Patents by Inventor Tzu-Hsien Chang

Tzu-Hsien Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11151724
    Abstract: An automatic detecting method and an automatic detecting apparatus using the same are provided. The automatic detecting apparatus includes an inputting unit, a dividing unit, a contouring unit, a range analyzing unit, a boundary analyzing unit, an edge detecting unit, an expanding unit and an overlapping unit. The dividing unit is used for dividing an overlooking image into four clusters via a clustering algorithm. The contouring unit is used for obtaining a contour. The range analyzing unit is used for obtaining a detecting range. The boundary analyzing unit is used for obtaining a circular boundary in the detecting range. The edge detecting unit is used for obtaining a plurality of edges in the circular boundary. The expanding unit is used for expanding the edges to obtain a plurality of expanded edges. The overlapping unit is used for overlapping the expanded edges and the contour to obtain a defect pattern.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: October 19, 2021
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Tzu-Ping Kao, Ching-Hsing Hsieh, Chia-Chi Chang, Ju-Te Chen, Chen-Hui Huang, Cheng-Hsien Chen
  • Publication number: 20210298210
    Abstract: An electronic device is provided, which is for coupling to another electronic device in a side-by-side manner, and the electronic device includes a substrate, a first thermal dissipation sheet and a thermal dissipation element. The substrate includes a first surface and a second surface. The first thermal dissipation sheet is disposed on the first surface. The thermal dissipation element is disposed on the substrate. The first thermal dissipation sheet is disposed between the thermal dissipation element and the substrate, and the thermal dissipation element at least partially overlaps the first thermal dissipation sheet.
    Type: Application
    Filed: February 22, 2021
    Publication date: September 23, 2021
    Inventors: Wan-Ling HUANG, Tzu-Yuan LIN, Geng-Fu CHANG, Chun-Hsien LIN, Shu-Ming KUO, Jui-Feng KO, Tsau-Hua HSIEH
  • Publication number: 20210280695
    Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin and a second fin on a substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes a liner on a first sidewall of the first fin, and an insulating fill material on a sidewall of the liner and on a second sidewall of the first fin. The liner is further on a surface of the first fin between the first sidewall of the first fin and the second sidewall of the first fin.
    Type: Application
    Filed: May 20, 2021
    Publication date: September 9, 2021
    Inventors: Ryan Chia-Jen Chen, Li-Wei Yin, Tzu-Wen Pan, Cheng-Chung Chang, Shao-Hua Hsu, Yi-Chun Chen, Yu-Hsien Lin, Ming-Ching Chang
  • Patent number: 11114549
    Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin and a second fin on a substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes a liner on a first sidewall of the first fin, and an insulating fill material on a sidewall of the liner and on a second sidewall of the first fin. The liner is further on a surface of the first fin between the first sidewall of the first fin and the second sidewall of the first fin.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: September 7, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ryan Chia-Jen Chen, Ming-Ching Chang, Yi-Chun Chen, Yu-Hsien Lin, Li-Wei Yin, Tzu-Wen Pan, Cheng-Chung Chang, Shao-Hua Hsu
  • Patent number: 11097941
    Abstract: A method includes forming a recess in a first substrate, bonding a micro-electro-mechanical systems (MEMS) substrate to the first substrate after forming the recess in the first substrate, forming an anti-stiction layer over the micro-electro-mechanical systems (MEMS) substrate, pattering the anti-stiction layer, etching the MEMS substrate to form a MEMS device, and bonding the MEMS device and the first substrate to a second substrate. The patterned anti-stiction layer is between the MEMS device and the second substrate.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: August 24, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Hsien Chang, Tzu-Heng Wu, Chun-Ren Cheng, Shih-Wei Lin, Jung-Kuo Tu
  • Publication number: 20160360912
    Abstract: A water bottle carrier contains: a body. The body includes a first part and a second part which are connected together to define an accommodating chamber, and the first part and the second part are removed from each other. The first part has a first cover and a first flexible pad formed on an inner wall of the first cover, and the first flexible pad has two first flexible protrusions arranged proximate to an upper end and a lower end of an inner wall thereof. The second part has a second cover and a second flexible pad formed on an inner wall of the second cover, and the second flexible pad has two second flexible protrusions arranged adjacent to an upper end and a lower end of an inner wall thereof.
    Type: Application
    Filed: June 15, 2015
    Publication date: December 15, 2016
    Inventor: Tzu-Hsien Chang