Patents by Inventor Tsutomu Tsuchiya

Tsutomu Tsuchiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11112731
    Abstract: A developer container includes a plurality of components combined together to form a space to store a developer. The plurality of components includes a first component and a second component. The developer container further includes a sealant to bond the first component and the second component, and a position regulator to regulate relative positions of the first component and the second component so as to maintain a distance between an adhesion portion of the first component and an adhesion portion of the second component.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: September 7, 2021
    Assignee: RICOH COMPANY, LTD.
    Inventors: Naohiro Kawashima, Yoshihiro Fujiwara, Yuki Oshikawa, Yuuki Tsuchiya, Ryusuke Mase, Tsutomu Iwata
  • Patent number: 10261004
    Abstract: The purpose of the present invention is to provide a determining device and a determining method to determine whether an inspected jet nozzle is defective by inspecting the jet nozzle for injecting a jet stream with long ground penetrating distance at a stage before installing in a construction site where a large diameter jet grouting method is used. To achieve this purpose, with this invention, in which a nozzle to be inspected is mounted onto an outlet port, a jet stream is ejected from a jet stream generating device, and measurement data measured by a pressure sensing unit when the jet stream impacts the pressure sensing unit is processed with a controlling device (for example, a computer), a nozzle to be inspected is determined to be a non-defective product if a first ratio is no less than a first prescribed value, a second ratio is no less than a second prescribed value, and a third ratio is no less than a third prescribed value.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: April 16, 2019
    Assignee: CHEMICAL GROUTING CO., LTD.
    Inventors: Tsutomu Tsuchiya, Masanori Kumekawa, Hiroyuki Abe
  • Patent number: 10221537
    Abstract: The purpose of the present invention is to provide an artificial ground freezing method having good coolant thermal efficiency without a gas-phase coolant being released into the ground or into the air.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: March 5, 2019
    Assignee: CHEMICAL GROUTING CO., LTD.
    Inventors: Yuichi Tachiwada, Tsutomu Tsuchiya, Takeru Ariizumi, Hiroshi Soma
  • Publication number: 20170350087
    Abstract: The purpose of the present invention is to provide an artificial ground freezing method having good coolant thermal efficiency without a gas-phase coolant being released into the ground or into the air.
    Type: Application
    Filed: April 22, 2015
    Publication date: December 7, 2017
    Applicant: CHEMICAL GROUTING CO., LTD.
    Inventors: Yuichi TACHIWADA, Tsutomu TSUCHIYA, Takeru ARIIZUMI, Hiroshi SOMA
  • Publication number: 20170343456
    Abstract: The purpose of the present invention is to provide a determining device and a determining method to determine whether an inspected jet nozzle is defective by inspecting the jet nozzle for injecting a jet stream with long ground penetrating distance at a stage before installing in a construction site where a large diameter jet grouting method is used. To achieve this purpose, with this invention, in which a nozzle to be inspected is mounted onto an outlet port, a jet stream is ejected from a jet stream generating device, and measurement data measured by a pressure sensing unit when the jet stream impacts the pressure sensing unit is processed with a controlling device (for example, a computer), a nozzle to be inspected is determined to be a non-defective product if a first ratio is no less than a first prescribed value, a second ratio is no less than a second prescribed value, and a third ratio is no less than a third prescribed value.
    Type: Application
    Filed: April 22, 2015
    Publication date: November 30, 2017
    Applicant: CHEMICAL GROUTING CO., LTD.
    Inventors: Tsutomu TSUCHIYA, Masanori KUMEKAWA, Hiroyuki ABE
  • Patent number: 8126501
    Abstract: This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: February 28, 2012
    Assignee: Renesas Electronics Corporation
    Inventors: Tadatoshi Danno, Tsutomu Tsuchiya
  • Publication number: 20110198742
    Abstract: This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab.
    Type: Application
    Filed: April 26, 2011
    Publication date: August 18, 2011
    Inventors: Tadatoshi Danno, Tsutomu Tsuchiya
  • Patent number: 7937105
    Abstract: This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab.
    Type: Grant
    Filed: February 17, 2008
    Date of Patent: May 3, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Tadatoshi Danno, Tsutomu Tsuchiya
  • Patent number: 7777309
    Abstract: This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab.
    Type: Grant
    Filed: February 19, 2008
    Date of Patent: August 17, 2010
    Assignee: Renesas Technology Corp.
    Inventors: Tadatoshi Danno, Tsutomu Tsuchiya
  • Patent number: 7425756
    Abstract: This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab.
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: September 16, 2008
    Assignee: Renesas Technology Corp.
    Inventors: Tadatoshi Danno, Tsutomu Tsuchiya
  • Publication number: 20080146187
    Abstract: This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab.
    Type: Application
    Filed: February 17, 2008
    Publication date: June 19, 2008
    Inventors: Tadatoshi DANNO, Tsutomu Tsuchiya
  • Publication number: 20080135960
    Abstract: This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab.
    Type: Application
    Filed: February 19, 2008
    Publication date: June 12, 2008
    Inventors: Tadatoshi DANNO, Tsutomu Tsuchiya
  • Patent number: 7312511
    Abstract: This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab.
    Type: Grant
    Filed: June 19, 2006
    Date of Patent: December 25, 2007
    Assignee: Renesas Technology Corp.
    Inventors: Tadatoshi Danno, Tsutomu Tsuchiya
  • Publication number: 20060237831
    Abstract: This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab.
    Type: Application
    Filed: June 19, 2006
    Publication date: October 26, 2006
    Inventors: Tadatoshi Danno, Tsutomu Tsuchiya
  • Publication number: 20060237830
    Abstract: This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise amplifiers which amplify an extremely weak signal therein. A semiconductor device includes a sealing body which is made of insulation resin, a plurality of leads which are provided inside and outside the sealing body, a tab which is provided inside the sealing body and has a semiconductor element fixing region and a wire connection region on a main surface thereof, a semiconductor element which is fixed to the semiconductor element fixing region and includes electrode terminals on an exposed main surface, conductive wires which connect electrode terminals of the semiconductor element and the leads, and conductive wires which connect electrode terminals of the semiconductor element and the wire connecting region of the tab.
    Type: Application
    Filed: June 19, 2006
    Publication date: October 26, 2006
    Inventors: Tadatoshi Danno, Tsutomu Tsuchiya
  • Patent number: D516597
    Type: Grant
    Filed: August 6, 2004
    Date of Patent: March 7, 2006
    Assignee: Sony Corporation
    Inventor: Tsutomu Tsuchiya
  • Patent number: D516600
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: March 7, 2006
    Assignee: Sony Corporation
    Inventor: Tsutomu Tsuchiya
  • Patent number: D518018
    Type: Grant
    Filed: March 22, 2005
    Date of Patent: March 28, 2006
    Assignee: Sony Corporation
    Inventors: Shinpei Hirano, Shigeaki Suzuki, Tsutomu Tsuchiya
  • Patent number: D524840
    Type: Grant
    Filed: August 6, 2004
    Date of Patent: July 11, 2006
    Assignee: Sony Corporation
    Inventor: Tsutomu Tsuchiya
  • Patent number: D541332
    Type: Grant
    Filed: January 4, 2005
    Date of Patent: April 24, 2007
    Assignee: Sony Corporation
    Inventor: Tsutomu Tsuchiya