Patents by Inventor Tzer-Perng Chen
Tzer-Perng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9741905Abstract: An optoelectronic element includes an optoelectronic unit, a first metal layer, a second metal layer, a conductive layer and a transparent structure. The optoelectronic unit has a central line in a top view, a top surface, and a bottom surface. The second metal layer is formed on the top surface, and has an extension portion crossing over the central line and extending to the first metal layer. The conductive layer covers the first metal layer and the extension portion. The transparent structure covers the bottom surface without covering the top surface.Type: GrantFiled: September 18, 2015Date of Patent: August 22, 2017Assignee: Epistar CorporationInventors: Cheng-Nan Han, Tsung-Xian Lee, Min-Hsun Hsieh, Hung-Hsuan Chen, Hsin-Mao Liu, Hsing-Chao Chen, Ching San Tao, Chih-Peng Ni, Tzer-Perng Chen, Jen-Chau Wu, Masafumi Sano, Chih-Ming Wang
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Publication number: 20170040504Abstract: This disclosure discloses an LED assembly. The LED assembly includes a transparent mount with a top surface and a bottom surface opposite to the top surface, an LED chip arranged on the top surface, an electrode plate, a first phosphor layer having a first phosphor, and a second phosphor layer having a second phosphor, wherein the transparent mount and the electrode plate substantially have a same width. The electrode plate is arranged on an edge of the top surface and electrically connected to the LED chip.Type: ApplicationFiled: October 19, 2016Publication date: February 9, 2017Inventors: TZER-PERNG CHEN, TZU-CHI CHENG
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Patent number: 9559229Abstract: The disclosure provides a multi-junction solar cell structure and the manufacturing method thereof, comprising a first photovoltaic structure and a second photovoltaic structure; wherein at least one of the first photovoltaic structure and the second photovoltaic structure comprises a discontinuous photoelectric converting structure.Type: GrantFiled: December 30, 2010Date of Patent: January 31, 2017Assignee: EPISTAR CORPORATIONInventor: Tzer-Perng Chen
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Patent number: 9546762Abstract: Disclosed are LED assemblies and their applications. An example LED assembly has an LED chip, a supportive structure and a transparent structure. The LED chip includes a transparent substrate, at least one LED cell, and two pads. The transparent substrate has a top surface with two terminals. The LED cell is formed on the top surface, and includes at least one light-emitting stack configured to emit light. The pad is formed on the top surface at the two terminals. The supportive structure has a transparent portion and a conductive portion. The conductive portion is connected to the transparent portion to fix the LED chip and supply electric power to at least one of the pads. The transparent structure encapsulates the LED cell.Type: GrantFiled: August 15, 2014Date of Patent: January 17, 2017Assignees: HUGA OPTOTECH INC., INTERLIGHT OPTOTECH CORPORATIONInventors: Tzer-Perng Chen, Tzu-Chi Cheng
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Patent number: 9502622Abstract: This disclosure discloses an LED assembly. The LED assembly comprises a transparent substrate; a first phosphor layer; a transparent mount, having a plurality of trenches substantially in parallel to each other, wherein the first phosphor layer is positioned between the transparent substrate and the transparent mount; an LED chip, mounted on an area of the transparent mount, wherein the area is located substantially between the trenches; and a second phosphor layer inside the trenches.Type: GrantFiled: September 23, 2014Date of Patent: November 22, 2016Assignees: HUGA OPTOTECH INC., INTERLIGHT OPTOTECH CORPORATIONInventors: Tzer-Perng Chen, Tzu-Chi Cheng
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Patent number: 9362456Abstract: An optoelectronic semiconductor device includes a substrate, a semiconductor system having an active layer formed on the substrate and an electrode structure formed on the semiconductor system, wherein the layout of the electrode structure having at least a first conductivity type contact zone or a first conductivity type bonding pad, a second conductivity type bonding pad, a first conductivity type extension electrode, and a second conductivity type extension electrode wherein the first conductivity type extension electrode and the second conductivity type extension electrode have three-dimensional crossover, and partial of the first conductivity type extension electrode and the first conductivity type contact zone or the first conductivity type bonding pad are on the opposite sides of the active layer.Type: GrantFiled: September 24, 2012Date of Patent: June 7, 2016Assignee: EPISTAR CORPORATIONInventors: Wei-Yo Chen, Yen-Wen Chen, Chien-Yuan Wang, Min-Hsun Hsieh, Tzer-Perng Chen
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Publication number: 20160013371Abstract: An optoelectronic element includes an optoelectronic unit, a first metal layer, a second metal layer, a conductive layer and a transparent structure. The optoelectronic unit has a central line in a top view, a top surface, and a bottom surface. The second metal layer is formed on the top surface, and has an extension portion crossing over the central line and extending to the first metal layer. The conductive layer covers the first metal layer and the extension portion. The transparent structure covers the bottom surface without covering the top surface.Type: ApplicationFiled: September 18, 2015Publication date: January 14, 2016Inventors: Cheng-Nan HAN, Tsung-Xian LEE, Min-Hsun HSIEH, Hung-Hsuan CHEN, Hsin-Mao LIU, Hsing-Chao CHEN, Ching San TAO, Chih-Peng NI, Tzer-Perng CHEN, Jen-Chau WU, Masafumi SANO, Chih-Ming WANG
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Publication number: 20150295154Abstract: The present disclosure provides a method for forming a light-emitting apparatus, comprising providing a carrier having a plurality of first metal contacts; forming a light-emitting structure comprising a substrate, a first cladding layer on the substrate, an active layer on the first cladding layer, and a second cladding layer on the active layer; bonding the light-emitting structure to the carrier; forming a cap layer on a side of the light-emitting structure opposite to the carrier; and cutting the carrier and the cap layer to form a chip-scale LED unit.Type: ApplicationFiled: April 15, 2015Publication date: October 15, 2015Inventors: Chuan-Cheng TU, Jen-Chau WU, Yuh-Ren SHIEH, Tzer-Perng CHEN, Min-Hsun HSIEH
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Patent number: 9142740Abstract: An optoelectronic element includes an optoelectronic unit having a first top surface; a first metal layer on the first top surface; a first transparent structure surrounding the optoelectronic unit and exposing the first top surface; and a first contact layer on the first transparent structure, including a connective part electrically connected with the first metal layer.Type: GrantFiled: May 2, 2013Date of Patent: September 22, 2015Assignee: EPISTAR CORPORATIONInventors: Cheng-Nan Han, Tsung-Xian Lee, Min-Hsun Hsieh, Hung-Hsuan Chen, Hsin-Mao Liu, Hsing-Chao Chen, Ching-San Tao, Chih-Peng Ni, Tzer-Perng Chen, Jen-Chau Wu, Masafumi Sano, Chih-Ming Wang
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Publication number: 20150214449Abstract: The disclosure discloses an optoelectronic element comprising: an optoelectronic unit comprising a first metal layer, a second metal layer, and an outermost lateral surface; an insulating layer having a first portion overlapping the optoelectronic unit and extending beyond the lateral surface, and a second portion separated from the first portion in a cross-sectional view; and a first conductive layer formed on the insulating layer.Type: ApplicationFiled: April 6, 2015Publication date: July 30, 2015Inventors: Cheng-Nan HAN, Tsung-Xian LEE, Min-Hsun HSIEH, Hung-Hsuan CHEN, Hsin-Mao LIU, Hsing-Chao CHEN, Ching-San TAO, Chih-Peng NI, Tzer- Perng CHEN, Jen-Chau WU
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Patent number: 9024451Abstract: An integrated lighting apparatus comprises a first control device including a semiconductor substrate, an integrated circuit block formed above a first portion of the semiconductor substrate, and a plurality of power pads formed above the integrated circuit block; a first light emitting device formed above a second portion of the semiconductor substrate; and a through plug passing through the semiconductor substrate for electrically connecting the first control device and the first light emitting device.Type: GrantFiled: August 22, 2014Date of Patent: May 5, 2015Assignee: Epistar CorporationInventors: Hsin-Mao Liu, Min-Hsun Hsieh, Tzer-Perng Chen, Meng-Yuan Hong, Cheng Nan Han, Tsung-Xian Lee, Ta-Cheng Hsu, Chih-Chiang Lu
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Patent number: 9018655Abstract: The present disclosure provides a method for forming a light-emitting apparatus, comprising providing a first board having a plurality of first metal contacts, providing a substrate, forming a plurality of light-emitting stacks and trenches on the substrate, wherein the light-emitting stacks are apart from each other by the plurality of the trenches, bonding the light-emitting stacks to the first board, forming an encapsulating material commonly on the plurality of the light-emitting stacks, and cutting the first board and the encapsulating material to form a plurality of chip-scale LED units.Type: GrantFiled: November 18, 2013Date of Patent: April 28, 2015Assignee: Epistar CorporationInventors: Chuan-Cheng Tu, Jen-Chau Wu, Yuh-Ren Shieh, Tzer-Perng Chen, Min-Hsun Hsieh
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Publication number: 20150097199Abstract: This disclosure discloses an LED assembly. The LED assembly comprises a transparent substrate; a first phosphor layer; a transparent mount, having a plurality of trenches substantially in parallel to each other, wherein the first phosphor layer is positioned between the transparent substrate and the transparent mount; an LED chip, mounted on an area of the transparent mount, wherein the area is located substantially between the trenches; and a second phosphor layer inside the trenches.Type: ApplicationFiled: September 23, 2014Publication date: April 9, 2015Inventors: TZER-PERNG CHEN, TZU-CHI CHENG
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Patent number: 9000461Abstract: An optoelectronic element includes an optoelectronic unit having a first top surface, a first bottom surface opposite to the first top surface, and a lateral surface between the first top surface and the first bottom surface; a first transparent structure covering the lateral surface and exposing the first top surface of the optoelectronic unit; a first insulating layer on the first top surface and the first transparent structure; a second insulating layer on the first insulating layer; a first opening through the first insulating layer and the second insulating layer; and a first conductive layer on the second insulating layer and electrically connecting to the optoelectronic unit via the first opening.Type: GrantFiled: August 9, 2011Date of Patent: April 7, 2015Assignee: Epistar CorporationInventors: Cheng-Nan Han, Tsung-Xian Lee, Min-Hsun Hsieh, Hung-Hsuan Chen, Hsin-Mao Liu, Hsing-Chao Chen, Ching-San Tao, Chih-Peng Ni, Tzer-Perng Chen, Jen-Chau Wu
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Publication number: 20150070871Abstract: Disclosed are LED assemblies and their applications. An example LED assembly has an LED chip, a supportive structure and a transparent structure. The LED chip includes a transparent substrate, at least one LED cell, and two pads. The transparent substrate has a top surface with two terminals. The LED cell is formed on the top surface, and includes at least one light-emitting stack configured to emit light. The pad is formed on the top surface at the two terminals. The supportive structure has a transparent portion and a conductive portion. The conductive portion is connected to the transparent portion to fix the LED chip and supply electric power to at least one of the pads. The transparent structure encapsulates the LED cell.Type: ApplicationFiled: August 15, 2014Publication date: March 12, 2015Inventors: Tzer-Perng CHEN, Tzu-Chi CHENG
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Publication number: 20140361319Abstract: An integrated lighting apparatus comprises a first control device including a semiconductor substrate, an integrated circuit block formed above a first portion of the semiconductor substrate, and a plurality of power pads formed above the integrated circuit block; a first light emitting device formed above a second portion of the semiconductor substrate; and a through plug passing through the semiconductor substrate for electrically connecting the first control device and the first light emitting device.Type: ApplicationFiled: August 22, 2014Publication date: December 11, 2014Inventors: Hsin-Mao LIU, Min-Hsun HSIEH, Tzer-Perng CHEN, Meng-Yuan HONG, Cheng Nan HAN, Tsung-Xian LEE, Ta-Cheng HSU, Chih-Chiang LU
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Patent number: 8816508Abstract: An integrated lighting apparatus includes at least a lighting device, a control device comprising an integrated circuit, and a connector that is used to electrically connect the lighting device and the control device. With the combination, the integrated circuit drives the lighting device in accordance with its various designed functionality, thus expands applications of the integrated lighting apparatus.Type: GrantFiled: July 20, 2011Date of Patent: August 26, 2014Assignee: Epistar CorporationInventors: Hsin-Mao Liu, Min-Hsun Hsieh, Tzer-Perng Chen, Meng-Yuan Hong, Cheng Nan Han, Tsung-Xian Lee, Ta-Cheng Hsu, Chih-Chiang Lu
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Patent number: 8816386Abstract: A flip-chip LED including a light emitting structure, a first dielectric layer, a first metal layer, a second metal layer, and a second dielectric layer is provided. The light emitting structure includes a first conductive layer, an active layer, and a second conductive layer. The active layer is disposed on the first conductive layer, and the second conductive layer is disposed on the active layer. The first metal layer is disposed on the light emitting structure and is contact with the first conductive layer, and part of the first metal layer is disposed on the first dielectric layer. The second metal layer is disposed on the light emitting structure and is in contact with the second conductive layer, and part of the second metal layer is disposed on the first dielectric layer. The second dielectric layer is disposed on the first dielectric layer. The first conductive layer includes a rough surface so as to improve a light extraction efficiency.Type: GrantFiled: January 16, 2014Date of Patent: August 26, 2014Assignee: Epistar CorporationInventors: Tzer-Perng Chen, Jen-Chau Wu, Chuan-Cheng Tu, Yuh-Ren Shieh
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Publication number: 20140186979Abstract: The present disclosure provides a method for forming a light-emitting apparatus, comprising providing a first board having a plurality of first metal contacts, providing a substrate, forming a plurality of light-emitting stacks and trenches on the substrate, wherein the light-emitting stacks are apart from each other by the plurality of the trenches, bonding the light-emitting stacks to the first board, forming an encapsulating material commonly on the plurality of the light-emitting stacks, and cutting the first board and the encapsulating material to form a plurality of chip-scale LED units.Type: ApplicationFiled: November 18, 2013Publication date: July 3, 2014Applicant: EPISTAR CORPORATIONInventors: Chuan-Cheng TU, Jen-Chau WU, Yuh-Ren SHIEH, Tzer-Perng CHEN, Min-Hsun HSIEH
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Publication number: 20140131760Abstract: A flip-chip LED including a light emitting structure, a first dielectric layer, a first metal layer, a second metal layer, and a second dielectric layer is provided. The light emitting structure includes a first conductive layer, an active layer, and a second conductive layer. The active layer is disposed on the first conductive layer, and the second conductive layer is disposed on the active layer. The first metal layer is disposed on the light emitting structure and is contact with the first conductive layer, and part of the first metal layer is disposed on the first dielectric layer. The second metal layer is disposed on the light emitting structure and is in contact with the second conductive layer, and part of the second metal layer is disposed on the first dielectric layer. The second dielectric layer is disposed on the first dielectric layer. The first conductive layer includes a rough surface so as to improve a light extraction efficiency.Type: ApplicationFiled: January 16, 2014Publication date: May 15, 2014Applicant: EPISTAR CORPORATIONInventors: Tzer-Perng CHEN, Jen-Chau WU, Chuan-Cheng TU, Yuh-Ren SHIEH