Patents by Inventor Valeriy Y. Sukharev

Valeriy Y. Sukharev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6016009
    Abstract: A process of forming a tungsten contact plug, on an integrated circuit (IC), that is substantially free of seam formation is described. The process includes forming a dielectric layer on a surface of a substrate, forming a via in the dielectric layer, blanket depositing a first bulk layer of tungsten on the dielectric layer and partially filling the via, blanket depositing an amorphous or a microcrystalline layer of tungsten over the first bulk layer of tungsten such that growth of tungsten grains inside the via is effectively inhibited, and blanket depositing a second bulk layer of tungsten on the amorphous or microcrystalline layer.
    Type: Grant
    Filed: April 27, 1998
    Date of Patent: January 18, 2000
    Assignee: LSI Logic Corporation
    Inventors: Valeriy Y. Sukharev, David J. Heine
  • Patent number: 5804249
    Abstract: A process of forming a tungsten contact plug, on an integrated circuit (IC), that is substantially free of seam formation is described. The process includes forming a dielectric layer on a surface of a substrate, forming a via in the dielectric layer, blanket depositing a first bulk layer of tungsten on the dielectric layer and partially filling the via, blanket depositing an amorphous or a microcrystalline layer of tungsten over the first bulk layer of tungsten such that growth of tungsten grains inside the via is effectively inhibited, and blanket depositing a second bulk layer of tungsten on the amorphous or microcrystalline layer.
    Type: Grant
    Filed: February 7, 1997
    Date of Patent: September 8, 1998
    Assignee: LSI Logic Corporation
    Inventors: Valeriy Y. Sukharev, David J. Heine