Patents by Inventor Vasile Romega Thompson

Vasile Romega Thompson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7683465
    Abstract: A semiconductor device is provided that includes a leadframe, a die, and a clip. The leadframe has a flag and a power pad. The die is coupled to the flag. The clip comprises a die retaining section and a pad section. The die is coupled to the die retaining section, and the pad section extends from the die retaining section. The pad section is coupled to the power pad.
    Type: Grant
    Filed: September 17, 2007
    Date of Patent: March 23, 2010
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Vasile Romega Thompson, Zhi-Gang Bai
  • Patent number: 7339267
    Abstract: Semiconductor packages (100) that prevent the leaching of gold from back metal layers (118) into the solder (164) and methods for fabricating the same are provided. An exemplary method comprises providing a semiconductor wafer stack (110) including metal pads (112) and a substrate (116). An adhesion/plating layer (115) is formed on the substrate (116). A layer of gold (118) is plated on the adhesion/plating layer (115). The layer of gold is etched in a street area (124) to expose edge portions (128) of the layer of gold (118) and the adhesion/plating layer (115). A layer of barrier metal (130) is deposited to form an edge seal (129) about the exposed edge portions (128). The edge seal (129) prevents the leaching of gold from back metal layers (118) into the solder (162) when the wafer stack (110) is soldered to a leadframe (162).
    Type: Grant
    Filed: May 26, 2005
    Date of Patent: March 4, 2008
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Vasile Romega Thompson, Jason Fender, Terry K. Daly, Jin-Wook Jang
  • Patent number: 7271469
    Abstract: A semiconductor device is provided that includes a leadframe, a die, and a clip. The leadframe has a flag and a power pad. The die is coupled to the flag. The clip comprises a die retaining section and a pad section. The die is coupled to the die retaining section, and the pad section extends from the die retaining section. The pad section is coupled to the power pad. Methods for forming the semiconductor device are provided as well.
    Type: Grant
    Filed: May 31, 2005
    Date of Patent: September 18, 2007
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Vasile Romega Thompson, Zhi-Gang Bai