Abstract: A device is provided, including: a first device package including: a first redistribution structure including a first redistribution line and a second redistribution line; a die on the first redistribution structure; a first via coupled to a first side of the first redistribution line; a second via coupled to a first side of the second redistribution line and extending through the second redistribution line; an encapsulant surrounding the die, the first via, and the second via; and a second redistribution structure over the encapsulant, the second redistribution structure electrically connected to the die, the first via, and the second via; a first conductive connector coupled to a second side of the first redistribution line, the first conductive connector disposed along a different axis than a longitudinal axis of the first via; and a second conductive connector coupled to a second side of the second redistribution line, the second conductive connector disposed along a longitudinal axis of the second via.

Abstract: In an embodiment, a device includes: a conductive shield on a first dielectric layer; a second dielectric layer on the first dielectric layer and the conductive shield, the first and second dielectric layers surrounding the conductive shield, the second dielectric layer including: a first portion disposed along an outer periphery of the conductive shield; a second portion extending through a center region of the conductive shield; and a third portion extending through a channel region of the conductive shield, the third portion connecting the first portion to the second portion; a coil on the second dielectric layer, the coil disposed over the conductive shield; an integrated circuit die on the second dielectric layer, the integrated circuit die disposed outside of the coil; and an encapsulant surrounding the coil and the integrated circuit die, top surfaces of the encapsulant, the integrated circuit die, and the coil being level.

Abstract: A device is provided, including: a first device package including: a first redistribution structure including a first redistribution line and a second redistribution line; a die on the first redistribution structure; a first via coupled to a first side of the first redistribution line; a second via coupled to a first side of the second redistribution line and extending through the second redistribution line; an encapsulant surrounding the die, the first via, and the second via; and a second redistribution structure over the encapsulant, the second redistribution structure electrically connected to the die, the first via, and the second via; a first conductive connector coupled to a second side of the first redistribution line, the first conductive connector disposed along a different axis than a longitudinal axis of the first via; and a second conductive connector coupled to a second side of the second redistribution line, the second conductive connector disposed along a longitudinal axis of the second via.

Abstract: A semiconductor device package is provided, including a semiconductor device, a magnetic flux generation unit, a molding material, and a conductive slot. The magnetic flux generation unit is surrounding an axis and configured to produce magnetic flux passes through the magnetic flux generation unit. The molding material is surrounding the semiconductor device and the magnetic flux generation unit. The conductive slot is positioned over the molding material, wherein an opening is formed on the conductive slot, and the axis passes through the opening.

Abstract: A method for packaging a semiconductor device used in an electronic apparatus having wireless charging function is provided. The method includes coupling a semiconductor device and a coil over a redistribution layer. The method further includes forming a molding material over the semiconductor device and the coil. The method also includes forming a conductive metal slot over the molding material. An opening is formed on the conductive metal slot for allowing magnetic flux to pass through.

Abstract: Coil structures and methods of forming are provided. The coil structure includes a substrate. A plurality of coils is disposed over the substrate, each coil comprising a conductive element that forms a continuous spiral having a hexagonal shape in a plan view of the coil structure. The plurality of coils is arranged in a honeycomb pattern, and each conductive element is electrically connected to an external electrical circuit.

Abstract: A method for packaging a semiconductor device used in an electronic apparatus having wireless charging function is provided. The method includes coupling a semiconductor device and a coil over a redistribution layer. The method further includes forming a molding material over the semiconductor device and the coil. The method also includes forming a conductive metal slot over the molding material. An opening is formed on the conductive metal slot for allowing magnetic flux to pass through.

Abstract: A network interface card frame comprises chiefly an upper and a lower cover with a metal plate embedded inside respectively and a circuit board encapsulated between the two covers. At both lateral sides of metal plates designed a continuous first folding and second folding rim, a plurality of holes disposed on the second folding rim in order to make metal plates firmly secured within upper and lower plastic frame. At perimeter of the lower connection section of upper cover, a convex edge arranged there with an exterior angle on it. And a concave edge is mounted on the upper connection section of lower cover, corresponding to the convex edge, with a lead angle formed on the interior angle of the concave edge. The exterior angle of convex edge on upper cover could be mounted on the lead angle of the concave edge on lower cover, then the two covers are welded together by using sonic welding so as to avoid welding material spilling over on the surface of interface card.