Patents by Inventor Tsutomu Shoki

Tsutomu Shoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9494851
    Abstract: Disclosed is a mask blank substrate for use in lithography, wherein the main surface on which the transfer pattern of the substrate is formed has a root mean square roughness (Rms) of not more than 0.15 nm obtained by measuring an area of 1 ?m×1 ?m with an atomic force microscope, and has a power spectrum density of not more than 10 nm4 at a spatial frequency of not less than 1 ?m?1.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: November 15, 2016
    Assignee: HOYA CORPORATION
    Inventors: Toshihiko Orihara, Kazuhiro Hamamoto, Hirofumi Kozakai, Youichi Usui, Tsutomu Shoki, Junichi Horikawa
  • Patent number: 9488904
    Abstract: Provided is a mask blank glass substrate that has high surface smoothness, that is formed with a fiducial mark capable of improving the detection accuracy of a defect position or the like, and that enables reuse or recycling of a glass substrate included therein. An underlayer is formed on a main surface, on the side where a transfer pattern is to be formed, of a glass substrate for a mask blank. The underlayer serves to reduce surface roughness of the main surface of the glass substrate or to reduce defects of the main surface of the glass substrate. A surface of the underlayer is a precision-polished surface. A fiducial mark which provides a reference for a defect position in defect information is formed on the underlayer.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: November 8, 2016
    Assignee: HOYA CORPORATION
    Inventors: Toshihiko Orihara, Akihiro Kawahara, Tsutomu Shoki
  • Publication number: 20160282711
    Abstract: This invention provides a reflective mask blank capable of preventing peeling-off of a multilayer reflective film due to cleaning or the like in a mask manufacturing process or during mask use. The reflective mask blank includes a multilayer reflective film, a protective film, an absorber film, and a resist film formed in this order on a substrate. Assuming that a distance from the center of the substrate to an outer peripheral end of the multilayer reflective film is L(ML), that a distance from the center of the substrate to an outer peripheral end of the protective film is L(Cap), that a distance from the center of the substrate to an outer peripheral end of the absorber film is L(Abs), and that a distance from the center of the substrate to an outer peripheral end of the resist film is L(Res), L(Abs)>L(Res)>L(Cap)?L(ML) and the outer peripheral end of the resist film is located inward of an outer peripheral end of the substrate.
    Type: Application
    Filed: June 10, 2016
    Publication date: September 29, 2016
    Applicant: HOYA CORPORATION
    Inventors: Kazuhiro HAMAMOTO, Tatsuo ASAKAWA, Osamu MARUYAMA, Tsutomu SHOKI
  • Patent number: 9423685
    Abstract: Provided is a multilayer reflective film formed substrate formed with a fiducial mark for accurately managing coordinates of defects. A multilayer reflective film formed substrate is formed with a multilayer reflective film, which is adapted to reflect EUV light, on a substrate and a fiducial mark which serves as a reference for a defect position in defect information is formed on the multilayer reflective film. The fiducial mark includes a main mark for determining a reference point for the defect position and auxiliary marks arranged around the main mark. The main mark has a point-symmetrical shape and has a portion with a width of 200 nm or more and 10 ?m or less with respect to a scanning direction of an electron beam writing apparatus or defect inspection light.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: August 23, 2016
    Assignee: HOYA CORPORATION
    Inventors: Tsutomu Shoki, Kazuhiro Hamamoto
  • Publication number: 20160238925
    Abstract: A reflective mask blank capable of facilitating the discovery of contaminants, scratches and other critical defects by inhibiting the detection of pseudo defects attributable to surface roughness of a substrate or film in a defect inspection using a highly sensitive defect inspection apparatus. The reflective mask blank has a mask blank multilayer film comprising a multilayer reflective film, obtained by alternately laminating a high refractive index layer and a low refractive index layer, and an absorber film on a main surface of a mask blank substrate, wherein, in the relationship between bearing area (%) and bearing depth (nm) as measured with an atomic force microscope for a 1 ?m×1 ?m region of the surface of the reflective mask blank on which the mask blank multilayer film is formed, the surface of the reflective mask blank satisfies the relationship of (BA70?BA30)/(BD70?BD30)?60(%/nm) and maximum height (Rmax)?4.5 nm.
    Type: Application
    Filed: August 29, 2014
    Publication date: August 18, 2016
    Applicant: HOYA CORPORATION
    Inventors: Kazuhiro HAMAMOTO, Tatsuo ASAKAWA, Tsutomu SHOKI
  • Patent number: 9377679
    Abstract: This invention provides a reflective mask blank capable of preventing peeling-off of a multilayer reflective film due to cleaning or the like in a mask manufacturing process or during mask use. The reflective mask blank includes a multilayer reflective film, a protective film, an absorber film, and a resist film formed in this order on a substrate. Assuming that a distance from the center of the substrate to an outer peripheral end of the multilayer reflective film is L(ML), that a distance from the center of the substrate to an outer peripheral end of the protective film is L(Cap), that a distance from the center of the substrate to an outer peripheral end of the absorber film is L(Abs), and that a distance from the center of the substrate to an outer peripheral end of the resist film is L(Res), L(Abs)>L(Res)>L(Cap)?L(ML) and the outer peripheral end of the resist film is located inward of an outer peripheral end of the substrate.
    Type: Grant
    Filed: July 27, 2013
    Date of Patent: June 28, 2016
    Assignee: HOYA CORPORATION
    Inventors: Kazuhiro Hamamoto, Tatsuo Asakawa, Osamu Maruyama, Tsutomu Shoki
  • Publication number: 20160161837
    Abstract: Provided is a reflective mask blank capable of facilitating the discovery of contaminants, scratches and other critical defects by inhibiting the detection of pseudo defects attributable to surface roughness of a substrate or film in a defect inspection using a highly sensitive defect inspection apparatus. The reflective mask blank has a mask blank multilayer film comprising a multilayer reflective film, obtained by alternately laminating a high refractive index layer and a low refractive index layer, and an absorber film on a main surface of a mask blank substrate, wherein the root mean square roughness (Rms), obtained by measuring a 3 ?m×3 ?m region on the surface of the reflective mask blank on which the mask blank multilayer film is formed with an atomic force microscope, is not more than 0.5 nm and the power spectrum density at a spatial frequency of 1 ?m?1 to 10 ?m?1 is not more than 50 nm4.
    Type: Application
    Filed: August 29, 2014
    Publication date: June 9, 2016
    Applicant: HOYA CORPORATION
    Inventors: Kazuhiro HAMAMOTO, Tatsuo ASAKAWA, Tsutomu SHOKI
  • Patent number: 9348217
    Abstract: Disclosed is a mask blank substrate for use in lithography, wherein a main surface of the substrate satisfies a relational equation of (BA70?BA30)/(BD70?BD30)?350 (%/nm), and has a maximum height (Rmax)?1.2 nm in a relation between a bearing area (%) and a bearing depth (nm) obtained by measuring, with an atomic force microscope, an area of 1 ?m×1 ?m in the main surface on the side of the substrate where a transfer pattern is formed, wherein BA30 is defined as a bearing area of 30%, BA70 is defined as a bearing area of 70%, and BD70 and BD30 are defined to respectively represent bearing depths for the bearing area of 30% and the bearing area of 70%.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: May 24, 2016
    Assignee: HOYA CORPORATION
    Inventors: Kazuhiro Hamamoto, Toshihiko Orihara, Hirofumi Kozakai, Youichi Usui, Tsutomu Shoki, Junichi Horikawa
  • Patent number: 9323141
    Abstract: Disclosed is a method for producing a substrate with a multilayer reflective film for EUV lithography including a multilayer reflective film disposed on a principal surface of a substrate, the method including a multilayer reflective film formation step of forming the multilayer reflective film on the principal surface of the substrate in such a manner that the multilayer reflective film has a slope region in which the film thickness is decreased in a direction from the inside to the outside of the substrate on a peripheral portion of the principal surface, and a fiducial mark formation step of forming fiducial marks in the slope region by removing at least a portion of the multilayer reflective film, the fiducial marks serving as references for a defective location indicated by defect information with respect to the surface of the substrate with the multilayer reflective film.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: April 26, 2016
    Assignee: HOYA CORPORATION
    Inventors: Tsutomu Shoki, Kazuhiro Hamamoto
  • Publication number: 20160077423
    Abstract: Disclosed is a method for producing a substrate with a multilayer reflective film for EUV lithography including a multilayer reflective film disposed on a principal surface of a substrate, the method including a multilayer reflective film formation step of forming the multilayer reflective film on the principal surface of the substrate in such a manner that the multilayer reflective film has a slope region in which the film thickness is decreased in a direction from the inside to the outside of the substrate on a peripheral portion of the principal surface, and a fiducial mark formation step of forming fiducial marks in the slope region by removing at least a portion of the multilayer reflective film, the fiducial marks serving as references for a defective location indicated by defect information with respect to the surface of the substrate with the multilayer reflective film.
    Type: Application
    Filed: November 25, 2015
    Publication date: March 17, 2016
    Applicant: HOYA CORPORATION
    Inventors: Tsutomu SHOKI, Kazuhiro HAMAMOTO
  • Publication number: 20160041462
    Abstract: Provided is a mask blank glass substrate that has high surface smoothness, that is formed with a fiducial mark capable of improving the detection accuracy of a defect position or the like, and that enables reuse or recycling of a glass substrate included therein. An underlayer is formed on a main surface, on the side where a transfer pattern is to be formed, of a glass substrate for a mask blank. The underlayer serves to reduce surface roughness of the main surface of the glass substrate or to reduce defects of the main surface of the glass substrate. A surface of the underlayer is a precision-polished surface. A fiducial mark which provides a reference for a defect position in defect information is formed on the underlayer.
    Type: Application
    Filed: October 22, 2015
    Publication date: February 11, 2016
    Applicant: HOYA CORPORATION
    Inventors: Toshihiko ORIHARA, Akihiro Kawahara, Tsutomu Shoki
  • Publication number: 20160004153
    Abstract: A method of manufacturing a reflective mask blank comprising a multilayer reflective film formed on a substrate so as to reflect EUV light; and a laminated film formed on the multilayer reflective film. The method includes the steps of depositing the multilayer reflective film on the substrate to form a multilayer reflective film formed substrate; carrying out defect inspection for the multilayer reflective film formed substrate; depositing the laminated film on the multilayer reflective film of the multilayer reflective film formed substrate; forming a fiducial mark for an upper portion of the laminated film to thereby form a reflective mask blank comprising the fiducial mark, the fiducial mark serving as a reference for a defect position in defect information; and carrying out defect inspection of the reflective mask blank by using the fiducial mark as a reference.
    Type: Application
    Filed: February 20, 2014
    Publication date: January 7, 2016
    Applicant: HOYA CORPORATION
    Inventors: Tsutomu SHOKI, Kazuhiro HAMAMOTO, Yohei IKEBE
  • Patent number: 9229316
    Abstract: Disclosed is a method for producing a substrate with a multilayer reflective film for EUV lithography including a multilayer reflective film disposed on a principal surface of a substrate, the method including a multilayer reflective film formation step of forming the multilayer reflective film on the principal surface of the substrate in such a manner that the multilayer reflective film has a slope region in which the film thickness is decreased in a direction from the inside to the outside of the substrate on a peripheral portion of the principal surface, and a fiducial mark formation step of forming fiducial marks in the slope region by removing at least a portion of the multilayer reflective film, the fiducial marks serving as references for a defective location indicated by defect information with respect to the surface of the substrate with the multilayer reflective film.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: January 5, 2016
    Assignee: HOYA CORPORATION
    Inventors: Tsutomu Shoki, Kazuhiro Hamamoto
  • Patent number: 9195131
    Abstract: Provided is a mask blank glass substrate that has high surface smoothness, that is formed with a fiducial mark capable of improving the detection accuracy of a defect position or the like, and that enables reuse or recycling of a glass substrate included therein. An underlayer is formed on a main surface, on the side where a transfer pattern is to be formed, of a glass substrate for a mask blank. The underlayer serves to reduce surface roughness of the main surface of the glass substrate or to reduce defects of the main surface of the glass substrate. A surface of the underlayer is a precision-polished surface. A fiducial mark which provides a reference for a defect position in defect information is formed on the underlayer.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: November 24, 2015
    Assignee: HOYA CORPORATION
    Inventors: Toshihiko Orihara, Akihiro Kawahara, Tsutomu Shoki
  • Publication number: 20150331312
    Abstract: An object of the present invention is to provide a mask blank substrate and the like that enables critical defects to be reliably detected as a result of reducing the number of detected defects, including pseudo defects, even when using highly sensitive defect inspection apparatuses that use light of various wavelengths. The present invention relates to a mask blank substrate that is used in lithography, wherein the power spectral density at a spatial frequency of 1×10?2 ?m?1 to 1 ?m?1, obtained by measuring a 0.14 mm×0.1 mm region on a main surface of the mask blank substrate on the side of which a transfer pattern is formed at 640×480 pixels with a white-light interferometer, is not more than 4×106 nm4, and the power spectral density at a spatial frequency of not less than 1 ?m?1, obtained by measuring a 1 ?m×1 ?m region on the main surface with an atomic force microscope, is not more than 10 nm4.
    Type: Application
    Filed: December 27, 2013
    Publication date: November 19, 2015
    Applicant: HOYA CORPORATION
    Inventors: Kazuhiro HAMAMOTO, Toshihiko ORIHARA, Tsutomu SHOKI, Junichi HORIKAWA
  • Publication number: 20150301441
    Abstract: This invention provides a reflective mask blank capable of preventing peeling-off of a multilayer reflective film due to cleaning or the like in a mask manufacturing process or during mask use. The reflective mask blank includes a multilayer reflective film, a protective film, an absorber film, and a resist film formed in this order on a substrate. Assuming that a distance from the center of the substrate to an outer peripheral end of the multilayer reflective film is L(ML), that a distance from the center of the substrate to an outer peripheral end of the protective film is L(Cap), that a distance from the center of the substrate to an outer peripheral end of the absorber film is L(Abs), and that a distance from the center of the substrate to an outer peripheral end of the resist film is L(Res), L(Abs)>L(Res)>L(Cap)?L(ML) and the outer peripheral end of the resist film is located inward of an outer peripheral end of the substrate.
    Type: Application
    Filed: July 27, 2013
    Publication date: October 22, 2015
    Applicant: HOYA CORPORATION
    Inventors: Kazuhiro HAMAMOTO, Tatsuo ASAKAWA, Osamu MARUYAMA, Tsutomu SHOKI
  • Publication number: 20150205196
    Abstract: An object of the present invention is to provide a substrate with a multilayer reflective film that enables the number of detected pseudo defects, to be reduced even when using highly sensitive defect inspection apparatuses using light of various wavelengths, and in particular, is capable of achieving a level of smoothness required of substrates with a multilayer reflective film while reliably detecting critical defects as a result of reducing the number of detected pseudo defects, as well as a method of manufacturing the same.
    Type: Application
    Filed: September 24, 2013
    Publication date: July 23, 2015
    Applicant: HOYA CORPORATION
    Inventors: Toshihiko Orihara, Kazuhiro Hamamoto, Hirofumi Kozakai, Tsutomu Shoki, Junichi Horikawa
  • Publication number: 20150079501
    Abstract: Disclosed is a method for producing a substrate with a multilayer reflective film for EUV lithography including a multilayer reflective film disposed on a principal surface of a substrate, the method including a multilayer reflective film formation step of forming the multilayer reflective film on the principal surface of the substrate in such a manner that the multilayer reflective film has a slope region in which the film thickness is decreased in a direction from the inside to the outside of the substrate on a peripheral portion of the principal surface, and a fiducial mark formation step of forming fiducial marks in the slope region by removing at least a portion of the multilayer reflective film, the fiducial marks serving as references for a defective location indicated by defect information with respect to the surface of the substrate with the multilayer reflective film.
    Type: Application
    Filed: March 21, 2013
    Publication date: March 19, 2015
    Applicant: HOYA CORPORATION
    Inventors: Tsutomu Shoki, Kazuhiro Hamamoto
  • Publication number: 20150017574
    Abstract: Disclosed is a mask blank substrate for use in lithography, wherein the main surface on which the transfer pattern of the substrate is formed has a root mean square roughness (Rms) of not more than 0.15 nm obtained by measuring an area of 1 ?m×1 ?m with an atomic force microscope, and has a power spectrum density of not more than 10 nm4 at a spatial frequency of not less than 1 ?m?1.
    Type: Application
    Filed: March 28, 2013
    Publication date: January 15, 2015
    Applicant: HOYA CORPORATION
    Inventors: Toshihiko Orihara, Kazuhiro Hamamoto, Hirofumi Kozakai, Youichi Usui, Tsutomu Shoki, Junichi Horikawa
  • Publication number: 20140329174
    Abstract: Disclosed is a mask blank substrate for use in lithography, wherein a main surface of the substrate satisfies a relational equation of (BA70?BA30)/(BD70?BD30)?350 (%/nm), and has a maximum height (Rmax)?1.2 nm in a relation between a bearing area (%) and a bearing depth (nm) obtained by measuring, with an atomic force microscope, an area of 1 ?m×1 ?m in the main surface on the side of the substrate where a transfer pattern is formed, wherein BA30 is defined as a bearing area of 30%, BA70 is defined as a bearing area of 70%, and BD70 and BD30 are defined to respectively represent bearing depths for the bearing area of 30% and the bearing area of 70%.
    Type: Application
    Filed: March 28, 2013
    Publication date: November 6, 2014
    Applicant: HOYA CORPORATION
    Inventors: Kazuhiro Hamamoto, Toshihiko Orihara, Hirofumi Kozakai, Youichi Usui, Tsutomu Shoki, Junichi Horikawa