Patents by Inventor Varinder Kalra

Varinder Kalra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050141164
    Abstract: A low resistance fuse apparatus and methods of manufacture includes a first intermediate insulation layer, a second intermediate insulation layer, and a free standing fuse element layer independently formed and fabricated from each of the first and second intermediate insulation layers, The fuse element layer includes first and second contact pads and a fusible link extending therebetween. The first and second intermediate insulation layers extend on opposite sides of the free standing fuse element layer and are laminated together with the fuse element layer therebetween.
    Type: Application
    Filed: February 24, 2005
    Publication date: June 30, 2005
    Inventors: Joan Bender, Hundi Kamath, Varinder Kalra, Daniel Manoukian, Peter So
  • Patent number: 5726621
    Abstract: A subminiature circuit protector includes a plurality of layers of ceramic material in a laminate structure, each layer bearing a fuse element. The ends of laminate structure are coated with electrically conductive end terminations. The fuse elements of the layers may be connected in parallel, with fuse elements on each layer connecting to both end terminations, or interconnected in series from one end termination to the other. Each of the fuse elements of the individual layers may comprise two or more individual fuse elements connected in series or in parallel. A method for manufacturing the circuit protector in accordance with the invention includes the steps of printing a multiplicity of fuse elements on a plurality of substrates, stacking the substrates to form a laminate structure, cutting the laminate into individual units, and coating the opposite ends of the units with electrically conductive material to form end terminations.
    Type: Grant
    Filed: August 11, 1995
    Date of Patent: March 10, 1998
    Assignee: Cooper Industries, Inc.
    Inventors: Stephen Whitney, Keith Spalding, Joan Winnett, Varinder Kalra
  • Patent number: 5440802
    Abstract: A method of manufacturing a chip fuse includes the steps of depositing a plurality of columns of electrically conductive metal film on a green, unfired ceramic substrate, and disposing a plurality of wire elements on the substrate over the film columns and perpendicular to the film columns. A cover of green, unfired ceramic is bonded to the substrate over the wire elements and film columns to form a laminate. The laminate is then die cut into individual fuses, which are then fired to cure the ceramic and form an intermetallic bond between the wire elements and the metal film. End termination coatings are then applied to the fuses to facilitate connecting the fuses in an electrical circuit. The invention relates to a chip fuse manufactured according to the method.
    Type: Grant
    Filed: September 12, 1994
    Date of Patent: August 15, 1995
    Assignee: Cooper Industries
    Inventors: Stephen Whitney, Vernon Spaunhorst, Joan Winnett, Varinder Kalra