Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.

Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.

Abstract: Systems and method for monitoring semiconductor wafer fabrication processing, for example based upon EBR line inspection, including capturing at least one image of a wafer at an intermediate stage of fabrication. The captured image(s) are compressed to generate a composite representation of at least an edge zone of the wafer. An edge bead removal area is identified in the representation, and at least one feature attribute is extracted from the identified area. The extracted feature attribute is automatically assessed, and information relating to a status of the fabrication processing in generated based upon the assessment. For example, recommended modifications to the fabrication processing, either upstream or downstream of the current stage of fabrication (or both) can be generated and implemented.

Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.

Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.

Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.

Abstract: Wafer edge inspection approaches are disclosed wherein an imaging device captures at least one image of an edge of a wafer. The at least one image can be analyzed in order to identify an edge bead removal line. An illumination system having a diffuser can further be used in capturing images.

Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.

Abstract: Systems and method for monitoring semiconductor wafer fabrication processing, for example based upon EBR line inspection, including capturing at least one image of a wafer at an intermediate stage of fabrication. The captured image(s) are compressed to generate a composite representation of at least an edge zone of the wafer. An edge bead removal area is identified in the representation, and at least one feature attribute is extracted from the identified area. The extracted feature attribute is automatically assessed, and information relating to a status of the fabrication processing in generated based upon the assessment. For example, recommended modifications to the fabrication processing, either upstream or downstream of the current stage of fabrication (or both) can be generated and implemented.

Abstract: Techniques for simulating universal serial bus (USB) video devices are described. In one example, a document containing a USB video device descriptor set is loaded by a device simulator application. The document is parsed and the descriptor set is extracted. The descriptor set is then used to define a simulated USB video device. A device simulation framework simulates a USB device attachment to a computing device and video data is streamed from the simulated USB video device to the computing device. A video driver associated with the computing device processes the video data as if the data originated from USB video device hardware. Multiple different USB video devices may be simulated and different collections and configurations of video data can be utilized.

Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.

Abstract: The described embodiments relate to testing streaming media capture devices and/or computer systems. One exemplary method enumerates and tests multiple streaming media capture device which are operably associated with a computer. The method simultaneously exercises said computer's display and power states.

Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.

Abstract: A vertical blanking interval (VBI) signal testing tool captures, isolates, and analyzes a VBI signal to determine the quality of the VBI signal or signal source. A digitized VBI signal may be received and analyzed according to industry standards. The VBI signal is examined using thresholds, threshold points, and other points as a way of discerning waveforms in the signal and their individual characteristics. Thereafter, deviations of the VBI signal from industry standards are logged or displayed for review. One feature of the tool records captured VBI data to a persistent storage medium, thereby allowing post-processing of the VBI signal at another time and/or another location. An exemplary analysis program can read the recorded VBI data from the persistent storage medium and perform tests to determine the quality of the VBI signal or signal source. VBI signal translations are also contemplated.

Abstract: Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.

Abstract: Systems and methods of inspection for a substrate. At least two images of a selected portion of the substrate edge are captured using an optical imaging system, and each characterized by a discrete focal distance setting of the optical imaging system. A composite image of the substrate edge is formed from the at least two images. Defect(s) are identified in the composite image. Some optical systems can include at least one optical element having an optical power and a focusing mechanism for modifying a focal distance of the optical system.

Abstract: The described embodiments relate to testing streaming media capture devices and/or computer systems. One exemplary method enumerates and tests multiple streaming media capture device which are operably associated with a computer. The method simultaneously exercises said computer's display and power states.

Abstract: A vertical blanking interval (VBI) signal testing tool captures, isolates, and analyzes a VBI signal to determine the quality of the VBI signal or signal source. A digitized VBI signal is received and analyzed according to industry standards. The VBI signal is first examined using thresholds, threshold points, and other points as a way of discerning waveforms in the signal and their individual characteristics. Thereafter, deviations of the VBI signal from industry standards are logged or displayed for review.

Abstract: The described embodiments relate to testing streaming media capture devices and/or computer systems. One exemplary method enumerates and tests multiple streaming media capture device which are operably associated with a computer. The method simultaneously exercises said computer's display and power states.

Abstract: Techniques for simulating universal serial bus (USB) video devices are described. In one example, a document containing a USB video device descriptor set is loaded by a device simulator application. The document is parsed and the descriptor set is extracted. The descriptor set is then used to define a simulated USB video device. A device simulation framework simulates a USB device attachment to a computing device and video data is streamed from the simulated USB video device to the computing device. A video driver associated with the computing device processes the video data as if the data originated from USB video device hardware. Multiple different USB video devices may be simulated and different collections and configurations of video data can be utilized.