Abstract: A power module has a metallic base plate layer and a substrate layer that has a first metallic layer, a dielectric layer, and a second metallic layer. A solder layer thermally and electrically connects the second metallic layer to the base plate. A plurality of silicon dice are mounted to the first metallic layer of the substrate. The solder layer has a void development region which after a predetermined number of thermal cycles does not significantly increase. The silicon dice are oriented on the substrate layer so that the silicon dice are not aligned over the void development region corresponding to the useful life of the module. The metallic base plate may also be mounted to a heatsink through a thermal grease layer. The heatsink may comprise the outer covering of the power module.

Abstract: An integrated power module combining drivers and power devices includes a diagnosis module integrated with or connected to the integrated power module. That includes protectors. The protectors provides protection against power device failure, transistor stack failure, gate drive failure, power failure, and other conditions. In a first level of diagnosis and protection, a gate driver is responsive to hard faults, such as short circuit and under voltage conditions, to disenable the power devices, for example, switching transistors of an inverter. In addition, the first level of protection includes soft faults, such as detection of overcurrent and over temperature in the power device, conditions that are merely reported to the controller, whereby the number and frequency of the events can be monitored. The second level of protection also provided by the diagnostic module may include power interlock to ensure that full power is being delivered to the integrated power module.

Abstract: An electrically powered active suspension system is disclosed having a suspension unit wherein the system controller and the power electronics module are integrated into a single housing with the motor mechanism of the suspension unit.