Patents by Inventor Tzu-Ching Hung

Tzu-Ching Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190113117
    Abstract: A roller screw structure includes a screw rod, a nut set and planetary rollers. The screw rod includes an outer thread portion having first and second side-recession portions. The nut set includes an inner thread portion having third and fourth side-recession portions. The planetary roller includes a roller-thread portion having first and second side-protrusion portions. In assembling, the first and second side-protrusion portions are tightly engaged with the first and second side-recession portions, with the first and second side-protrusion portions tightly engaging with the third and fourth side-recession portions synchronously.
    Type: Application
    Filed: October 16, 2017
    Publication date: April 18, 2019
    Inventor: Tzu-Ching Hung
  • Publication number: 20180086952
    Abstract: An adhesive composition is provided. The adhesive composition includes a mixture (A), wherein the mixture (A) includes a first component (a), a cross-linking agent (b), and a second component (c), wherein the second component (c) includes a calcium-containing complex compound or a calcium-containing compound. Based on the total weight of the mixture (A), a content of the first component (a) is from 40 to 80 wt %, a content of the cross-linking agent (b) is from 20 to 60 wt %, and a content of the second component (c) is from 1 to 20 wt %. Specifically, the calcium-containing complex compound is selected from the group consisting of a compound represented by formula (1), a compound represented by formula (2), a compound represented by formula (3), and a compound represent by formula (4), and the calcium-containing compound is selected from the group consisting of a compound represented by formula (5) and a compound represent by formula (6).
    Type: Application
    Filed: November 22, 2016
    Publication date: March 29, 2018
    Applicant: TAIFLEX Scientific Co., Ltd.
    Inventors: I-Ling Teng, Tzu-Ching Hung, Chiao-Pei Chen, Yu-Hsien Lee, Tsung-Tai Hung, Bo-Sheng Wang, Cheng-Yen Hsiao, Chen-Hsin Huang
  • Patent number: 9694569
    Abstract: A polyimide metal laminated plate has a first metallic film, a first thermoplastic polyimide film laminated on a surface of the first metallic film, a first thermosetting polyimide film laminated on a surface of the first thermoplastic polyimide film distal from the first metallic film, and a second thermoplastic polyimide film laminated on a surface of the first thermosetting polyimide film distal from the first thermoplastic polyimide film. The polyimide metal laminated plate has no adhesive layer, so the polyimide metal laminated plate not only has good heat resistance, flame resistance, anti-chemical properties, and dimensional stability, but also meets the thinning tendency of FPCB. In addition, by the first thermosetting polyimide film and the second thermoplastic polyimide film having a water vapor transmission rate equal to or more than 170 g-?m/m2-day, the delamination and whitening of the polyimide metal laminated plate is prevented.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: July 4, 2017
    Assignee: Taiflex Scientific Co., Ltd.
    Inventors: Ching-Hung Huang, Kuang-Ting Hsueh, Tzu-Ching Hung, Hui-Chen Huang
  • Patent number: 9321224
    Abstract: An infrared absorption film includes a polymer resin substrate, a polymer dispersant and an infrared absorption material. The infrared absorption material has a plurality of tungsten oxide and/or composite tungsten oxide nanoparticles dispersed in the polymer resin substrate by the polymer dispersant, wherein a weight ratio of the polymer dispersant to the infrared absorption material is between 0.3 and 0.6.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: April 26, 2016
    Assignee: TAIFLEX Scientific Co., Ltd.
    Inventors: Chia-Che Chuang, Yu-Chih Kao, Chen-Kuo Lu, Kuan-Yu Li, Tzu-Ching Hung, Chiu-Feng Chen
  • Publication number: 20160088728
    Abstract: An insulation film of a signal transmission line includes a substrate layer, and a bonding layer arranged on the substrate layer for directly covering metal conductors of the signal transmission line, wherein the bonding layer is made of a polyolefin copolymer resin or a polyolefin resin mixture.
    Type: Application
    Filed: November 3, 2014
    Publication date: March 24, 2016
    Inventors: Fu-Min Wang, Tsung-Tai Hung, I-Ling Teng, Feng-Jung Tien, Yu-Hsien Lee, Tzu-Ching Hung
  • Patent number: 9285680
    Abstract: A photosensitive polyimide composition; the composition comprises a base agent and a curing agent comprising a photoinitiator. By applying an aliphatic diamine monomer, which has a long carbon chain, and a grafting monomer, which has a main carbon chain having a double bond and an epoxy group at two ends respectively, to a method of making the base agent, a mixture of the base agent and the curing agent can be screen printed to form a photosensitive polyimide film on a copper foil. Also, the photosensitive polyimide film can be exposed under low exposure energy, and can be developed to a solder-resistant polyimide thin film by a weak alkaline developer after exposed. In addition, the solder-resistant polyimide thin film has low dielectric constant, low dielectric loss, good flame resistance, good solder resistance, and good pencil hardness. Accordingly, the photosensitive polyimide composition is applicable to high density flexible printed circuit boards.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: March 15, 2016
    Assignee: Taiflex Scientific Co., Ltd.
    Inventors: Shih-Chang Lin, Hsiu-Ming Chang, Tzu-Ching Hung
  • Publication number: 20160067932
    Abstract: An infrared absorption film includes a polymer resin substrate, a polymer dispersant and an infrared absorption material. The infrared absorption material has a plurality of tungsten oxide and/or composite tungsten oxide nanoparticles dispersed in the polymer resin substrate by the polymer dispersant, wherein a weight ratio of the polymer dispersant to the infrared absorption material is between 0.3 and 0.6.
    Type: Application
    Filed: October 15, 2014
    Publication date: March 10, 2016
    Inventors: Chia-Che Chuang, Yu-Chih Kao, Chen-Kuo Lu, Kuan-Yu Li, Tzu-Ching Hung, Chiu-Feng Chen
  • Patent number: 9279057
    Abstract: A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic acid group, and an anhydride monomer having a carboxylic acid group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a polyimide; and mixing the polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.
    Type: Grant
    Filed: May 6, 2014
    Date of Patent: March 8, 2016
    Assignee: Taiflex Scientific Co., Ltd.
    Inventors: Hsiu-Ming Chang, Shih-Chang Lin, Tzu-Ching Hung
  • Publication number: 20160053055
    Abstract: A method of making a soluble thermoplastic polyimide composition, which comprises the steps of: polymerizing a first diamine, a second diamine different from the first diamine, and a dianhydride in a polar aprotic solvent to obtain a polyamine acid, wherein the first diamine contains a carboxyl group; and imidizing the polyamine acid to obtain the composition, wherein the composition contains the carboxyl group. By controlling the content of the dianhydride within a range from 85 mol. % to 99 mol. % based on the total content of the first diamine and the second diamine, the soluble thermoplastic polyimide composition made from the method can be laminated with a commercial polyimide film and a metal foil via simple steps of coating, drying, and pressing, to form a polyimide metal laminate. Therefore, by utilizing the soluble thermoplastic polyimide composition made from the method, making a polyimide metal laminate is simple and economical.
    Type: Application
    Filed: October 9, 2014
    Publication date: February 25, 2016
    Inventors: Tzu-Ching Hung, Ching-Hung Huang, Kuang-Ting Hsueh
  • Publication number: 20160018733
    Abstract: A photosensitive polyimide composition; the composition comprises a base agent and a curing agent comprising a photoinitiator. By applying an aliphatic diamine monomer, which has a long carbon chain, and a grafting monomer, which has a main carbon chain having a double bond and an epoxy group at two ends respectively, to a method of making the base agent, a mixture of the base agent and the curing agent can be screen printed to form a photosensitive polyimide film on a copper foil. Also, the photosensitive polyimide film can be exposed under low exposure energy, and can be developed to a solder-resistant polyimide thin film by a weak alkaline developer after exposed. In addition, the solder-resistant polyimide thin film has low dielectric constant, low dielectric loss, good flame resistance, good solder resistance, and good pencil hardness. Accordingly, the photosensitive polyimide composition is applicable to high density flexible printed circuit boards.
    Type: Application
    Filed: July 16, 2014
    Publication date: January 21, 2016
    Inventors: Shih-Chang Lin, Hsiu-Ming Chang, Tzu-Ching Hung
  • Publication number: 20150367606
    Abstract: A polyimide metal laminated plate has a first metallic film, a first thermoplastic polyimide film laminated on a surface of the first metallic film, a first thermosetting polyimide film laminated on a surface of the first thermoplastic polyimide film distal from the first metallic film, and a second thermoplastic polyimide film laminated on a surface of the first thermosetting polyimide film distal from the first thermoplastic polyimide film. The polyimide metal laminated plate has no adhesive layer, so the polyimide metal laminated plate not only has good heat resistance, flame resistance, anti-chemical properties, and dimensional stability, but also meets the thinning tendency of FPCB. In addition, by the first thermosetting polyimide film and the second thermoplastic polyimide film having a water vapor transmission rate equal to or more than 170 g-?m/m2-day, the delamination and whitening of the polyimide metal laminated plate is prevented.
    Type: Application
    Filed: June 24, 2014
    Publication date: December 24, 2015
    Inventors: Ching-Hung Huang, Kuang-Ting Hsueh, Tzu-Ching Hung, Hui-Chen Huang
  • Publication number: 20150346402
    Abstract: The near-infrared radiation absorbing masterbatch provided is prepared by melt-extruding a mixture comprising near-infrared radiation absorbing particles and a first polymer. The particles have a near-infrared absorption at a wavelength ranging from 0.7 ?m to 2 ?m and a far-infrared emissivity equal to or more than 0.85. The near-infrared light radiated by the particles has a wavelength ranging from 2 ?m to 22 ?m. Accordingly, the product made from the masterbatch, such as the near-infrared radiation absorbing fiber, plate, or film can not only absorb sunlight and store heat, but also radiate far-infrared light. Hence, the product has a thermal effect for keeping the human body warm and can serve as indoor and outdoor heat storing products at the same time.
    Type: Application
    Filed: August 6, 2014
    Publication date: December 3, 2015
    Inventors: Yu-Chih Kao, Chi-Yung Chang, Kuan-Yu Li, Tzu-Ching Hung
  • Publication number: 20150322274
    Abstract: A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic group, and an anhydride monomer having a carboxylic group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a modified polyimide; and mixing the modified polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.
    Type: Application
    Filed: May 6, 2014
    Publication date: November 12, 2015
    Applicant: TAIFLEX SCIENTIFIC CO., LTD.
    Inventors: Hsiu-Ming Chang, Shih-Chang Lin, Tzu-Ching Hung
  • Publication number: 20150257296
    Abstract: A cover layer of a printed circuit board has a polymer film, a reflective composite layer and an adhesive layer. The polymer film has a melting point greater than 260° C. The reflective composite layer is mounted on one side surface of the polymer film and has a first reflective pigment. The adhesive layer is mounted on another side surface of the polymer film. Also, at a range of wavelength where a reflectivity of the cover layer is greater than 89%, absorption of the polymer film to the same range of wavelength is less than 35%. The cover layer is laminated on a printed circuit board and after surface mount technology process at a temperature ranging from 160° C. to 320° C., the cover layer has a reflectivity over 89% without yellowing and delamination.
    Type: Application
    Filed: March 7, 2014
    Publication date: September 10, 2015
    Applicant: TAIFLEX SCIENTIFIC CO., LTD.
    Inventors: Tzu-Ching Hung, Yu-Chen Shih, Feng-Jung Tien, Chen-Kuo Lu, Yu-Hsien Lee, Su-Ping Wu
  • Publication number: 20150194553
    Abstract: A thermally conductive encapsulate comprising a thermally conductive composite layer having a thermal conductivity of 0.5 W/m*K to 8 W/m*K and an adhesive resin layer having a thermal conductivity of 0.05 W/m*K to 0.4 W/m*K is provided. A percentage of a thickness of the adhesive resin layer relative to a total thickness of the thermally conductive encapsulate ranges from 0.1% to 10%, and the thermally conductive encapsulate has an overall thermal impedance less than 0.72° C.-in2/W. Accordingly, the thermally conductive encapsulate not only provides sealing, insulating and adhesive properties, but also effectively dissipates the heat to the environment without increasing the thickness or volume of the solar cell module and without modifying the original encapsulation process, and thereby enhancing the solar cell module's conversion efficiency and increasing its power output.
    Type: Application
    Filed: January 8, 2014
    Publication date: July 9, 2015
    Applicant: TAIFLEX SCIENTIFIC CO., LTD.
    Inventors: FU-MIN WANG, I-LING TENG, TSUNG-TAI HUNG, YU-HSIEN LEE, TZU-CHING HUNG, CHEN-HSIN HUANG
  • Publication number: 20150108388
    Abstract: Provided is a light-absorbing composition, which is prepared by melt-extruding a mixture containing light-absorbing particle agglomerates and a polymer. The light-absorbing particle agglomerates comprises a dispersant and light-absorbing particles capped with the dispersant, and the light-absorbing particle agglomerates dispersed in the light-absorbing composition and have an average particle size ranging from 10 nanometers to 800 nanometers. Accordingly, the light-absorbing composition can effectively absorb near-infrared light and store infrared heat, and thereby providing infrared-absorbing, heat-insulating and heat-storing abilities. Furthermore, a light-absorbing structure made from the light-absorbing composition has good transparency, higher infrared absorbance, light-absorbing and heat-releasing efficiencies, and is thereby beneficial to keep the temperature equilibrium of buildings or vehicles.
    Type: Application
    Filed: October 21, 2013
    Publication date: April 23, 2015
    Applicant: Taiflex Scientific Co., Ltd.
    Inventors: Yu-Chih Kao, Chen-Kuo Lu, Tzu-Ching Hung
  • Publication number: 20140370263
    Abstract: A plasticizable heat-insulating composition compatible with polyvinyl acetal resins and mixed with polyvinyl acetal resin for forming a mixture for a plasticizing process for making a transparent intermediate heat-insulating sheet, as well as a transparent heat-insulating sandwich-structured panel that demonstrates high transparency, high wide-range near infrared absorbance and high heat-insulation index, so as to improve their heat-insulating and energy-saving functions.
    Type: Application
    Filed: September 5, 2013
    Publication date: December 18, 2014
    Applicant: Taiflex Scientific Co., Ltd.
    Inventors: Chen-Kuo LU, Yu-Chih KAO, Chia-Che CHUANG, Tzu-Ching HUNG
  • Patent number: 8415004
    Abstract: A method for manufacturing a low thermal-impedance insulated metal substrate has steps of providing an electrical-conductive metal layer; forming a first thermal-conductive polymeric composite layer on the electrical-conductive metal layer; forming a second thermal-conductive polymeric composite layer on the first thermal-conductive polymeric composite layer; and adhere a thermal-conductive metal layer on the second thermal-conductive polymeric composite layer by hot-pressing process. Therefore, the low thermal-impedance insulated metal substrate of the present invention has lower thermal-impedance, lower coefficient of thermal expansion and higher electrical reliability.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: April 9, 2013
    Assignee: Taiflex Scientific Co., Ltd.
    Inventors: Yu-Hsien Lee, Chen-Hsin Huang, Feng-Jung Tien, Tzu-Ching Hung
  • Publication number: 20110111191
    Abstract: A method for manufacturing a low thermal-impedance insulated metal substrate has steps of providing an electrical-conductive metal layer; forming a first thermal-conductive polymeric composite layer on the electrical-conductive metal layer; forming a second thermal-conductive polymeric composite layer on the first thermal-conductive polymeric composite layer; and adhere a thermal-conductive metal layer on the second thermal-conductive polymeric composite layer by hot-pressing process. Therefore, the low thermal-impedance insulated metal substrate of the present invention has lower thermal-impedance, lower coefficient of thermal expansion and higher electrical reliability.
    Type: Application
    Filed: November 12, 2009
    Publication date: May 12, 2011
    Inventors: Yu-Hsien Lee, Chen-Hsin Huang, Feng-Jung Tien, Tzu-Ching Hung
  • Patent number: 6709741
    Abstract: The present invention discloses an adhesive composition for flexible printed circuit board comprising the following component: (a) an epoxy resin; (b) an accelerator having a structure of one of the following general formulas: wherein, E represents sulfur, nitrogen or phosphorus; Ar represents an aromatic ring; R1 is the same or different and represents a substituted or unsubatituted monovalent hydrocarbon group, a hydroxyl group, an alkoxy group, a nitro group, a cyano group or a halogen atom; R2 and R3 each represents a hydrogen atom and a methyl group; R4 is the same or different and represents a substituted or unsubstituted monovalent hydrocarbon group; R5 represents a substituted or unsubstituted pyridinium group; a represents an integer of 0 to 2; and b represents 2 to 3; (c) a nitrile rubber having carboxyl groups, and a carboxyl terminated butadiene acrylonitrile is preferred; and (d) an inorganic filler, an aluminum hydroxide is preferred.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: March 23, 2004
    Assignee: Taiflex Scientific Co., Ltd.
    Inventors: Fu-Le Lin, Ching-Ping Chen, Tzu-Ching Hung, Sung-Chen Huang, Kuo-Hua Yu, Kuo-Hsiung Hsia, Yen-Chi Liu