Patents by Inventor V Valiveti

V Valiveti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method with optimized polymer and metal structural components for electronic assembly
    Patent number: 10736247
    Abstract: A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: August 4, 2020
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Gokul Murugesan, Santosh Kustagi, Raghuveer Hanumanthrao Desai, V Valiveti
  • SYSTEM AND METHOD WITH OPTIMIZED POLYMER AND METAL STRUCTURAL COMPONENTS FOR ELECTRONIC ASSEMBLY
    Publication number: 20200187394
    Abstract: A system and method of constructing an electronic assembly. A structural component is identified as a candidate for forming as a combined construction of a metal element and a polymer element. A minimum material thickness required of the metal element for achieving a required electromagnetic shielding property is determined. A minimum area required of the metal element for achieving a required electrical bonding property is determined. A maximum polymer element proportion of the structural component that meets a required structural property and a required thermal property is determined. The structural component is designed with the metal element having the minimum material thickness and the minimum area and with the polymer element having the maximum polymer element proportion. The structural component is manufactured from the polymer element and the metal element to meet the mechanical and electrical properties, and the structural component in the electronic assembly.
    Type: Application
    Filed: December 6, 2018
    Publication date: June 11, 2020
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Gokul Murugesan, Santosh Kustagi, Raghuveer Hanumanthrao Desai, V Valiveti