Abstract: An electronic system includes: a processor configured to access operation data; a local cache memory, coupled to the processor, configured to store a limited amount of the operation data; a memory controller, coupled to the local cache memory, configured to maintain a flow of the operation data; and a memory subsystem, coupled to the memory controller, including: a first tier memory configured to store the operation data, with critical timing, by a fast control bus, and a second tier memory configured to store the operation data with non-critical timing, by a reduced performance control bus.

Abstract: A nonvolatile memory device includes a nonvolatile memory, a volatile memory being a cache memory of the nonvolatile memory, and a first controller configured to control the nonvolatile memory. The nonvolatile memory device further includes a second controller configured to receive a device write command and an address, and transmit, to the volatile memory through a first bus, a first read command and the address and a first write command and the address sequentially, and transmit a second write command and the address to the first controller through a second bus, in response to the reception of the device write command and the address.

Abstract: A semiconductor memory device having a flexible refresh skip area includes a memory cell array including a plurality of rows to store data, a row decoder connected to the memory cell array, a refresh area storage unit to store a beginning address and an end address of a memory area that is to be refreshed in which the memory area that is to be refreshed does not include a refresh skip area having a size is selectively and/or adaptively changed, and a refresh control circuit connected to the row decoder and the refresh area storage unit. The refresh control circuit controls a refresh operation for the area that is to be refreshed and not for the refresh skip area.

Abstract: A semiconductor memory device capable of detecting a miscorrected bit generated in the semiconductor memory device outside the semiconductor memory device and a memory system including the semiconductor memory device are disclosed. The semiconductor memory device may generate first check bits based on first data received from the outside, divide an error correcting code (ECC) code word including the first data and the first check bits into a plurality of code word groups, and dispose a miscorrected bit, caused by error bits included in a first ECC code word group, in another ECC code word group rather than the first ECC code word group.

Abstract: A semiconductor memory cell array is provided which includes a first memory cell array area including first group memory cells arranged in a chip in a matrix of rows and columns and having a first operating speed; and a second memory cell array area including second group memory cells arranged in the chip in a matrix of rows and columns and having a second operating speed different from the first operating speed. The first and second memory cell array areas are accessed by addressing of a DRAM controller.

Abstract: A semiconductor memory device performs a modified read operation or a modified write operation. The semiconductor memory device includes a memory cell array, a read circuit, and a write circuit. The semiconductor memory device further includes an operation unit performing an operation on read data obtained by the read circuit according to operation assignment information applied through an address line to reduce memory access time when entering a modified read mode. In addition, the semiconductor memory device may optionally manage a normal read mode and the modified read mode and allow operation result data output from the operation unit to be written by the write circuit in the modified read mode.

Abstract: An embodiment includes a memory device, comprising: a memory configured to store data; a data interface; an error interface; and a controller coupled to the data interface, the error interface, and the memory. The controller is configured to transmit data stored in the memory through the data interface; and the controller is configured to transmit error information generated in response to correcting an error in data read from memory through the error interface.

Abstract: An embodiment includes a memory module, comprising: a module error interface; and a plurality of memory devices, each memory device coupled to the module error interface, including a data interface and an device error interface, and configured to communicate error information through the device error interface and the module error interface.

Abstract: Exemplary embodiments provide a tiered error correction code (ECC) Chipkill system, comprising: a device ECC incorporated into at least a portion of a plurality of memory devices that corrects n-bit memory device-level failures in the respective memory device, and transmits a memory device failure signal when any memory device-level failure is greater than n-bits and beyond correction capability of the device ECC device; and a system-level ECC device external to the plurality of memory devices is responsive to receiving the memory device failure signal to correct the memory device failure based on a system ECC parity.

Abstract: A semiconductor memory device performs a modified read operation or a modified write operation. The semiconductor memory device includes a memory cell array, a read circuit, and a write circuit. The semiconductor memory device further includes an operation unit performing an operation on read data obtained by the read circuit according to operation assignment information applied through an address line to reduce memory access time when entering a modified read mode. In addition, the semiconductor memory device may optionally manage a normal read mode and the modified read mode and allow operation result data output from the operation unit to be written by the write circuit in the modified read mode.

Abstract: A semiconductor memory cell array is provided which includes a first memory cell array area including first group memory cells arranged in a chip in a matrix of rows and columns and having a first operating speed; and a second memory cell array area including second group memory cells arranged in the chip in a matrix of rows and columns and having a second operating speed different from the first operating speed. The first and second memory cell array areas are accessed by addressing of a DRAM controller.

Abstract: An integrated circuit chip includes a plurality of independent FIFO memory devices that are each configured to support all four combinations of DDR and SDR write modes and DDR and SDR read modes and collectively configured to support all four multiplexer, demultiplexer, broadcast and multi-Q operating modes.

Abstract: An integrated circuit chip includes a plurality of independent FIFO memory devices that are each configured to support all four combinations of DDR and SDR write modes and DDR and SDR read modes and collectively configured to support all four multiplexer, demultiplexer, broadcast and multi-Q operating modes.