihiro Ishimaru, Takashi Kitae, Tsutomu Mitani, Tousaku Nishiyama
  • Patent number: 6376051
    Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
    Type: Grant
    Filed: March 7, 2000
    Date of Patent: April 23, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Tsutomu Mitani, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda
  • Publication number: 20020043652
    Abstract: The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.
    Type: Application
    Filed: July 3, 2001
    Publication date: April 18, 2002
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama
  • Publication number: 20020034620
    Abstract: In a mounting structure including a first electrode and a second electrode electrically connected to each other via a conductive adhesive, the periphery of an adhesion portion between at least one of the electrodes and the conductive adhesive is covered with an electrical insulating layer, whereby the adhesion portion is reinforced from the periphery. The electrical insulating layer may be formed by dissolving a binder resin component of the conductive adhesive in a solvent. This increases the concentration of a conductive filler in the conductive adhesive, so that the conductivity of the adhesion portion is also enhanced.
    Type: Application
    Filed: September 27, 2001
    Publication date: March 21, 2002
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Takezawa, Tsutomu Mitani, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda
  • Publication number: 20010015424
    Abstract: A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.
    Type: Application
    Filed: December 29, 2000
    Publication date: August 23, 2001
    Applicant: Matsushita Electric Industrial Co. Ltd.
    Inventors: Hiroaki Takezawa, Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani
  • Publication number: 20010005053
    Abstract: A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element.
    Type: Application
    Filed: December 27, 2000
    Publication date: June 28, 2001
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takashi Kitae, Tsutomu Mitani, Yukihiro Ishimaru, Hiroaki Takezawa
  • Publication number: 20010002727
    Abstract: A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.
    Type: Application
    Filed: November 29, 2000
    Publication date: June 7, 2001
    Inventors: Tsukasa Shiraishi, Tsutomu Mitani, Kazuyoshi Amami, Yoshihiro Bessho
  • Patent number: 6042953
    Abstract: A bi-layer bump comprises a base layer composed of sprayed aluminum thick film having a thickness of about 20 .mu.m formed to cover the periphery of the passivation film formed on each pad electrode, a surface layer composed of sprayed copper thick film having a thickness of about 30 .mu.m formed on the base layer. According to the above-mentioned structure, a substrate on which bumps are formed which has an excellent electric property and connecting reliability, wherein an interlayer insulating layer, an active layer and a multi-layer wiring can be provided under the pad electrode can be obtained.
    Type: Grant
    Filed: March 18, 1997
    Date of Patent: March 28, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazufumi Yamaguchi, Tsutomu Mitani, Mitsuo Asabe
  • Patent number: 5914274
    Abstract: A bi-layer bump comprises a base layer composed of sprayed aluminum thick film having a thickness of about 20 .mu.m formed to cover the periphery of the passivation film formed on each pad electrode, a surface layer composed of sprayed copper thick film having a thickness of about 30 .mu.m formed on the base layer. According to the above-mentioned structure, a substrate on which bumps are formed which has an excellent electric property and connecting reliability, wherein an interlayer insulating layer, an active layer and a multi-layer wiring can be provided under the pad electrode can be obtained.
    Type: Grant
    Filed: April 1, 1998
    Date of Patent: June 22, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazufumi Yamaguchi, Tsutomu Mitani, Mitsuo Asabe
  • Patent number: 5674573
    Abstract: A method for synthesizing a hard diamond-like thin film on a rotating substrate, the method comprising the steps of: generating plasma of gas containing hydrocarbon gas, in a first vacuum vessel having an inflow portion and an outflow portion for the gas such that the substrate is provided in a second vacuum vessel maintained at a pressure lower, by a factor of 10 or more, than that of the first vacuum vessel due to flow resistance of the gas between the outflow portion and the substrate; and irradiating the plasma onto the substrate by pressure difference between the first vacuum vessel and the second vacuum vessel while an AC power is being applied to a mesh-shaped internal electrode provided in the first vacuum vessel.
    Type: Grant
    Filed: December 29, 1993
    Date of Patent: October 7, 1997
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsutomu Mitani, Hirokazu Nakaue, Hideo Kurokawa