Abstract: Light emitting diode (LED) packages and LED displays utilizing the LED packages are disclosed. LED packages can have a plurality of cavities with each having one or more LEDs. The LEDs can be individually controllable so that the LED package emits the desired color combination of light from the package. The LED packages are arranged with an encapsulant over the cavities that shape the LED package emission to a wide angle or pitch. Some of the LED packages can have three cavities, while others can have four or more cavities. The packages can comprise an encapsulant that forms lenses over the cavities and continues beyond the cavities to cover surfaces of the LED package body. The body can include different anchoring features to improve package reliability by anchoring the encapsulant to the body. One embodiment of an LED display according to the present invention comprises a plurality of LED packages, at least some having a plurality of cavities.

Abstract: Light emitting diode (LED) packages and LED displays utilizing the LED packages are disclosed. LED packages can have a plurality of cavities with each having one or more LEDs. The LEDs can be individually controllable so that the LED package emits the desired color combination of light from the package. The LED packages are arranged with an encapsulant over the cavities that shape the LED package emission to a wide angle or pitch. Some of the LED packages can have three cavities, while others can have four or more cavities. The packages can comprise an encapsulant that forms lenses over the cavities and continues beyond the cavities to cover surfaces of the LED package body. The body can include different anchoring features to improve package reliability by anchoring the encapsulant to the body. One embodiment of an LED display according to the present invention comprises a plurality of LED packages, at least some having a plurality of cavities.

Abstract: Emitter panels and displays utilizing solid state packages and methods for fabricating the same are disclosed. One emitter panel comprises a raised barrier on a submount defining a plurality of cavities, each cavity having at least one LED in a pixel area. The panel is capable of receiving electrical signals for independently controlling the emission from the emitters. Solid state displays utilize the emitter panels mounted in relation to one another to generate a message or image. The panels comprise multiple pixels each having at least one light emitter, with each panel capable of receiving electrical signals for independently controlling the emission of at the pixels.

Abstract: Emitter packages and LEDs displays utilizing the packages are disclosed, with the packages providing advantages such as reducing the cost and interconnect complexity for the packages and displays. One emitter package comprises a casing with a plurality of cavities, each cavity having at least one LED. A lead frame structure is included integral to the casing, with the at least one LED from each of the cavities mounted to the lead frame structure. The package is capable of receiving electrical signals for independently controlling the emission from a first and second of the cavities. One LED display utilizes the LED packages mounted in relation to one another to generate a message or image. The LED packages comprise multiple pixels each having at least one LED, with each package capable of receiving electrical signals for independently controlling the emission of at least a first and second of the pixels.

Abstract: Light emitting diode (LED) packages and LED displays utilizing the LED packages are disclosed. LED packages can have a plurality of cavities with each having one or more LEDs. The LEDs can be individually controllable so that the LED package emits the desired color combination of light from the package. The LED packages are arranged with an encapsulant over the cavities that shape the LED package emission to a wide angle or pitch. Some of the LED packages can have three cavities, while others can have four or more cavities. The packages can comprise an encapsulant that forms lenses over the cavities and continues beyond the cavities to cover surfaces of the LED package body. The body can include different anchoring features to improve package reliability by anchoring the encapsulant to the body. One embodiment of an LED display according to the present invention comprises a plurality of LED packages, at least some having a plurality of cavities.

Abstract: A side view surface mount light emitting device is disclosed. The light emitting device comprises a side oriented package comprising a floor and a plurality of light emitting diodes (LEDs) mounted on the floor. The device further includes a plurality of contact pins in electrical contact, such that the plurality of contact pins protrude from a side of the package, in which at least one of the contact pins is oriented in a direction opposite the remaining contact pins. The LEDs of the device are disposed to emit light in a direction parallel to said mount surface. Some configurations also include a plurality of bond pads, on or a part of the floor, to facilitate electrical connection between the LEDs and the contact pins, in which adjacent bond pads have a tapered shape such that the widest portion of a first bond pad is adjacent to the narrowest portion of a second bond pad. Displays including such devices are also disclosed.

Abstract: Light emitting diode (LED) packages and LED displays utilizing the LED packages are disclosed. LED packages can have a cavity with emitters arranged in close proximity to approximate a point light source, with each of the packages emitting a color combination of light from the emitters. The LED packages are arranged with an encapsulant or lens over the cavity that shapes the LED package emission to a wide angle or pitch. One embodiment of an LED package according to the present invention comprises a cavity with a plurality LEDs. The LED package also comprises a lens over the cavity to shape the emission of the LEDs to a wider angle along an axis compared to emission of the LEDs without the lens. The LEDs are individually controllable, with the LED package emitting different color combinations of emission from the LEDs. One embodiment of an LED display according to the present invention comprises a plurality of LED packages, at least some having a cavity with a plurality of LEDs.

Abstract: Emitter packages and LEDs displays utilizing the packages are disclosed, with the packages providing advantages such as reducing the cost and interconnect complexity for the packages and displays. One emitter package comprises a casing with a plurality of cavities, each cavity having at least one LED. A lead frame structure is included integral to the casing, with the at least one LED from each of the cavities mounted to the lead frame structure. The package is capable of receiving electrical signals for independently controlling the emission from a first and second of the cavities. One LED display utilizes the LED packages mounted in relation to one another to generate a message or image. The LED packages comprise multiple pixels each having at least one LED, with each package capable of receiving electrical signals for independently controlling the emission of at least a first and second of the pixels.

Abstract: A multiple element emitter package is disclosed for increasing color fidelity and heat dissipation, improving current control, and increasing rigidity of the package assembly. In one embodiment, the package comprises a casing with a cavity extending into the interior of the casing from a first main surface. A lead frame is at least partially encased by the casing, the lead frame comprising a plurality of electrically conductive parts carrying a linear array of LEDs. Electrically conductive parts, separate from the parts carrying the LEDs, have a connection pad, wherein the LEDs are electrically coupled to the connection pad, such as by a wire bond. This arrangement allows for a respective electrical signal to be applied to each of the LEDs. The emitter package may be substantially waterproof, and an array of the emitter packages may be used in an LED display such as an indoor and/or outdoor LED screen.

Abstract: Emitter packages and LEDs displays utilizing the packages are disclosed, with the packages providing advantages such as reducing the cost and interconnect complexity for the packages and displays. One emitter package comprises a casing with a plurality of cavities, each cavity having at least one LED. A lead frame structure is included integral to the casing, with the at least one LED from each of the cavities mounted to the lead frame structure. The package is capable of receiving electrical signals for independently controlling the emission from a first and second of the cavities. One LED display utilizes the LED packages mounted in relation to one another to generate a message or image. The LED packages comprise multiple pixels each having at least one LED, with each package capable of receiving electrical signals for independently controlling the emission of at least a first and second of the pixels.

Abstract: Emitter panels and displays utilizing solid state packages and methods for fabricating the same are disclosed. One emitter panel comprises a raised barrier on a submount defining a plurality of cavities, each cavity having at least one LED in a pixel area. The panel is capable of receiving electrical signals for independently controlling the emission from the emitters. Solid state displays utilize the emitter panels mounted in relation to one another to generate a message or image. The panels comprise multiple pixels each having at least one light emitter, with each panel capable of receiving electrical signals for independently controlling the emission of at the pixels.

Abstract: A system for simulating operation of an electrical device includes a printed circuit board assembly (PCBA) and a host machine. The PCBA includes a communications module, modular power switching modules (PSMs), and modular cells. Using an associated method, each PSM applies a predetermined pulse width modulation (PWM) duty cycle to AC input power to generate a calibrated DC output voltage. The cells, which are connected to a respective PSM, include a microcontroller. The host machine transmits a controller area network (CAN) cell state message to the communications module. The communications module converts the cell state messages into corresponding serial messages, and transmits the serial messages to the microprocessors of the cells to cause the cells to set their states to the desired simulation state. The cells generate the desired simulation state using PWM and transmit a cell status message back to the host machine via the communications module.

Abstract: A side view surface mount light emitting device is disclosed. The light emitting device comprises a side oriented package comprising a floor and a plurality of light emitting diodes (LEDs) mounted on the floor. The device further includes a plurality of contact pins in electrical contact, such that the plurality of contact pins protrude from a side of the package, in which at least one of the contact pins is oriented in a direction opposite the remaining contact pins. The LEDs of the device are disposed to emit light in a direction parallel to said mount surface. Some configurations also include a plurality of bond pads, on or a part of the floor, to facilitate electrical connection between the LEDs and the contact pins, in which adjacent bond pads have a tapered shape such that the widest portion of a first bond pad is adjacent to the narrowest portion of a second bond pad. Displays including such devices are also disclosed.

Abstract: Emitter packages and LEDs displays utilizing the packages are disclosed, with the packages providing advantages such as reducing the cost and interconnect complexity for the packages and displays. One emitter package comprises a casing with a plurality of cavities, each cavity having at least one LED. A lead frame structure is included integral to the casing, with the at least one LED from each of the cavities mounted to the lead frame structure. The package is capable of receiving electrical signals for independently controlling the emission from a first and second of the cavities. One LED display utilizes the LED packages mounted in relation to one another to generate a message or image. The LED packages comprise multiple pixels each having at least one LED, with each package capable of receiving electrical signals for independently controlling the emission of at least a first and second of the pixels.

Abstract: A system for simulating operation of an electrical device includes a printed circuit board assembly (PCBA) and a host machine. The PCBA includes a communications module, modular power switching modules (PSMs), and modular cells. Using an associated method, each PSM applies a predetermined pulse width modulation (PWM) duty cycle to AC input power to generate a calibrated DC output voltage. The cells, which are connected to a respective PSM, include a microcontroller. The host machine transmits a controller area network (CAN) cell state message to the communications module. The communications module converts the cell state messages into corresponding serial messages, and transmits the serial messages to the microprocessors of the cells to cause the cells to set their states to the desired simulation state. The cells generate the desired simulation state using PWM and transmit a cell status message back to the host machine via the communications module.

Abstract: According to one embodiment of the invention, a method comprises measuring memory access latency for a prefetch cycle associated with a transmission of data from a memory device to a destination device such as a storage device. Hereafter, the prefetch rate is dynamically adjusted based on the measured memory access latency.

Abstract: A multiple element emitter package is disclosed for increasing color fidelity and heat dissipation, improving current control, increasing rigidity of the package assembly. In one embodiment, the package comprises a surface-mount device a casing with a cavity extending into the interior of the casing from a first main surface is provided. A lead frame is at least partially encased by the casing, the lead frame comprising a plurality of electrically conductive parts carrying a linear array of light emitting devices (LEDs). Electrically conductive parts, separate from parts carrying the LEDs have a connection pad, wherein the LEDs are electrically coupled to a connection pad, such as by a wire bond. This lead frame arrangement allows for a respective electrical signal can be applied to each of the LEDs. The emitter package may be substantially waterproof, and an array of the emitter packages may be used in an LED display such as an indoor and/or outdoor LED screen.

Abstract: An embodiment of the present invention is a technique to process a plurality of I/O sequences associated with a storage device. A task context pre-fetch engine pre-fetches a task context from a task context memory based on a pre-fetch request. At least a multi-threaded transmit transport layer (T×TL) processes the plurality of I/O sequences from an I/O pool simultaneously. The multi-threaded T×TL generates the pre-fetch request and one or more frames from the plurality of I/O sequences. A switch fabric and controller routes the frame to a link layer associated with the storage device.

Abstract: Methods of scheduling tasks in computer systems architectures are disclosed. In one aspect, a method may include comparing a connection address of a first node with a connection address of a second node, determining that the connection address of the first node matches the connection address of the second node, and scheduling tasks to the first and second nodes based, at least in part, on the determination. Apparatus to implement task scheduling, and systems including the apparatus are also disclosed.

Abstract: A method, computer program product, system (including a circuit card), and integrated circuit for initializing a buffer pool, such that the buffer pool includes a plurality of data buffers available for use during a plurality of I/O transfers. In response to the initiation of a first I/O transfer concerning a first data portion being transferred from a first data source to a first data target, the first data portion is written to a first portion of the plurality of data buffers. The first data portion is transferred to the first data target, and the first portion of the plurality of data buffers is released back to the buffer pool for use during one or more subsequent I/O transfers.