Abstract: High torque guidewires and methods for making and using them are provided. A guidewire may include an inner core wire movable relative to an outer jacket. The outer jacket includes proximal and distal ends, a lumen extending there between, thereby defining a longitudinal axis, and one or more helical slots adjacent the distal end. The core wire includes a proximal portion, a distal portion slidably received in the outer jacket lumen and terminating in a curved distal tip that extends from the outer jacket distal end, and one or more pins on the distal portion, each pin slidably received in a respective helical slot in the outer jacket such that axial movement of the core wire relative to the outer jacket causes the pin to slide within the helical slot and rotate the distal tip relative to the outer jacket distal end.

Abstract: A method for making tea cubes containing a blend of granular sugar, dry extract of either black or green teas, micronized tea and flavour comprises providing tea leaves that have been micronized in a jet mill (1) to simulate performance of instant tea without contributing any stickiness. Next, sugar and flavour are prepared for mixing and incorporating them with micronized tea. The particle size distribution of sugar is decided depending upon the percentage (%) of non-sugar ingredients in the cube formulation.

Abstract: A system for providing aggregated patient data may include a processor and memory. The processor may receive clinical data items from a healthcare data system and device data items from healthcare devices, where the clinical data items and the device data items are associated with patients. The processor may generate patient data objects corresponding to the patients, where each patient data object includes the clinical data items and the device data items associated with one of the patients. The processor may filter the patient data objects based on access privileges of a third party organization to generate filtered patient data objects and transform the filtered patient data objects based on a data transformation rule associated with the third party organization to generate transformed patient data objects. The processor may provide, e.g. over a network, the transformed patient data objects to at least one device associated with the third party organization.

Abstract: A spiral-based thin-film mesh for medical devices and related methods is provided. The spiral-based thin-film mesh may be used as a stent cover for a stent device. The thin-film mesh may include a plurality of spirals. The spirals allow the thin-film mesh to expand omni-directionally. In one or more embodiments, the spirals may be logarithmic spirals, golden spirals, approximated golden spirals, box Phi spirals, or Fibonacci spirals. The thin-film mesh may be formed from thin-film Nitinol (TFN), and may be fabricated via sputter deposition on a micropattemed wafer.

Abstract: A device includes a multilayer substrate having a first surface and a second surface opposite the first surface. An integrated circuit is mounted on the second surface of the multilayer substrate, the integrated circuit having transmission circuitry configured to process millimeter wave signals. A substrate waveguide having a substantially solid wall is formed within a portion of the multilayer substrate perpendicular to the first surface. The substrate waveguide has a first end with the wall having an edge exposed on the first surface of the multilayer substrate. A reflector is located in one of the layers of the substrate and is coupled to an edge of the wall on an opposite end of the substrate waveguide.

Abstract: A device includes an elastic tubular stent including struts forming closed cells arranged in rows along a circumferential direction of the stent, with each cell having a first obtuse-angled corner on one end of the cell along a longitudinal direction of the stent and a second obtuse-angled corner on an opposing end of the cell along the longitudinal direction. The stent may be fabricated by cutting an array of quadrilateral cells in a nitinol hypotube to form a stent, with each cell having four corners with approximately equal angles. The stent may then be expanded radially such that each cell has a first obtuse-angled corner on one end of the cell along a longitudinal direction of the stent and a second obtuse-angled corner on an opposing end of the cell along the longitudinal direction, and heat treated to fix the shape of the stent.

Abstract: Systems and methods for selecting a treatment regimen for a particular patient are provided. The treatment regimen is selected using a first data store including a first plurality of patient records for a first plurality of patients, and a second data store including efficacy rates of a plurality of treatment regimens against a plurality of infections and infection-causing pathogens. The system, or a user of the system, identifies a first infection of the particular patient and a first treatment regimen to be prescribed to treat the first infection. A second plurality of patient records is generated by identifying, in the first plurality of patient records of the first data store, patient records associated with diagnosis or treatment of the first infection. The second plurality of patient records are appended with efficacy rates for the first infection from the second data store.

Abstract: A thin-film covered stent device may include a thin-film mesh and a stent backbone covered by the thin-film mesh, thereby forming a dual-layer stent structure. The thin-film covered stent device may have smaller pores and a high pore density compared to conventional stents. For example, the thin-film covered stent device may have a slit length of between 50 and 250 micrometers and a pore density of between 134 and 227 pores per mm2. The thin-film covered stent device facilitates rapid healing of tissue defects such as those encountered during the endovascular treatment of an aneurysm.

Abstract: A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.

Abstract: A method for toy robot programming, the toy robot including a set of sensors, the method including, at a user device remote from the toy robot: receiving sensor measurements from the toy robot during physical robot manipulation; in response to detecting a programming trigger event, automatically converting the sensor measurements into a series of puppeted programming inputs; and displaying graphical representations of the set of puppeted programming inputs on a programming interface application on the user device.

Abstract: Thin-film mesh for medical devices and related methods are provided. The thin-film mesh may include slits to be expanded into pores, and the expanded thin-film mesh may be used as a cover for a stent device. The thin-film mesh has a tube-shape and the slits may be angled with respect to a longitudinal axis of the tube-shape thin-film mesh. The angled slits allow for the thin-film mesh to expand in multiple dimensions, including along the longitudinal axis and along the circumferential direction of the tube-shape thin-film mesh. The slits may be provided in diagonal rows arranged in longitudinal columns. Longitudinal columns of different types of slits may be arranged along the circumferential direction on the tube-shape thin-film mesh to form a zig-zag pattern of slits. The thin-film mesh may be formed from thin-film Nitinol (TFN) and may be fabricated via sputter deposition on a micropatterned wafer.

Abstract: Provided are embodiments for power supply monitoring with variable thresholds for variable voltage vails. An example method includes determining a proportionality factor based on a reference voltage value of a reference voltage and a rail voltage value of a rail voltage. The method further includes monitoring the rail voltage by a power supply monitoring circuit comprising a first resistor, a second resistor, and a third resistor, wherein the power supply monitoring circuit monitors the rail voltage based on the reference voltage to determine, by the power supply monitoring circuit, whether one of an under voltage condition or an over voltage condition occurs. The method further includes, responsive to a processor commanding a change in the rail voltage value of the rail voltage, causing, by the processor, a new reference voltage value to be generated based on the proportionality factor to adjust an under voltage threshold and an over voltage threshold.

Abstract: The disclosed principles provide for implementing low-cost and fast metallic printing processes into the QFN and other no-leads package assembly flow to selectively print solderable material in areas that would otherwise be susceptible to corrosion and thus pose reliability risks. The problem of copper corrosion and poor BLR performance in no-leads packages because of remaining exposed copper areas after package singulation is solved by employing selective metallic printing processes in the assembly flow to coat all risk-prone areas with solder material. For example, for no-leads packages that are formed using printed leadframes, solder can be deposited through inkjet, screen, stencil, or photonic printing into the grooves which are formed after passivating the packages at the strip level. The singulating occurs through the grooves having solder printed therein, and results in wettable upper and sidewall surfaces of the outer ends of the leadframe for each package.

Abstract: A thin-film covered stent device may include a thin-film mesh and a stent backbone covered by the thin-film mesh, thereby forming a dual-layer stent structure. The thin-film covered stent device may have smaller pores and a high pore density compared to conventional stents. For example, the thin-film covered stent device may have a slit length of between 50 and 250 micrometers and a pore density of between 134 and 227 pores per mm2. The thin-film covered stent device facilitates rapid healing of tissue defects such as those encountered during the endovascular treatment of an aneurysm.

Abstract: Disclosed are methods, systems, and non-transitory computer-readable medium for deriving platform feedback data from raw feedback data for dynamic retrieval by downstream subsystems. For example, a method may include detecting a return notification trigger of a user, identifying segment data, determining a return notification form identifier based on the segment data, loading an electronic return notification form corresponding to the return notification form identifier, receiving raw feedback data from the user device, deriving platform feedback data from the raw feedback data using a plurality of mappings stored in one or more electronic mapping databases, and storing the platform feedback data in at least one of a feedback service component and a return notification service component, in one or more formats configured for retrieval by one or more downstream subsystems associated with managing and/or analyzing the one or more wearable items.

Abstract: A leadless integrated circuit (IC) package includes a spaced apart plurality of lead terminals on at least two sides of the leadless IC package, and an IC die including a substrate having at least a semiconductor surface including circuitry coupled to bond pads with the bond pads having bonding features thereon. The bonding features are flip chip bonded to the plurality of lead terminals. Mold compound is above the IC die and between adjacent lead terminals. The lead terminals and the substrate both extend out to have exposed surfaces at edges of the leadless IC package, and the lead terminals also provide a back side bondable contact.

Abstract: Systems for use with a medical device for controlling an infusion device are provided. In one aspect, a system includes an infusion device that is configurable with operating limit parameters for providing medication to a patient, and a limiting system. The limiting system receives laboratory information associated with a patient, compares current operating parameters of the infusion device with the operating limit parameters in view of the laboratory information for the patient before and during administration of the medication to the patient by the infusion device, determines that administration of the medication by the infusion device should be prevented based on comparing the operating parameters with the operating limit parameters in view of the laboratory information and, responsive to determining that the operation should be prevented, prevents the administration of the medication by the infusion device, and generates a notification indicating that the operating limit parameters require modification.

Abstract: An intrasaccular flow diverter includes a wire structure (e.g., a braided wire or a laser-cut hypotube), a thin-film mesh placed over the wire structure, and crimps fixing the thin-film mesh to the wire structure at each crimp. The wire structure and the thin-film mesh between adjacent crimps are expanded radially to form thin-film covered spheroid structures. When deployed in an aneurysm, the spheroid structures may volumetrically fill the aneurysm sac. An intrasaccular flow diverter with an umbrella structure includes a wire structure with a plurality of crimps along the wire structure, and a thin-film covered umbrella structure at one end of the wire structure. The wire structure between adjacent crimps is expanded radially to form a spheroid structure. When deployed in an aneurysm, the thin-film covered umbrella structure may cover the aneurysm neck.

Abstract: A thromboembolic removal system for treating ischemic stroke, including a guide and occlusion catheter, a delivery and aspiration catheter, an aspiration pump, a thromboembolic receiver, and a thromboembolic separator.

Abstract: Described examples include a sensor device having at least one conductive elongated first pillar positioned on a central pad of a first conductor layer over a semiconductor substrate, the first pillar extending in a first direction normal to a plane of a surface of the first conductor layer. Conductive elongated second pillars are positioned in normal orientation on a second conductor layer over the semiconductor substrate, the conductive elongated second pillars at locations coincident to via openings in the first conductor layer. The second conductor layer is parallel to and spaced from the first conductor layer by at least an insulator layer, the conductive elongated second pillars extending in the first direction through a respective one of the via openings. The at least one conductive elongated first pillar is spaced from surrounding conductive elongated second pillars by gaps.