Patents by Inventor Tzu-Wei Huang

Tzu-Wei Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11218721
    Abstract: A method and apparatus of Inter prediction for video coding using Multi-hypothesis (MH) are disclosed. If an MH mode is used for the current block: at least one MH candidate is derived using reduced reference data by adjusting at least one coding-control setting; an Inter candidate list is generated, where the Inter candidate list comprises said at least one MH candidate; and current motion information associated with the current block is encoded using the Inter candidate list at the video encoder side or the current motion information associated with the current block is decoded at the video decoder side using the Merge candidate list. The coding control setting may correspond to prediction direction setting, filter tap setting, block size of reference block to be fetched, reference picture setting or motion limitation setting.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: January 4, 2022
    Assignee: MEDIATEK INC.
    Inventors: Man-Shu Chiang, Chih-Wei Hsu, Tzu-Der Chuang, Ching-Yeh Chen, Yu-Wen Huang
  • Publication number: 20210400550
    Abstract: A communications apparatus and associated method communicating with at least one cellular network includes a radio transceiver and a processor. The communications apparatus includes a a radio transceiver, capable of transmitting or receiving wireless radio frequency signals to or from a cellular network; and a processor. The processor is configured to: receive an incoming call request message that will trigger a Circuit Switch Fall Back (CSFB) procedure or a Evolved Packet System Fall Back (EPS FB) procedure from the cellular network via the radio transceiver, query a user to accept or reject the incoming call request before triggering the CSFB procedure or the EPS FB procedure, and determine whether to trigger the CSFB procedure or the EPS FB procedure based on a response to the query from the user.
    Type: Application
    Filed: September 3, 2021
    Publication date: December 23, 2021
    Inventors: Guan-Jie HUANG, Tzu-Wen CHANG, Kuan-Wei CHEN, Yu-Hua HUANG, Teng MA, Sheng-Kai CHANG
  • Publication number: 20210400311
    Abstract: Methods and apparatus of video processing for a video coding system using Neural Network (NN) are disclosed. According to this method, a shifted region is determined for the filter region to avoid unavailable reconstructed or filtered-reconstructed video data for the NN processing of the filter region, where boundaries of the shifted region comprises region boundaries derived by shifting target boundaries upward, leftward, or both upward and leftward, and wherein the target boundaries correspond to one or more top boundaries and one or more left boundaries of target processing region including the current block and one or more remaining un-processed blocks. According to another method, the areas outside boundaries of pictures, slices, tiles, or tile groups are padded. In yet another method, a flag is used to indicate whether the NN processing is allowed to cross a boundary between two slices, two tiles or two tile groups.
    Type: Application
    Filed: June 17, 2020
    Publication date: December 23, 2021
    Inventors: Yu-Ling HSIAO, Ching-Yeh CHEN, Tzu-Der CHUANG, Chih-Wei HSU, Yu-Wen HUANG
  • Patent number: 10804306
    Abstract: A solid-state imaging device having flat microlenses is provided. The solid-state imaging device includes a semiconductor substrate having a plurality of photoelectric conversion elements. The solid-state imaging device further includes a color filter layer disposed above the semiconductor substrate. The solid-state imaging device also includes a microlens having a flat top surface disposed on the color filter layer. The flat top surface of the microlens is directly above the photoelectric conversion element, and the area of the flat top surface of the microlens is equal to the area of the photoelectric conversion element.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: October 13, 2020
    Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Tzu-Wei Huang, Ji-Hong Lin, Huang-Jen Chen
  • Patent number: 10462431
    Abstract: An image sensor is provided. The image sensor includes a semiconductor substrate containing a plurality of photoelectric conversion elements. A color filter array is disposed above the semiconductor substrate. The color filter array includes a first color filter, a second color filter and a third color filter. The image sensor further includes an isolated partition disposed in the color filter array to surround one of the first, second and third color filters. The isolated partition has a refractive index that is lower than the refractive indexes of the first, second and third color filters.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: October 29, 2019
    Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Tzu-Wei Huang, Chi-Han Lin
  • Publication number: 20190123087
    Abstract: A solid-state imaging device having flat microlenses is provided. The solid-state imaging device includes a semiconductor substrate having a plurality of photoelectric conversion elements. The solid-state imaging device further includes a color filter layer disposed above the semiconductor substrate. The solid-state imaging device also includes a microlens having a flat top surface disposed on the color filter layer. The flat top surface of the microlens is directly above the photoelectric conversion element, and the area of the flat top surface of the microlens is equal to the area of the photoelectric conversion element.
    Type: Application
    Filed: November 30, 2018
    Publication date: April 25, 2019
    Inventors: Tzu-Wei HUANG, Ji-Hong LIN, Huang-Jen CHEN
  • Patent number: 10192916
    Abstract: Methods of fabricating solid-state imaging devices having a flat microlens array are provided. The method includes providing a semiconductor substrate having a plurality of photoelectric conversion elements. A color filter layer is formed above the semiconductor substrate. A lens material layer is formed on the color filter layer. A hard mask having a lens-shaped pattern is formed on the lens material layer. The method further includes etching both the hard mask and the lens material layer to form a microlens with a flat top surface that is formed from the lens material layer, and to leave a portion of the hard mask on the flat top surface of the microlens. The method also includes removing the portion of the hard mask that remains on the microlens.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: January 29, 2019
    Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Tzu-Wei Huang, Ji-Hong Lin, Huang-Jen Chen
  • Patent number: 10170511
    Abstract: A solid-state imaging device has a sensing region, a pad region and a peripheral region between the sensing region and the pad region. The solid-state imaging device includes a plurality of photoelectric conversion elements formed in a semiconductor substrate and disposed in the sensing region, and a bond pad disposed on the semiconductor substrate and in the pad region. The solid-state imaging device further includes a microlens layer disposed above the semiconductor substrate. The microlens layer includes a microlens array in the sensing region and a first dummy structure in the pad region. The first dummy structure includes a plurality of first microlens elements disposed to surround an area of the bond pad. Moreover, the solid-state imaging device includes a passivation film conformally formed on a top surface of the microlens layer.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: January 1, 2019
    Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Tzu-Wei Huang, Chi-Han Lin
  • Publication number: 20180358396
    Abstract: A solid-state imaging device has a sensing region, a pad region and a peripheral region between the sensing region and the pad region. The solid-state imaging device includes a plurality of photoelectric conversion elements formed in a semiconductor substrate and disposed in the sensing region, and a bond pad disposed on the semiconductor substrate and in the pad region. The solid-state imaging device further includes a microlens layer disposed above the semiconductor substrate. The microlens layer includes a microlens array in the sensing region and a first dummy structure in the pad region. The first dummy structure includes a plurality of first microlens elements disposed to surround an area of the bond pad. Moreover, the solid-state imaging device includes a passivation film conformally formed on a top surface of the microlens layer.
    Type: Application
    Filed: June 7, 2017
    Publication date: December 13, 2018
    Inventors: Tzu-Wei HUANG, Chi-Han LIN
  • Publication number: 20180358397
    Abstract: Methods of fabricating solid-state imaging devices having a flat microlens array are provided. The method includes providing a semiconductor substrate having a plurality of photoelectric conversion elements. A color filter layer is formed above the semiconductor substrate. A lens material layer is formed on the color filter layer. A hard mask having a lens-shaped pattern is formed on the lens material layer. The method further includes etching both the hard mask and the lens material layer to form a microlens with a flat top surface that is formed from the lens material layer, and to leave a portion of the hard mask on the flat top surface of the microlens. The method also includes removing the portion of the hard mask that remains on the microlens.
    Type: Application
    Filed: June 8, 2017
    Publication date: December 13, 2018
    Inventors: Tzu-Wei HUANG, Ji-Hong LIN, Huang-Jen CHEN
  • Publication number: 20180198125
    Abstract: A polymer coated cathode material not subject to catastrophic failure through local overheating comprises cathode active material particles and a polymer layer. The polymer layer wraps each cathode active material particle. The polymer coated cathode material has a core-shell structure. The core-shell structure comprises a core and a shell, the core is formed by the cathode active material particle, the shell is formed by the polymer layer. A battery made by the polymer coated cathode material is safer, in that when there is a short circuit, the short circuit only happens locally and a chain reaction is avoided. Only a part of the battery may reach high temperature, preventing an explosion of the battery. A cathode using the polymer coated cathode material, and a battery using the cathode are also provided.
    Type: Application
    Filed: December 25, 2017
    Publication date: July 12, 2018
    Inventors: JEI-WEI CHANG, TZU-WEI HUANG
  • Patent number: 9961784
    Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating layers are formed on the two metal layers. Two including upper and bottom conductive layers are formed on the two insulating layers. Then, the two insulating layers and the two conductive layers are laminated so that the two metal layers bonded to each other are embedded between the two insulating layers. A part of the two insulating layers and a part of the two conductive layers are removed to form a plurality of blind holes exposing the two metal layers. A conductive material is formed in the blind holes and on the remained two conductive layers. The sealed area of the two metal layers is separated to form two separated circuit substrates.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: May 1, 2018
    Assignee: Subtron Technology Co., Ltd.
    Inventor: Tzu-Wei Huang
  • Publication number: 20170208696
    Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating layers are formed on the two metal layers. Two including upper and bottom conductive layers are formed on the two insulating layers. Then, the two insulating layers and the two conductive layers are laminated so that the two metal layers bonded to each other are embedded between the two insulating layers. A part of the two insulating layers and a part of the two conductive layers are removed to form a plurality of blind holes exposing the two metal layers. A conductive material is formed in the blind holes and on the remained two conductive layers. The sealed area of the two metal layers is separated to form two separated circuit substrates.
    Type: Application
    Filed: March 31, 2017
    Publication date: July 20, 2017
    Applicant: Subtron Technology Co., Ltd.
    Inventor: Tzu-Wei Huang
  • Patent number: 9679933
    Abstract: An image sensor is provided. The image sensor includes a red (R) pixel, a green (G) pixel, a blue (B) pixel and an infrared (IR) pixel, and R, G and B filters respectively disposed at the R, G and B pixels. The image sensor also includes an IR pass filter disposed at the IR pixel and an IR filter stacked with the R, G and B filters, wherein the IR filter cuts off at least IR light with a specific wavelength. Furthermore, a method of forming an image sensor is also provided.
    Type: Grant
    Filed: October 6, 2014
    Date of Patent: June 13, 2017
    Assignee: VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Tzu-Wei Huang, Wei-Ko Wang, Chi-Han Lin
  • Patent number: 9655254
    Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating layers are formed on the two metal layers. Two including upper and bottom conductive layers are formed on the two insulating layers. Then, the two insulating layers and the two conductive layers are laminated so that the two metal layers bonded to each other are embedded between the two insulating layers. A part of the two insulating layers and a part of the two conductive layers are removed to form a plurality of blind holes exposing the two metal layers. A conductive material is formed in the blind holes and on the remained two conductive layers. The sealed area of the two metal layers is separated to form two separated circuit substrates.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: May 16, 2017
    Assignee: SUBTRON TECHNOLOGY CO. LTD.
    Inventor: Tzu-Wei Huang
  • Patent number: 9603263
    Abstract: A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a through hole passing through the sealed area is formed. Two insulating layers are formed on the two metal layers. Two conductive layers are formed on the two insulating layers. The two insulating layers and the two conductive layers are laminated to the two metal layers bonded to each other, wherein the metal layers are embedded between the two insulating layers, and the two insulating layers fill into the through hole. The sealed area of the two metal layers is separated to form two separated circuit substrates. Therefore, the thinner substrate can be operated in the following steps, such as patterning process or plating process. In addition, the method may be extended to manufacture the circuit substrate with odd-numbered layer or even-numbered layer.
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: March 21, 2017
    Assignee: Subtron Technology Co., Ltd.
    Inventors: Chih-Hong Chuang, Tzu-Wei Huang
  • Publication number: 20160301897
    Abstract: An image sensor is provided. The image sensor includes a semiconductor substrate containing a plurality of photoelectric conversion elements. A color filter array is disposed above the semiconductor substrate. The color filter array includes a first color filter, a second color filter and a third color filter. The image sensor further includes an isolated partition disposed in the color filter array to surround one of the first, second and third color filters. The isolated partition has a refractive index that is lower than the refractive indexes of the first, second and third color filters.
    Type: Application
    Filed: April 10, 2015
    Publication date: October 13, 2016
    Inventors: Tzu-Wei HUANG, Chi-Han LIN
  • Publication number: 20160210292
    Abstract: In one embodiment, the present invention is directed to a method implemented on a computer system of database retrieval including organizing and suggesting search results by style, not just product category. In one embodiment, a computer implemented smoothing algorithm is used to adjust the ranking feature calculations from insufficient data. The use of smoothing improves the statistical confidence of the ranking features, creating a product ranking that is robust to small sample bias.
    Type: Application
    Filed: January 19, 2016
    Publication date: July 21, 2016
    Inventors: Grace Tzu-Wei Huang, Phil Kallos
  • Publication number: 20160099280
    Abstract: An image sensor is provided. The image sensor includes a red (R) pixel, a green (G) pixel, a blue (B) pixel and an infrared (IR) pixel, and R, G and B filters respectively disposed at the R, G and B pixels. The image sensor also includes an IR pass filter disposed at the IR pixel and an IR filter stacked with the R, G and B filters, wherein the IR filter cuts off at least IR light with a specific wavelength. Furthermore, a method of forming an image sensor is also provided.
    Type: Application
    Filed: October 6, 2014
    Publication date: April 7, 2016
    Inventors: Tzu-WEI HUANG, Wei-Ko WANG, Chi-Han LIN
  • Patent number: D931363
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: September 21, 2021
    Assignee: FLYTECH TECHNOLOGY CO., LTD
    Inventors: Yi-Heng Tseng, Tung-Ying Lee, Tzu-Wei Huang, Che-Wei Lin