Abstract: An air-conditioning apparatus includes a heat source unit generating heat to be transferred by a heat medium, a plurality of load-side units through which the heat medium flows, and a controller proportionally dividing a common power consumption consumed by the heat source unit. Each of the plurality of load-side units includes a flow control valve controlling a flow rate of the heat medium, an inflow pressure sensor detecting an inlet pressure of the heat medium at the flow control valve, and an outflow pressure sensor detecting an outlet pressure of the heat medium at the flow control valve.

Abstract: Provided are a transfer roller 33 that transfers an image formed on a transfer film 46 to a card, peeling member 34b that peels off the transfer film 46 from the card after transferring the image, and transfer roller up-and-down means 61 and peeling member up-and-down means 62 for respectively moving the transfer roller 33 and the peeling member 34b up and down. By this means, the transfer roller 33 and the peeling member 34b are moved up and down respectively at predetermined timing before transfer and after transfer, and it is thereby possible to always perform stable image formation without causing the transfer film to become damaged and/or deformed.

Abstract: Provided is a method of evaluating a semiconductor substrate, which evaluates quality of the semiconductor substrate by a photoluminescence measurement, wherein the evaluation by the photoluminescence measurement includes, after subjecting a surface of an evaluation-target semiconductor substrate to a pretreatment, irradiating the surface with excitation light, and then detecting emission obtained from the surface having been irradiated with the excitation light, and the pretreatment includes subjecting the surface of the evaluation-target semiconductor substrate to be irradiated with the excitation light to an oxide film formation treatment and charging the surface of the formed oxide film by corona discharge.

Abstract: An aspect of the present invention relates to a method of evaluating metal contamination in a boron-doped p-type silicon wafer, which comprises measuring over time by a microwave photoconductive decay method a recombination lifetime following irradiation with light of a silicon wafer being evaluated and obtaining information on change over time of the recombination lifetime, and comparing the information on change over time of the recombination lifetime that has been obtained with reference information on change over time that has been obtained by calculation or actual measurement of a recombination lifetime of an Fe-contaminated boron-doped p-type silicon wafer to determine whether or not metal contamination other than Fe is present in the silicon wafer being evaluated.

Abstract: An aspect of the present invention relates to a method of evaluating metal contamination in a boron-doped p-type silicon wafer, which comprises measuring over time by a microwave photoconductive decay method a recombination lifetime following irradiation with light of a silicon wafer being evaluated and obtaining information on change over time of the recombination lifetime, and comparing the information on change over time of the recombination lifetime that has been obtained with reference information on change over time that has been obtained by calculation or actual measurement of a recombination lifetime of an Fe-contaminated boron-doped p-type silicon wafer to determine whether or not metal contamination other than Fe is present in the silicon wafer being evaluated.

Abstract: Provided is a method of evaluating a semiconductor substrate, which evaluates quality of the semiconductor substrate by a photoluminescence measurement, wherein the evaluation by the photoluminescence measurement includes, after subjecting a surface of an evaluation-target semiconductor substrate to a pretreatment, irradiating the surface with excitation light, and then detecting emission obtained from the surface having been irradiated with the excitation light, and the pretreatment includes subjecting the surface of the evaluation-target semiconductor substrate to be irradiated with the excitation light to an oxide film formation treatment and charging the surface of the formed oxide film by corona discharge.

Abstract: An aspect of the present invention relates to a method of evaluating metal contamination in a semiconductor wafer that has been subjected to a heat treatment, which comprises obtaining analysis values by analyzing a plurality of analysis points on a surface of the semiconductor wafer by a first analysis method or a second analysis method, wherein in the first analysis method, analysis values employed in evaluation decrease as an amount of contamination by a metal element that is to be evaluated increases, and in the second analysis method, analysis values employed in evaluation increase as an amount of contamination by a metal element that is to be evaluated increases, and wherein determination of presence or absence of localized contamination by the metal element that is to be evaluated is made by evaluating the analysis values based on the normal value specified by a probability distribution function.

Abstract: An aspect of the present invention relates to a method of evaluating metal contamination in a boron-doped p-type silicon wafer, which comprises measuring over time by a microwave photoconductive decay method a recombination lifetime following irradiation with light of a silicon wafer being evaluated and obtaining information on change over time of the recombination lifetime, and comparing the information on change over time of the recombination lifetime that has been obtained with reference information on change over time that has been obtained by calculation or actual measurement of a recombination lifetime of an Fe-contaminated boron-doped p-type silicon wafer to determine whether or not metal contamination other than Fe is present in the silicon wafer being evaluated.

Abstract: An aspect of the present invention relates to a method of evaluating metal contamination in a semiconductor wafer that has been subjected to a heat treatment, which comprises obtaining analysis values by analyzing a plurality of analysis points on a surface of the semiconductor wafer by a first analysis method or a second analysis method, wherein in the first analysis method, analysis values employed in evaluation decrease as an amount of contamination by a metal element that is to be evaluated increases, and in the second analysis method, analysis values employed in evaluation increase as an amount of contamination by a metal element that is to be evaluated increases, and wherein determination of presence or absence of localized contamination by the metal element that is to be evaluated is made by evaluating the analysis values based on the normal value specified by a probability distribution function.

Abstract: A printing device is provided with a housing, and a card stacker is disposed above the housing. The card stacker stores cards to be placed parallel in a laminate manner. The housing houses a card rotating section, linear card transport path each being disposed below the card stacker, printing section provided below the card transport path, various sensors, and control section. A card storage section is disposed on the most downstream side of the card transport path. The card storage section stores processed cards to overlap in a laminate manner. The card stacker enables the supply number of cards to be increased, and it is possible to increase the height of the card storage section by the card transport path positioning in the upper portion inside the housing.

Abstract: Provided is a printer capable of ensuring a large peeling angle at the time of peeling between the transfer film and the ink ribbon by differentiating a conveyance direction of the transfer film at a peeling part on a proceeding passage from the proceeding direction. In the printer which forms an image on a transfer film 46 while feeding an ink ribbon 41 and the transfer film 46 to a print position between a platen roller 45 and a thermal head 40 which are mutually pressure-contacted, the transfer film 46 is wound to form a conveyance passage between a feeding spool 48 and a winding spool 47 in a film cassette 100 which is attached to a device frame in a detachably attachable manner, and a film conveying roller 49 and pinch rollers 32a, 32b are arranged at positions so that the conveyance passage of the transfer film 46 attached to the device frame is displaced to the inside of the cassette by a predetermined amount.

Abstract: The present invention provides a printing device which provides high printing quality. The printing device includes: an image forming section which has a thermal head 9 and a platen roller 12; a media conveyance section for conveying an intermediate transfer film F; a ribbon conveyance section for conveying an ink ribbon R; a sensor 10 for detecting a first mark formed on the film F; and a control section for controlling the image forming section, the media conveyance section, and the ribbon conveyance section in accordance with output information from the sensor 10.

Abstract: A plurality of closed regions constituting a line drawing image are extracted and displayed on a display means. A desired closed region included among the plurality of displayed closed regions is extracted as an image layer by specifying the desired closed region by means of a manipulation means. At this time, a closed region display screen for displaying the extracted closed regions thereon and an image layer display screen for displaying the extracted image layer thereon are displayed in side by side relation on the display means. Thus, whether an appropriate closed region is converted to the image layer or not is easily determined. Also, when a plurality of closed regions are specified, the plurality of specified closed regions are extracted as an image layer. Thus, the plurality of closed regions are treated together as the single image layer.

Abstract: Provided is a printer capable of ensuring a large peeling angle at the time of peeling between the transfer film and the ink ribbon by differentiating a conveyance direction of the transfer film at a peeling part on a proceeding passage from the proceeding direction. In the printer which forms an image on a transfer film 46 while feeding an ink ribbon 41 and the transfer film 46 to a print position between a platen roller 45 and a thermal head 40 which are mutually pressure-contacted, the transfer film 46 is wound to form a conveyance passage between a feeding spool 48 and a winding spool 47 in a film cassette 100 which is attached to a device frame in a detachably attachable manner, and a film conveying roller 49 and pinch rollers 32a, 32b are arranged at positions so that the conveyance passage of the transfer film 46 attached to the device frame is displaced to the inside of the cassette by a predetermined amount.

Abstract: A method includes a grinding step of forming the shape of a contact surface, a grooving step of roughening the shaped contact surface to form grooves therein, and a contact surface lapping step of lapping the contact surface having the grooves with a lapping film to form oil grooves for holding a lubricant oil. The surface roughness of the contact surface is such that the maximum height roughness Rz is 4 ?m or less, the mean length RSm of the roughness profile elements is 30 to 60 ?m, the skewness Rsk of the roughness profile is ?2.7 to ?0.6 (no unit), the reduced peak height Rpk is 0.09 ?m or less, and the reduced valley depth Rvk is 0.4 to 1.3 ?m.

Abstract: A printer has a substantially linear transport path P1 in which a card C is transported, roller 41 provided on the transport path P1 to transport the card C, roller 42 spaced apart from the roller 41 on the transport path P1 to transport the card C to the opposite side to the roller 41, cleaning roller 31 that is disposed opposite to the roller 41 on the transport path P1 and that has an adhesive portion for cleaning the surface of the card C, and control section 95 for controlling the rotation velocity of the roller 31 to rotate the roller 31 at least at rotation velocity V1 and at rotation velocity V2 lower than the rotation velocity V1, where the control section 95 controls the rotation velocity of the roller 31 from the rotation velocity V1 to the rotation velocity V2 for a period during which the front end of the card C reaches the roller 41 from the cleaning roller 31.

Abstract: Provided are a transfer roller 33 that transfers an image formed on a transfer film 46 to a card, peeling member 34b that peels off the transfer film 46 from the card after transferring the image, and transfer roller up-and-down means 61 and peeling member up-and-down means 62 for respectively moving the transfer roller 33 and the peeling member 34b up and down. By this means, the transfer roller 33 and the peeling member 34b are moved up and down respectively at predetermined timing before transfer and after transfer, and it is thereby possible to always perform stable image formation without causing the transfer film to become damaged and/or deformed.