Abstract: A pressure sensor system including at least one pressure sensor unit, the pressure sensor unit being configured with at least one sensor element which is situated in a cavity of a support structure, signal processing elements being integrated into support structure, the at least one sensor element being embeddable into the support structure to form the pressure sensor unit, and the support structure being formed by a land grid array/mold premold structure (LGA/MPM). The pressure sensor unit is introduced into a sensor housing to be provided with a diaphragm and is supported therein, a residual volume of the sensor housing, which is provided with at least one diaphragm and to the wiring of which the pressure sensor unit is electrically connected, being filled with an incompressible fluid. Also described is a method for manufacturing such a pressure sensor system and a measuring device.

Abstract: A pressure sensor system having at least one pressure sensor device. The pressure sensor device has a stack having a ceramic substrate, at least one signal processing element, and at least one sensor element. The pressure sensor device is placed in a sensor housing provided with a membrane, and a residual volume of the sensor housing provided with the membrane is filled with an incompressible fluid. A method for producing such a pressure sensor system, and to a measuring device, are also described.

Abstract: A pressure sensor system including at least one pressure sensor unit configured as a system-in-package, the pressure sensor unit encompassing a supporting structure including a cavity and a sensor element situated in the cavity; the supporting structure being formed by a land grid array/mold premold structure (LGA/MPM) and signal-processing elements being integrated into and/or on the supporting structure; the pressure sensor unit being introduced into a pressure sensor housing provided with a diaphragm and being supported therein, and a residual volume of the pressure sensor housing provided with at least one diaphragm being filled with an incompressible fluid; and the pressure sensor housing including a groove extending around the pressure sensor unit, in which a sealing ring is situatable.

Abstract: A method for producing a microelectromechanical component as well as a wafer system includes steps of: providing a first wafer having a plurality of microelectromechanical base elements; forming a respective container structure on the microelectromechanical base elements at the wafer level; and disposing an oil or a gel within the container structures.

Abstract: A pressure sensor system having at least one pressure sensor device. The pressure sensor device has a stack having a ceramic substrate, at least one signal processing element, and at least one sensor element. The pressure sensor device is placed in a sensor housing provided with a membrane, and a residual volume of the sensor housing provided with the membrane is filled with an incompressible fluid. A method for producing such a pressure sensor system, and to a measuring device, are also described.

Abstract: A pressure sensor system including at least one pressure sensor unit, the pressure sensor unit being configured with at least one sensor element which is situated in a cavity of a support structure, signal processing elements being integrated into support structure, the at least one sensor element being embeddable into the support structure to form the pressure sensor unit, and the support structure being formed by a land grid array/mold premold structure (LGA/MPM). The pressure sensor unit is introduced into a sensor housing to be provided with a diaphragm and is supported therein, a residual volume of the sensor housing, which is provided with at least one diaphragm and to the wiring of which the pressure sensor unit is electrically connected, being filled with an incompressible fluid. Also described is a method for manufacturing such a pressure sensor system and a measuring device.

Abstract: A pressure sensor system including at least one pressure sensor unit configured as a system-in-package, the pressure sensor unit encompassing a supporting structure including a cavity and a sensor element situated in the cavity; the supporting structure being formed by a land grid array/mold premold structure (LGA/MPM) and signal-processing elements being integrated into and/or on the supporting structure; the pressure sensor unit being introduced into a pressure sensor housing provided with a diaphragm and being supported therein, and a residual volume of the pressure sensor housing provided with at least one diaphragm being filled with an incompressible fluid; and the pressure sensor housing including a groove extending around the pressure sensor unit, in which a sealing ring is situatable.

Abstract: A method for producing a microelectromechanical component as well as a wafer system includes steps of: providing a first wafer having a plurality of microelectromechanical base elements; forming a respective container structure on the microelectromechanical base elements at the wafer level; and disposing an oil or a gel within the container structures.

Abstract: A MEMS microphone system with encapsulated movable electrode is provided. The MEMS microphone system comprises a MEMS sensor having an access channel, a plug, and first and second members. The access channel configured to receive the plug is formed on at least one of the first and second member. A vacuum having a pressure different from a pressure outside the MEMS sensor is formed between the first and second members.

Abstract: A MEMS microphone system with encapsulated movable electrode is provided. The MEMS microphone system comprises a MEMS sensor having an access channel, a plug, and first and second members. The access channel configured to receive the plug is formed on at least one of the first and second member. A vacuum having a pressure different from a pressure outside the MEMS sensor is formed between the first and second members.