Patents by Inventor Tzong-Hann Yang

Tzong-Hann Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding package components through plating
    Patent number: 10840212
    Abstract: A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: November 17, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu
  • Bonding Package Components Through Plating
    Publication number: 20200020662
    Abstract: A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
    Type: Application
    Filed: September 24, 2019
    Publication date: January 16, 2020
    Inventors: Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu
  • Bonding package components through plating
    Patent number: 10483230
    Abstract: A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: November 19, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu
  • Bonding Package Components Through Plating
    Publication number: 20170294402
    Abstract: A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
    Type: Application
    Filed: June 26, 2017
    Publication date: October 12, 2017
    Inventors: Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu
  • Bonding package components through plating
    Patent number: 9691738
    Abstract: A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: June 27, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu
  • Adjusting sizes of connectors of package components
    Patent number: 9430605
    Abstract: A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: August 30, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang, Hung-Jui Kuo, Chung-Shi Liu
  • Bonding Package Components Through Plating
    Publication number: 20150364449
    Abstract: A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
    Type: Application
    Filed: August 24, 2015
    Publication date: December 17, 2015
    Inventors: Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu
  • Adjusting Sizes of Connectors of Package Components
    Publication number: 20150347663
    Abstract: A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.
    Type: Application
    Filed: August 13, 2015
    Publication date: December 3, 2015
    Inventors: Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang, Hung-Jui Kuo, Chung-Shi Liu
  • Bonding package components through plating
    Patent number: 9117772
    Abstract: A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: August 25, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu
  • Adjusting sizes of connectors of package components
    Patent number: 9111064
    Abstract: A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: August 18, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang, Hung-Jui Kuo, Chung-Shi Liu
  • Adjusting Sizes of Connectors of Package Components
    Publication number: 20140308764
    Abstract: A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.
    Type: Application
    Filed: June 27, 2014
    Publication date: October 16, 2014
    Inventors: Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang, Hung-Jui Kuo, Chung-Shi Liu
  • Adjusting sizes of connectors of package components
    Patent number: 8791579
    Abstract: A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: July 29, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang, Hung-Jui Kuo, Chung-Shi Liu
  • Bonding Package components Through Plating
    Publication number: 20130334692
    Abstract: A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
    Type: Application
    Filed: June 19, 2012
    Publication date: December 19, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu
  • Metal bump formation
    Patent number: 8501615
    Abstract: A system and method for forming metal bumps is provided. An embodiment comprises attaching conductive material to a carrier medium and then contacting the conductive material to conductive regions of a substrate. Portions of the conductive material are then bonded to the conductive regions using a bonding process to form conductive caps on the conductive regions, and residual conductive material and the carrier medium are removed. A reflow process is used to reflow the conductive caps into conductive bumps.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: August 6, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Da Cheng, Chih-Wei Lin, Hsiu-Jen Lin, Tzong-Hann Yang, Wen-Hsiung Lu, Zheng-Yi Lim, Yi-Wen Wu, Chung-Shi Liu
  • Adjusting Sizes of Connectors of Package Components
    Publication number: 20130127059
    Abstract: A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.
    Type: Application
    Filed: November 17, 2011
    Publication date: May 23, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Lai, Ming-Che Ho, Tzong-Hann Yang, Chien Rhone Wang, Chia-Tung Chang, Hung-Jui Kuo, Chung-Shi Liu
  • Metal Bump Formation
    Publication number: 20120322255
    Abstract: A system and method for forming metal bumps is provided. An embodiment comprises attaching conductive material to a carrier medium and then contacting the conductive material to conductive regions of a substrate. Portions of the conductive material are then bonded to the conductive regions using a bonding process to form conductive caps on the conductive regions, and residual conductive material and the carrier medium are removed. A reflow process is used to reflow the conductive caps into conductive bumps.
    Type: Application
    Filed: June 15, 2011
    Publication date: December 20, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Da Cheng, Chih-Wei Lin, Hsiu-Jen Lin, Tzong-Hann Yang, Wen-Hsiung Lu, Zheng-Yi Lim, Yi-Wen Wu, Chung-Shi Liu