Patents by Inventor Vance Murakami
Vance Murakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11632867Abstract: Example implementations relate to a cable management arm for a computing system. The cable management arm includes a pair of latches, a pair of first bars, and a second bar. The pair of latches is detachably connectable to a chassis of the computing system. Each first bar has a first end pivotably connected to a respective latch of the pair of latches, and a second end connected to the second bar for defining an open space therebetween. The open space provides a non-interfering entrance for accessing the one or more electronic components from rear side of the chassis. The second bar supports the cables connected to the one or more electronic components. The pair of first bars is pivotable relative to the pair of latches such that the second bar is movable to a plurality of preset positions for providing the clearance from the cables during service event, for instance.Type: GrantFiled: September 9, 2021Date of Patent: April 18, 2023Assignee: Hewlett Packard Enterprise Development LPInventors: Warren Kartadinata, Vance Murakami
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Publication number: 20230071067Abstract: Example implementations relate to a cable management arm for a computing system. The cable management arm includes a pair of latches, a pair of first bars, and a second bar. The pair of latches is detachably connectable to a chassis of the computing system. Each first bar has a first end pivotably connected to a respective latch of the pair of latches, and a second end connected to the second bar for defining an open space therebetween. The open space provides a non-interfering entrance for accessing the one or more electronic components from rear side of the chassis. The second bar supports the cables connected to the one or more electronic components. The pair of first bars is pivotable relative to the pair of latches such that the second bar is movable to a plurality of preset positions for providing the clearance from the cables during service event, for instance.Type: ApplicationFiled: September 9, 2021Publication date: March 9, 2023Inventors: Warren Kartadinata, Vance Murakami
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Patent number: 10271454Abstract: Examples relate to sliding rail assemblies comprising a first and a second slide rail wherein each slide rail comprises a main body and a guide rail. The main body has an inner surface to attach to an inner surface of the guide rail and an outer surface having an upper, a lower and a middle protrusion along the length of the main body. The upper and the middle protrusions define a dovetail socket and the middle and the lower protrusion define a dovetail. The main bodies of the first and the second slide rails are identical to each other. Each dovetail protrusion of the first slide rail slidably engages a corresponding dovetail protrusion of the second slide rail such that a cavity is formed between the respective guide rails.Type: GrantFiled: August 11, 2017Date of Patent: April 23, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: Robert Eugene Cayou, Vance Murakami, Paul Wes Stelter, Eugene Yan Ki Hsue
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Publication number: 20190090375Abstract: Examples herein relate to a keying device for inserting a module in a chassis. The device comprises a key plate having a protrusion adapted to interlock with a slot of the chassis and teeth to grip the module and an operating handle. The keying device permits insertion or ejection of the module in the chassis responsive to the protrusion interlocking the slot of the chassis when the operating handle is in an open position and the keying device rejects insertion or ejection of the module in the chassis responsive to the protrusion not interlocking the slot of the chassis when the operating handle is in a closed position.Type: ApplicationFiled: September 19, 2017Publication date: March 21, 2019Inventors: Eugene Yan Ki Hsue, Harold Zin Htutt, Robert Eugene Cayou, Vance Murakami
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Publication number: 20190053398Abstract: Examples relate to sliding rail assemblies comprising a first and a second slide rail wherein each slide rail comprises a main body and a guide rail. The main body has an inner surface to attach to an inner surface of the guide rail and an outer surface having an upper, a lower and a middle protrusion along the length of the main body. The upper and the middle protrusions define a dovetail socket and the middle and the lower protrusion define a dovetail. The main bodies of the first and the second slide rails are identical to each other. Each dovetail protrusion of the first slide rail slidably engages a corresponding dovetail protrusion of the second slide rail such that a cavity is formed between the respective guide rails.Type: ApplicationFiled: August 11, 2017Publication date: February 14, 2019Inventors: Robert Eugene Cayou, Vance Murakami, Paul Wes Stelter, Eugene Yan Ki Hsue
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Patent number: 8960268Abstract: An exemplary method may include thermally coupling a network of cooling lines to each of a plurality of heat exchangers in a cooling system. The method may also include providing a first connection from a network of cooling lines to a first fluid source and a second connection from the network of cooling lines to a second fluid source for configuring the network of cooling lines in different states. The method may also include delivering cooling fluid through the network of cooling lines to each of the plurality of heat exchangers both when the network of cooling lines is connected only to the first fluid source and when the network of cooling lines is connected to both the first and second fluid sources.Type: GrantFiled: October 6, 2010Date of Patent: February 24, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Christian L Belady, Vance Murakami, Robert Allen Pereira
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Publication number: 20110017442Abstract: An exemplary method may comprise thermally coupling a network of cooling lines to each of a plurality of heat exchangers in a cooling system. The method may also comprise providing a first connection from a network of cooling lines to a first fluid source and a second connection from the network of cooling lines to a second fluid source for configuring the network of cooling lines in different states. The method may also comprise delivering cooling fluid through the network of cooling lines to each of the plurality of heat exchangers both when the network of cooling lines is connected only to the first fluid source and when the network of cooling lines is connected to both the first and second fluid sources.Type: ApplicationFiled: October 6, 2010Publication date: January 27, 2011Inventors: Christian L. Belady, Vance Murakami, Robert Allen Pareira
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Patent number: 7832461Abstract: An exemplary cooling method may comprise thermally coupling a network of cooling lines to each of a plurality of heat exchangers in a cooling system. The method may also comprise providing a first connection from a network of cooling lines to a first fluid source and a second connection from the network of cooling lines to an optional second fluid source. The method may also comprise delivering cooling fluid through the network of cooling lines to each of the plurality of heat exchangers whether the network of cooling lines is connected only to the first fluid source or to both the first and second fluid sources.Type: GrantFiled: February 9, 2007Date of Patent: November 16, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Christian L. Belady, Vance Murakami, Robert Allen Pereira
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Publication number: 20090034187Abstract: A system comprising a container adapted to house an electronic device. The system also comprises a fan adapted to transfer air between different portions of the container and pressure sensing logic adapted to determine a difference between air pressures at the different portions. The system further comprises control logic adapted to adjust a speed of the fan in accordance with the difference.Type: ApplicationFiled: July 31, 2007Publication date: February 5, 2009Inventors: Henry C. COLES, Vance Murakami, Wesley H. Stelter, Richard A. Bargerhuff
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Patent number: 7447022Abstract: An apparatus in one example comprises at least one heat exchanger mounted within a rack-mount equipment bay and at least one duct coupled with the at least one heat exchanger that is configured to form a semi-closed cooling loop with at least one electronic device mounted within the rack-mount equipment bay. The at least one duct directs an airflow between the at least one heat exchanger and the at least one electronic device for cooling of the at least one electronic device.Type: GrantFiled: August 9, 2006Date of Patent: November 4, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: Vance Murakami, Christian L. Belady
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Patent number: 7447026Abstract: An enclosure for housing electronic equipment comprises a cabinet for receiving the electronic equipment and a cooling system, wherein the cooling system comprises a coolant circulation system including a fluid inlet, a fluid outlet, and at least one fluid coupling device in fluid communication therewith, at least two heat exchange units, each heat exchange unit comprising a liquid-cooled heat exchanger in fluid communication with the coolant circulation system via the at least one fluid coupling device and each heat exchange unit including at least one blind mating sleeve, and at least one fan positioned to blow air across the heat exchanger, the cabinet including at least one guide pin for facilitating blind connection of the heat exchange unit to the fluid coupling device, the guide pin being positioned so as to be received in a blind mating sleeve when the heat exchange units are mounted in the cabinet.Type: GrantFiled: August 31, 2006Date of Patent: November 4, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: Vance Murakami, Robert Hintz, Henry C. Coles
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Publication number: 20080266726Abstract: Embodiments include a server and a sensor that detects when a first fluid line to the server fails so a second fluid line to the server is activated.Type: ApplicationFiled: April 27, 2007Publication date: October 30, 2008Inventors: Vance Murakami, Christian L. Belady, Paul L. Perez, Robert A. Pereira
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Publication number: 20080055845Abstract: An enclosure for housing electronic equipment comprises a cabinet for receiving the electronic equipment and a cooling system, wherein the cooling system comprises a coolant circulation system including a fluid inlet, a fluid outlet, and at least one fluid coupling device in fluid communication therewith, at least two heat exchange units, each heat exchange unit comprising a liquid-cooled heat exchanger in fluid communication with the coolant circulation system via the at least one fluid coupling device and each heat exchange unit including at least one blind mating sleeve, and at least one fan positioned to blow air across the heat exchanger, the cabinet including at least one guide pin for facilitating blind connection of the heat exchange unit to the fluid coupling device, the guide pin being positioned so as to be received in a blind mating sleeve when the heat exchange units are mounted in the cabinet.Type: ApplicationFiled: August 31, 2006Publication date: March 6, 2008Inventors: Vance Murakami, Robert Hintz, Henry C. Coles
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Publication number: 20080037217Abstract: An apparatus in one example comprises at least one heat exchanger mounted within a rack-mount equipment bay and at least one duct coupled with the at least one heat exchanger that is configured to form a semi-closed cooling loop with at least one electronic device mounted within the rack-mount equipment bay. The at least one duct directs an airflow between the at least one heat exchanger and the at least one electronic device for cooling of the at least one electronic device.Type: ApplicationFiled: August 9, 2006Publication date: February 14, 2008Inventors: Vance Murakami, Christian L. Belady
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Publication number: 20070251254Abstract: Cooling systems and methods are disclosed. In an exemplary embodiment, a method may comprise thermally coupling a network of cooling lines to each of a plurality of heat exchangers in a cooling system. The method may also comprise providing a first connection from a network of cooling lines to a first fluid source and a second connection from the network of cooling lines to an optional second fluid source. The method may also comprise delivering cooling fluid through the network of cooling lines to each of the plurality of heat exchangers whether the network of cooling lines is connected only to the first fluid source or to both the first and second fluid sources.Type: ApplicationFiled: February 9, 2007Publication date: November 1, 2007Inventors: Christian L. Belady, Vance Murakami, Robert Allen Pereira