Patents by Inventor Tyler Weaver
Tyler Weaver has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120180983Abstract: The present invention generally provides a cluster tool for processing a substrate. In one embodiment, the cluster tool comprises at least one processing rack, which comprises a first plurality of substrate processing chambers that are positioned adjacent to each other and aligned in a first direction, a second plurality of substrate processing chambers that are positioned adjacent to each other and adjacent to at least one of the first plurality of substrate processing chambers, the second plurality of substrate processing chambers being positioned in a second direction relative to the first direction, a first shuttle robot movable in the first direction for moving substrates between each of the first plurality of substrate processing chambers, and a second shuttle robot movable in the second direction for moving substrates between each of the second plurality of substrate processing chambers.Type: ApplicationFiled: March 2, 2012Publication date: July 19, 2012Inventors: TETSUYA ISHIKAWA, RICK J. ROBERTS, HELEN R. ARMER, LEON VOLFOVSKI, JAY D. PINSON, MICHAEL RICE, DAVID H. QUACH, MOHSEN S. SALEK, ROBERT LOWRANCE, JOHN A. BACKER, WILLIAM TYLER WEAVER, CHARLES CARLSON, CHONGYANG WANG, JEFFREY HUDGENS, HARALD HERCHEN, BRIAN LUE
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Patent number: 8215262Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, a cluster tool for processing a substrate includes a first processing rack, a first robot assembly and a second robot assembly operable to transfer substrates to substrate processing chambers in the first processing rack, and a horizontal motion assembly. The horizontal motion assembly includes one or more walls that form an interior region in which a motor is enclosed. The one or more walls defining an elongated opening through which a robot support interface travels, the robot support interface supporting a robot of the horizontal motion assembly.Type: GrantFiled: October 20, 2008Date of Patent: July 10, 2012Assignee: Applied Materials, Inc.Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lu
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Publication number: 20120141237Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, the enclosure containing at least a portion of a vertical actuator assembly, a support plate coupled to the enclosure, and a first transfer robot disposed on the support plate.Type: ApplicationFiled: November 28, 2011Publication date: June 7, 2012Inventors: Mike RICE, Jeffrey HUDGENS, Charles CARLSON, William Tyler WEAVER, Robert LOWRANCE, Eric ENGLHARDT, Dean C. HRUZEK, Dave SILVETTI, Michael KUCHAR, Kirk Van KATWYK, Van HOSKINS, Vinay SHAH
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Patent number: 8181596Abstract: An apparatus for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, a smaller system footprint, and a more repeatable wafer history. Embodiments provide for a cluster tool comprising first and second processing racks, each having two or more vertically stacked substrate processing chambers, a first robot assembly able to access the first processing rack from a first side, a second robot assembly able to access the first processing rack from a second side and the second processing rack from a first side, a third robot assembly able to access the second processing rack from a second side, and a fourth robot assembly able to access the first and second processing racks and to load substrates in a cassette.Type: GrantFiled: October 20, 2008Date of Patent: May 22, 2012Assignee: Applied Materials, Inc.Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lu
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Patent number: 8146530Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.Type: GrantFiled: October 20, 2008Date of Patent: April 3, 2012Assignee: Applied Materials, Inc.Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lu
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Patent number: 8066466Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, an actuator within the enclosure, and a fan assembly disposed in the enclosure that is adapted to generate a pressure within the enclosure that is less than a pressure outside of the enclosure.Type: GrantFiled: July 20, 2010Date of Patent: November 29, 2011Assignee: Applied Materials, Inc.Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Patent number: 7925377Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment of the cluster tool, grouping substrates together, and transferring and processing the substrates in groups of two or more, improves system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.Type: GrantFiled: July 19, 2006Date of Patent: April 12, 2011Assignee: Applied Materials, Inc.Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue, John A. Backer
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Publication number: 20100280654Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, is provided. In one embodiment of the invention, a robot assembly is provided. The robot assembly includes a first motion assembly movable in a first direction, and a second motion assembly, the second motion assembly being coupled to the first motion assembly and being movable relative to the first motion assembly in a second direction that is generally orthogonal to the first direction. The robot assembly further comprises an enclosure disposed in one of the first motion assembly or the second motion assembly, an actuator within the enclosure, and a fan assembly disposed in the enclosure that is adapted to generate a pressure within the enclosure that is less than a pressure outside of the enclosure.Type: ApplicationFiled: July 20, 2010Publication date: November 4, 2010Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Patent number: 7798764Abstract: A method and apparatus for processing substrates using a cluster tool that has an increased system throughput, increased system reliability, improved device yield performance, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robot assemblies that are configured in a parallel processing configuration and adapted to move in a vertical and a horizontal direction to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms.Type: GrantFiled: October 27, 2006Date of Patent: September 21, 2010Assignee: Applied Materials, Inc.Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Patent number: 7794195Abstract: A datum plate is provided for use in installations of substrate handling systems. The datum plate has a set of predetermined attachment locations adapted to couple the datum plate to a chamber; a set of predetermined attachment locations adapted to couple one or more automatic door opener platforms to the datum plate; and a set of predetermined attachment locations adapted to couple one or more substrate handlers contained within the chamber, to the datum plate. The attachment locations are positioned such that when the datum plate is coupled to the chamber, and the automatic door opener platform and the substrate handler are coupled to the datum plate, the substrate handler and automatic door opener platform are aligned for substrate transfer therebetween. Numerous other aspects are provided.Type: GrantFiled: April 8, 2008Date of Patent: September 14, 2010Assignee: Applied Materials, Inc.Inventor: William Tyler Weaver
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Patent number: 7743728Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool). In one embodiment, the cluster tool is adapted to perform a track lithography process in which a photosensitive material is applied to a substrate, patterned in a stepper/scanner, and then removed in a developing process completed in the cluster tool. In one embodiment of the cluster tool, substrates are grouped together in groups of two or more for transfer or processing to improve system throughput, reduce the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, and thus increase system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.Type: GrantFiled: April 21, 2008Date of Patent: June 29, 2010Assignee: Applied Materials, Inc.Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
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Patent number: 7694647Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.Type: GrantFiled: July 19, 2006Date of Patent: April 13, 2010Assignee: Applied Materials, Inc.Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
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Patent number: 7651306Abstract: Embodiments of the invention provide a method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool.Type: GrantFiled: December 22, 2005Date of Patent: January 26, 2010Assignee: Applied Materials, Inc.Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Dave Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Publication number: 20090064929Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.Type: ApplicationFiled: October 20, 2008Publication date: March 12, 2009Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lu
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Publication number: 20090064928Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.Type: ApplicationFiled: October 20, 2008Publication date: March 12, 2009Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
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Publication number: 20090067956Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool.Type: ApplicationFiled: October 20, 2008Publication date: March 12, 2009Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
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Patent number: 7467919Abstract: A wafer carrier opener is provided. The wafer carrier opener may eliminate the use of two separate actuators by using a four-bar linkage mechanism. The wafer carrier opener includes a wafer carrier door receiver, a horizontally stationary member, and a link coupled between the wafer carrier door receiver and the horizontally stationary member so as to allow horizontal movement of the wafer carrier door receiver.Type: GrantFiled: July 28, 2006Date of Patent: December 23, 2008Assignee: Applied Materials, Inc.Inventor: William Tyler Weaver
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Publication number: 20080223293Abstract: A cluster tool for processing a substrate includes a cassette and a processing module including a first process chamber that is configured to perform a chill process on a substrate, a second processing chamber that is configured to perform a bake process on the substrate, and an input chamber. The first processing chamber, the second processing chamber, and the input chamber are substantially adjacent to each other. The processing modules also includes a robot that is configured to receive the substrate in the input chamber and transfer and position the substrate in the first processing chamber and second processing chamber. The robot includes a robot blade, an actuator, and a heat exchanging device. The heat exchanging device includes a chilled transfer assembly. The cluster tool also includes a 6-axis articulated robot configured to transfer the substrate between the cassette and the input chamber.Type: ApplicationFiled: February 19, 2008Publication date: September 18, 2008Applicant: Sokudo Co,. Ltd.Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue
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Publication number: 20080213068Abstract: A datum plate is provided for use in installations of substrate handling systems. The datum plate has a set of predetermined attachment locations adapted to couple the datum plate to a chamber; a set of predetermined attachment locations adapted to couple one or more automatic door opener platforms to the datum plate; and a set of predetermined attachment locations adapted to couple one or more substrate handlers contained within the chamber, to the datum plate. The attachment locations are positioned such that when the datum plate is coupled to the chamber, and the automatic door opener platform and the substrate handler are coupled to the datum plate, the substrate handler and automatic door opener platform are aligned for substrate transfer therebetween. Numerous other aspects are provided.Type: ApplicationFiled: April 8, 2008Publication date: September 4, 2008Inventor: William Tyler Weaver
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Publication number: 20080199282Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool). In one embodiment, the cluster tool is adapted to perform a track lithography process in which a photosensitive material is applied to a substrate, patterned in a stepper/scanner, and then removed in a developing process completed in the cluster tool. In one embodiment of the cluster tool, substrates are grouped together in groups of two or more for transfer or processing to improve system throughput, reduce the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, and thus increase system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.Type: ApplicationFiled: April 21, 2008Publication date: August 21, 2008Inventors: Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, Michael Rice, David H. Quach, Mohsen S. Salek, Robert Lowrance, John A. Backer, William Tyler Weaver, Charles Carlson, Chongyang Wang, Jeffrey Hudgens, Harald Herchen, Brian Lue