Patents by Inventor Tzer-Perng Chen

Tzer-Perng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10978615
    Abstract: The present disclosure provides a light-emitting apparatus comprising a board having a plurality of first metal contacts and a plurality of second metal contacts on a top surface; a plurality of LEDs being bonded to the board, the each of the LEDs comprising a first cladding layer on the substrate, an active layer on the first cladding layer, a second cladding layer on the active layer, an upper surface on the second cladding layer, a first metal layer, and a second metal layer, wherein the first metal layer and the second metal layer are between the active layer and the board; an opaque layer between the adjacent LEDs and comprising a polymer mixed with a plurality of inorganic particles; and an encapsulating layer on the upper surfaces and opposite to the board, wherein the encapsulating layer does not cover a side wall of the active layer; and an underfill material between the board and the plurality of LEDs, wherein the underfill material surrounds each of the first metal layer and the second metal layer.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: April 13, 2021
    Assignee: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Tzer-Perng Chen, Jen-Chau Wu, Yuh-Ren Shieh, Chuan-Cheng Tu
  • Patent number: 10910528
    Abstract: This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: February 2, 2021
    Assignees: EPISTAR CORPORATION, KAISTAR LIGHTING (XIAMEN) CO., LTD.
    Inventors: Tzer-Perng Chen, Tzu-Chi Cheng
  • Publication number: 20200313051
    Abstract: The disclosure discloses an optoelectronic element comprising: an optoelectronic unit comprising a first metal layer, a second metal layer, and an outermost lateral surface; an insulating layer having a first portion overlapping the optoelectronic unit and extending beyond the lateral surface, and a second portion separated from the first portion in a cross-sectional view; and a first conductive layer formed on the insulating layer.
    Type: Application
    Filed: June 12, 2020
    Publication date: October 1, 2020
    Inventors: Cheng-Nan HAN, Tsung-Xian LEE, Min-Hsun HSIEH, Hung-Hsuan CHEN, Hsin-Mao LIU, Hsing-Chao CHEN, Ching-San TAO, Chih-Peng NI, Tzer- Perng CHEN, Jen-Chau WU
  • Publication number: 20200227591
    Abstract: The present disclosure provides a light-emitting apparatus comprising a board having a plurality of first metal contacts and a plurality of second metal contacts on a top surface; a plurality of LEDs being bonded to the board, the each of the LEDs comprising a first cladding layer on the substrate, an active layer on the first cladding layer, a second cladding layer on the active layer, an upper surface on the second cladding layer, a first metal layer, and a second metal layer, wherein the first metal layer and the second metal layer are between the active layer and the board; an opaque layer between the adjacent LEDs and comprising a polymer mixed with a plurality of inorganic particles; and an encapsulating layer on the upper surfaces and opposite to the board, wherein the encapsulating layer does not cover a side wall of the active layer; and an underfill material between the board and the plurality of LEDs, wherein the underfill material surrounds each of the first metal layer and the second metal layer.
    Type: Application
    Filed: March 24, 2020
    Publication date: July 16, 2020
    Inventors: Min-Hsun HSIEH, Tzer-Perng CHEN, Jen-Chau WU, Yuh-Ren SHIEH, Chuan-Cheng TU
  • Patent number: 10686106
    Abstract: The disclosure discloses an optoelectronic element comprising: an optoelectronic unit comprising a first metal layer, a second metal layer, and an outermost lateral surface; an insulating layer having a first portion overlapping the optoelectronic unit and extending beyond the lateral surface, and a second portion separated from the first portion in a cross-sectional view; and a first conductive layer formed on the insulating layer.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: June 16, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Cheng-Nan Han, Tsung-Xian Lee, Min-Hsun Hsieh, Hung-Hsuan Chen, Hsin-Mao Liu, Hsing-Chao Chen, Ching-San Tao, Chih-Peng Ni, Tzer-Perng Chen, Jen-Chau Wu
  • Patent number: 10529898
    Abstract: An optoelectronic element includes an optoelectronic unit, a first metal layer, a second metal layer, a conductive layer and a transparent structure. The optoelectronic unit has a central line in a top view, a top surface, and a bottom surface. The second metal layer is formed on the top surface, and has an extension portion crossing over the central line and extending to the first metal layer. The conductive layer covers the first metal layer and the extension portion. The transparent structure covers the bottom surface without covering the top surface.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: January 7, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Cheng-Nan Han, Tsung-Xian Lee, Min-Hsun Hsieh, Hung-Hsuan Chen, Hsin-Mao Liu, Hsing-Chao Chen, Ching San Tao, Chih-Peng Ni, Tzer-Perng Chen, Jen-Chau Wu, Masafumi Sano, Chih-Ming Wang
  • Publication number: 20190296198
    Abstract: This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.
    Type: Application
    Filed: June 10, 2019
    Publication date: September 26, 2019
    Inventors: TZER-PERNG CHEN, TZU-CHI CHENG
  • Patent number: 10319886
    Abstract: This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: June 11, 2019
    Assignees: Epistar Corporation, Kaistar Lighting (Xiamen) Co., Ltd.
    Inventors: Tzer-Perng Chen, Tzu-Chi Cheng
  • Publication number: 20180254391
    Abstract: The disclosure discloses an optoelectronic element comprising: an optoelectronic unit comprising a first metal layer, a second metal layer, and an outermost lateral surface; an insulating layer having a first portion overlapping the optoelectronic unit and extending beyond the lateral surface, and a second portion separated from the first portion in a cross-sectional view; and a first conductive layer formed on the insulating layer.
    Type: Application
    Filed: May 7, 2018
    Publication date: September 6, 2018
    Inventors: Cheng-Nan HAN, Tsung-Xian LEE, Min-Hsun HSIEH, Hung-Hsuan CHEN, Hsin-Mao LIU, Hsing-Chao CHEN, Ching-San TAO, Chih-Peng NI, Tzer- Perng CHEN, Jen-Chau WU
  • Publication number: 20180233635
    Abstract: This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.
    Type: Application
    Filed: April 17, 2018
    Publication date: August 16, 2018
    Inventors: TZER-PERNG CHEN, TZU-CHI CHENG
  • Patent number: 9947839
    Abstract: This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: April 17, 2018
    Assignees: Huga Optotech Inc., Interlight Optotech Corporation
    Inventors: Tzer-Perng Chen, Tzu-Chi Cheng
  • Patent number: 9893244
    Abstract: An optoelectronic element includes an optoelectronic unit, a first metal layer, a second metal layer, a conductive layer and a transparent structure. The optoelectronic unit has a central line in a top view, a top surface, and a bottom surface. The second metal layer is formed on the top surface, and has an extension portion crossing over the central line and extending to the first metal layer. The conductive layer covers the first metal layer and the extension portion. The transparent structure covers the bottom surface without covering the top surface.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: February 13, 2018
    Assignee: EPISTAR CORPORATION
    Inventors: Cheng-Nan Han, Tsung-Xian Lee, Min-Hsun Hsieh, Hung-Hsuan Chen, Hsin-Mao Liu, Hsing-Chao Chen, Ching San Tao, Chih-Peng Ni, Tzer-Perng Chen, Jen-Chau Wu, Masafumi Sano, Chih-Ming Wang
  • Publication number: 20180019382
    Abstract: An optoelectronic element includes an optoelectronic unit, a first metal layer, a second metal layer, a conductive layer and a transparent structure. The optoelectronic unit has a central line in a top view, a top surface, and a bottom surface. The second metal layer is formed on the top surface, and has an extension portion crossing over the central line and extending to the first metal layer. The conductive layer covers the first metal layer and the extension portion. The transparent structure covers the bottom surface without covering the top surface.
    Type: Application
    Filed: September 18, 2015
    Publication date: January 18, 2018
    Inventors: Cheng-Nan HAN, Tsung-Xian LEE, Min-Hsun HSIEH, Hung-Hsuan CHEN, Hsin-Mao LIU, Hsing-Chao CHEN, Ching San TAO, Chih-Peng NI, Tzer-Perng CHEN, Jen-Chau WU, Masafumi SANO, Chih-Ming WANG
  • Publication number: 20170365750
    Abstract: An optoelectronic element includes an optoelectronic unit, a first metal layer, a second metal layer, a conductive layer and a transparent structure. The optoelectronic unit has a central line in a top view, a top surface, and a bottom surface. The second metal layer is formed on the top surface, and has an extension portion crossing over the central line and extending to the first metal layer. The conductive layer covers the first metal layer and the extension portion. The transparent structure covers the bottom surface without covering the top surface.
    Type: Application
    Filed: August 16, 2017
    Publication date: December 21, 2017
    Inventors: Cheng-Nan HAN, Tsung-Xian LEE, Min-Hsun HSIEH, Hung-Hsuan CHEN, Hsin-Mao LIU, Hsing-Chao CHEN, Ching San TAO, Chih-Peng NI, Tzer-Perng CHEN, Jen-Chau WU, Masafumi SANO, Chih-Ming WANG
  • Patent number: 9741905
    Abstract: An optoelectronic element includes an optoelectronic unit, a first metal layer, a second metal layer, a conductive layer and a transparent structure. The optoelectronic unit has a central line in a top view, a top surface, and a bottom surface. The second metal layer is formed on the top surface, and has an extension portion crossing over the central line and extending to the first metal layer. The conductive layer covers the first metal layer and the extension portion. The transparent structure covers the bottom surface without covering the top surface.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: August 22, 2017
    Assignee: Epistar Corporation
    Inventors: Cheng-Nan Han, Tsung-Xian Lee, Min-Hsun Hsieh, Hung-Hsuan Chen, Hsin-Mao Liu, Hsing-Chao Chen, Ching San Tao, Chih-Peng Ni, Tzer-Perng Chen, Jen-Chau Wu, Masafumi Sano, Chih-Ming Wang
  • Publication number: 20170040504
    Abstract: This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.
    Type: Application
    Filed: October 19, 2016
    Publication date: February 9, 2017
    Inventors: TZER-PERNG CHEN, TZU-CHI CHENG
  • Patent number: 9559229
    Abstract: The disclosure provides a multi-junction solar cell structure and the manufacturing method thereof, comprising a first photovoltaic structure and a second photovoltaic structure; wherein at least one of the first photovoltaic structure and the second photovoltaic structure comprises a discontinuous photoelectric converting structure.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: January 31, 2017
    Assignee: EPISTAR CORPORATION
    Inventor: Tzer-Perng Chen
  • Patent number: 9546762
    Abstract: Disclosed are LED assemblies and their applications. An example LED assembly has an LED chip, a supportive structure and a transparent structure. The LED chip includes a transparent substrate, at least one LED cell, and two pads. The transparent substrate has a top surface with two terminals. The LED cell is formed on the top surface, and includes at least one light-emitting stack configured to emit light. The pad is formed on the top surface at the two terminals. The supportive structure has a transparent portion and a conductive portion. The conductive portion is connected to the transparent portion to fix the LED chip and supply electric power to at least one of the pads. The transparent structure encapsulates the LED cell.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: January 17, 2017
    Assignees: HUGA OPTOTECH INC., INTERLIGHT OPTOTECH CORPORATION
    Inventors: Tzer-Perng Chen, Tzu-Chi Cheng
  • Patent number: 9502622
    Abstract: This disclosure discloses an LED assembly. The LED assembly comprises a transparent substrate; a first phosphor layer; a transparent mount, having a plurality of trenches substantially in parallel to each other, wherein the first phosphor layer is positioned between the transparent substrate and the transparent mount; an LED chip, mounted on an area of the transparent mount, wherein the area is located substantially between the trenches; and a second phosphor layer inside the trenches.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: November 22, 2016
    Assignees: HUGA OPTOTECH INC., INTERLIGHT OPTOTECH CORPORATION
    Inventors: Tzer-Perng Chen, Tzu-Chi Cheng
  • Patent number: 9362456
    Abstract: An optoelectronic semiconductor device includes a substrate, a semiconductor system having an active layer formed on the substrate and an electrode structure formed on the semiconductor system, wherein the layout of the electrode structure having at least a first conductivity type contact zone or a first conductivity type bonding pad, a second conductivity type bonding pad, a first conductivity type extension electrode, and a second conductivity type extension electrode wherein the first conductivity type extension electrode and the second conductivity type extension electrode have three-dimensional crossover, and partial of the first conductivity type extension electrode and the first conductivity type contact zone or the first conductivity type bonding pad are on the opposite sides of the active layer.
    Type: Grant
    Filed: September 24, 2012
    Date of Patent: June 7, 2016
    Assignee: EPISTAR CORPORATION
    Inventors: Wei-Yo Chen, Yen-Wen Chen, Chien-Yuan Wang, Min-Hsun Hsieh, Tzer-Perng Chen