Patents by Inventor Vincent Adrianus Henneken

Vincent Adrianus Henneken has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210114061
    Abstract: Disclosed is a method for manufacturing an ultrasonic transducer assembly comprising an ultrasonic transducer chip having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements, a contact chip having a further main surface comprising a plurality of second contacts, a backing member comprising ultrasound absorbing and/or scattering bodies, said backing member comprising a first surface on which the transducer chip is mounted and a second surface on which the contact chip is mounted. A flexible interconnect extends over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact.
    Type: Application
    Filed: September 24, 2020
    Publication date: April 22, 2021
    Inventors: JOHANNES WILHELMUS WEEKAMP, VINCENT ADRIANUS HENNEKEN, ALFONS WOUTER GROENLAND, MARCUS CORNELIS LOUWERSE
  • Patent number: 10898924
    Abstract: A large aperture CMUT transducer array is formed of a plurality of adjacently located tiles of CMUT cells. The adjacent edges of the tiles are formed by an anisotropic etch process, preferably a deep reactive ion etching process which is capable of cutting through the die and its substrate while maintaining vertical edges in close proximity to the CMUT cells at the edge of the tile. This enables the CMUT cells of continuous rows or columns to exhibit a constant pitch over multiple CMUT cell tiles. The tiles also contain interconnect electrodes along an edge for making electrical connections to the tiles with flex circuit.
    Type: Grant
    Filed: July 13, 2015
    Date of Patent: January 26, 2021
    Assignee: Koninklijke Philips N.V.
    Inventors: Wojtek Sudol, Peter Dirksen, Vincent Adrianus Henneken, Ronald Dekker, Marcus Cornelis Louwerse
  • Patent number: 10898925
    Abstract: The present invention relates to an ultrasound transducer assembly, in particular for intravascular ultrasound systems. The ultrasound transducer assembly comprises at least one silicon substrate element including an ultrasound transducer element for emitting and receiving ultrasound waves and including electrical connectors for electrically connecting the transducer element. The substrate element has a top surface, a bottom surface and a side surface connecting the top surface and the bottom surface. An isolation layer forms the side surface for electrically isolating the substrate element.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: January 26, 2021
    Assignee: Koninklijke Philips N.V.
    Inventors: Ronald Dekker, Vincent Adrianus Henneken, Marcus Cornelis Louwerse, Maria Filomena Raganato
  • Publication number: 20210007711
    Abstract: A medical device (10) for insertion into a patient is disclosed. The medical device (10) comprising an elongate body (12), the medical device terminating in a distal portion and further comprising a carrier (20) carrying an annular sensor arrangement (50), wherein the annular sensor arrangement is attached on a forward facing surface of the elongate body (12). Also disclosed is a system (100) including such a medical device (10).
    Type: Application
    Filed: March 11, 2019
    Publication date: January 14, 2021
    Inventors: Arjen VAN DER HORST, Roland Alexander VAN DE MOLENGRAAF, Vincent Adrianus HENNEKEN, Johannes Wilhelmus WEEKAMP, Maarten Petrus Joseph KUENEN, Sergei Y. SHULEPOV, Bruno Jean Fran├žois FRACKOWIAK
  • Publication number: 20200367854
    Abstract: Devices, systems, and methods relating to intraluminal imaging are disclosed. In an embodiment, an intraluminal imaging device is disclosed. One embodiment of the intraluminal imaging device comprises a flexible elongate member configured to be inserted into a body lumen of a patient, the flexible elongate member comprising a proximal portion and a distal portion. The intraluminal imaging device further comprises an ultrasound imaging assembly disposed at the distal portion of the flexible elongate member. The imaging assembly comprises a support member, a flexible substrate positioned around the support member, a plurality of ultrasound transducer elements integrated in the flexible substrate, and a plurality of control circuits disposed on the flexible substrate at a position proximal to the plurality of transducer elements. The plurality of control circuits has an outer profile that does not extend beyond an outer profile of the plurality of transducer elements.
    Type: Application
    Filed: December 10, 2018
    Publication date: November 26, 2020
    Inventors: Egbertus Reinier JACOBS, Johannes Wilhelmus WEEKEMP, Vincent Adrianus HENNEKEN, Marcus Cornelis LOUWERSE, Ronald DEKKER
  • Patent number: 10828673
    Abstract: An ultrasound transducer arrangement (100) is disclosed comprising a plurality of substrate islands (110, 120, 130) spatially separated and electrically interconnected by a flexible polymer assembly (150) including electrically conductive tracks providing said electrical interconnections, said plurality including a first substrate island (110) comprising a plurality of ultra sound transducer cells (112) and a second substrate island (120) comprising an array of external contacts for connecting the ultrasound sensor arrangement to a flexible tubular body including a coaxial wire assembly (200) comprising a plurality of coaxial wires (220) each having a conductive core (228) covered by an electrically insulating sleeve (226); and an electrically insulating body (210) having a first main surface (211), a second main surface (213) and a plurality of through holes (212) each extending from the first main surface to the second main surface and coated with an electrically conductive member, wherein each coaxial wire
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: November 10, 2020
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Vincent Adrianus Henneken, Marcus Cornelis Louwerse, Johannes Wilhelmus Weekamp, Ronald Dekker, Marc Godfriedus Marie Notten, Antonia Cornelia Jeannet Van Rens
  • Patent number: 10814352
    Abstract: Disclosed is an ultrasonic transducer assembly comprising an ultrasonic transducer chip (100) having a main surface comprising a plurality of ultrasound transducer elements (112) and a plurality of first contacts (120) for connecting to said ultrasound transducer elements; a contact chip (400) having a further main surface comprising a plurality of second contacts (420); an backing member (300) comprising ultrasound absorbing and/or scattering bodies (310), said backing member comprising a first surface (302) on which the transducer chip is mounted and a second surface (306) on which the contact chip is mounted; and a flexible interconnect (200) extending over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks (210), each conductive track connecting one of said first contacts to a second contact.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: October 27, 2020
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Johannes Wilhelmus Weekamp, Vincent Adrianus Henneken, Alfons Wouter Groenland, Marcus Cornelis Louwerse
  • Publication number: 20200330072
    Abstract: Devices, systems, and methods relating to intraluminal imaging are disclosed. In an embodiment, an intraluminal imaging device is disclosed. One embodiment of the intraluminal imaging device comprises a flexible elongate member configured to be inserted into a body lumen of a patient, the flexible elongate member comprising a proximal portion and a distal portion. The intraluminal imaging device further comprises an ultrasound imaging assembly disposed at the distal portion of the flexible elongate member. The ultrasound imaging assembly comprises a support member, a flexible substrate positioned around the support member and including a proximal region and a distal region, the proximal region comprising a plurality of cutouts defining a plurality of substrate ribbons, a plurality of transducer elements integrated in the distal region of the flexible substrate, and a plurality of control circuits disposed on the proximal region of the flexible substrate.
    Type: Application
    Filed: December 10, 2018
    Publication date: October 22, 2020
    Inventors: Egbertus Reinier JACOBS, Johannes Wilhelmus WEEKEMP, Vincent Adrianus HENNEKEN, Marcus Cornelis LOUWERSE, Ronald DEKKER
  • Patent number: 10736607
    Abstract: An integrated circuit array, in particular for two dimensional sensor arrays such as ultrasound imaging systems is disclosed. The integrated circuit array (10) comprises a plurality of integrated circuit elements (12) each formed in a substrate (14), wherein the substrates are separated from each other. The array comprises a flexible and/or stretchable connection layer (22) connected to the integrated circuit elements for flexibly connecting the integrated circuit elements to each other. The array further comprises a plurality of electrical interconnects (18) for electrically connecting the integrated circuit elements to each other, wherein the electrical interconnects are formed as metal lines in one piece with integrated interconnects of the integrated circuit elements.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: August 11, 2020
    Assignee: Koninklijke Philips N.V.
    Inventors: Ronald Dekker, Vincent Adrianus Henneken, Angel Metodiev Savov
  • Publication number: 20200205776
    Abstract: An intraluminal ultrasound imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient. The flexible elongate member includes a proximal portion and a distal portion. The device also includes an ultrasound imaging assembly disposed at the distal portion of the flexible elongate member. The ultrasound imaging assembly is configured to obtain imaging data of the body lumen. The ultrasound imaging assembly includes a transducer array including a substrate, a silicon oxide layer disposed over the substrate, and a plurality of rows of micromachined ultrasound transducer elements disposed on the silicon oxide layer. Two of the plurality of rows of micromachined ultrasound transducer elements are spaced apart by a trench formed by etching through a screen formed in the silicon oxide layer. Associated devices, systems, and methods are also provided.
    Type: Application
    Filed: June 26, 2017
    Publication date: July 2, 2020
    Inventors: Ronald DEKKER, Vincent Adrianus HENNEKEN, Marcus Cornelis LOUWERSE, Aslihan ARSLAN CARISEY
  • Publication number: 20200146651
    Abstract: An ultrasound transducer probe (300) for intravascular operation, comprising a faceted distal front surface (302) for ultrasound emission and reception, which has at least two mutually neighboring front surface facets (304.a, 304.b) carrying respective sub-arrays (306) of micromachined ultrasonic transducer MUT elements (308), the sub-arrays of the MUT elements together forming a faceted array of MUT elements distributed over the distal front surface.
    Type: Application
    Filed: April 13, 2018
    Publication date: May 14, 2020
    Inventors: Arjen VAN DER HORST, Marcus Cornelis LOUWERSE, Vincent Adrianus HENNEKEN, Johannes Wilhelmus WEEKAMP, Maarten Petrus Joseph KUENEN, Sergei SHULEPOV
  • Patent number: 10555722
    Abstract: A CMUT transducer array comprising a first column (58) of spaced CMUT cells on at least one silicon island, a second column (58) of spaced CMUT cells on at least one further silicon island, the second column being staggered in alignment with the first column such that cells of the second column are partially located in spaces between successive cells of the first column, the first column and the second column being spaced apart by a gap, and a flexible foil retaining the respective silicon islands, the flexible foil comprising conductive interconnects.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: February 11, 2020
    Assignee: Koninklijke Philips N.V.
    Inventors: Vincent Adrianus Henneken, Marcus Cornelis Louwerse, Ronald Dekker
  • Publication number: 20190224717
    Abstract: The present invention relates to an ultrasound transducer assembly, in particular for intravascular ultrasound systems. The ultrasound transducer assembly comprises at least one silicon substrate element including an ultrasound transducer element for emitting and receiving ultrasound waves and including electrical connectors for electrically connecting the transducer element. The substrate element has a top surface, a bottom surface and a side surface connecting the top surface and the bottom surface. An isolation layer forms the side surface for electrically isolating the substrate element.
    Type: Application
    Filed: February 6, 2019
    Publication date: July 25, 2019
    Inventors: Ronald Dekker, Vincent Adrianus Henneken, Marcus Cornelis Louwerse, Maria Filomena Raganato
  • Publication number: 20190192116
    Abstract: An imaging device (100) is disclosed comprising an ultrasound transducer array (101, 120, 130) having a plurality of ultrasound transducer elements defining an ultrasound emitting surface of the ultrasound transducer array; and an acoustic window (220) on the ultrasound emitting surface, said acoustic window comprising: a first layer (221) of a hydrocarbon elastomer contacting the ultrasound emitting surface, said first layer further containing an antioxidant; and a second layer (223) of a further hydrocarbon elastomer on the first layer, said second layer having a greater Shore A hardness than the first layer. Also disclosed are an ultrasound imaging system (10) comprising such an imaging device, such as catheter (100), and a method (300) of forming an acoustic window (220) on an ultrasound transducer array (101, 120, 130) for such a device (100).
    Type: Application
    Filed: August 22, 2017
    Publication date: June 27, 2019
    Applicant: KONINKLIJKE PHILIPS N.V.
    Inventors: Lucas Johannes Anna Maria Beckers, Vincent Adrianus Henneken
  • Patent number: 10327333
    Abstract: The present invention relates to an electronic circuit arrangement (10) comprising: a substrate (12) having a first surface (12a) and a second surface (12b), an electronic circuit, an electrical connection part (16) for providing an electrical connection to the electronic circuit and being arranged on the first surface (12a), and at least one electrical wire (18). The electrical wire (18) comprises at least one conductive core (20) and an isolation (22) surrounding the conductive core (20). An end portion (18a) of the electrical wire (18) is an isolation-free portion for allowing access to the conductive core (20), wherein the end portion (18a) of the electrical wire (18) is connected to the electrical connection part (16). At least one through-hole (24) extending from the first surface (12a) to the second surface (12b) is provided in the substrate (12), wherein the electrical wire (18) is arranged through the through-hole (24).
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: June 18, 2019
    Assignee: Koninklijke Philips N.V.
    Inventors: Ronald Dekker, Vincent Adrianus Henneken, Marcel Mulder
  • Patent number: 10239093
    Abstract: The present invention relates to an ultrasound transducer assembly (10), in particular for intravascular ultrasound systems. The ultrasound transducer assembly comprises at least one silicon substrate element (30) including an ultrasound transducer element (14) for emitting and receiving ultrasound waves and including electrical connectors for electrically connecting the transducer element. The substrate element has a top surface (44), a bottom surface (46) and a side surface connecting the top surface and the bottom surface. An isolation layer (32, 50) forms the side surface for electrically isolating the substrate element.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: March 26, 2019
    Assignee: Koninklijke Philips N.V.
    Inventors: Ronald Dekker, Vincent Adrianus Henneken, Marcus Cornelis Louwerse, Maria Filomena Raganato
  • Publication number: 20180360417
    Abstract: Disclosed are an imaging system (10) or an interventional tool, such as a catheter (20), having a first ultrasound transducer array (23) and a second ultrasound transducer array (21) spaced by a fixed distance (D) from each other; wherein both arrays may be used to generate diagnostic images; and a processing arrangement (31, 32) to process a first sensor signal indicative of the first array imaging a reference location (X) at a first point in time, and to process a second sensor signal indicative of the second array imaging the reference location at a second point in time; and determine a translation (pullback) speed of the catheter from the set distance and the difference between the first point in time and the second point in time. Alternatively, a catheter may be provided comprising an ultrasound transducer array at a distal end of the catheter, and two pressure sensors for determining the translation speed.
    Type: Application
    Filed: December 1, 2016
    Publication date: December 20, 2018
    Inventors: VINCENT ADRIANUS HENNEKEN, ANTONIA CORNELIA VAN RENS, ROLAND WILHELMUS MARIA BULLENS, ARJEN VAN DER HORST, KE WANG, FRANK MICHAEL WEBER, IRINA WAECHTER-STEHLE
  • Publication number: 20170319180
    Abstract: A CMUT transducer array comprising a first column (58) of spaced CMUT cells on at least one silicon island, a second column (58) of spaced CMUT cells on at least one further silicon island, the second column being staggered in alignment with the first column such that cells of the second column are partially located in spaces between successive cells of the first column, the first column and the second column being spaced apart by a gap, and a flexible foil retaining the respective silicon islands, the flexible foil comprising conductive interconnects.
    Type: Application
    Filed: December 10, 2015
    Publication date: November 9, 2017
    Inventors: VINCENT ADRIANUS HENNEKEN, MARCUS CORNELIS LOUWERSE, RONALD DEKKER
  • Patent number: 9730636
    Abstract: The present invention relates to a minimally invasive medical instrument (100) having a proximal end (100b) and a distal end (100a) and comprising a sensor arrangement (10) arranged at the distal end (100b) of the medical instrument (100). The sensor arrangement (10) comprises a sensor (20) configured to generate sensor data in the form of an electrical sensor signal, and a data conversion device (40) configured to convert the electrical sensor signal into an optical signal and comprising an electrical input (41) for receiving the electrical sensor signal and an optical output (42) for transmitting the optical signal. The sensor arrangement (10) further comprises an optical fiber (50) configured to transmit the optical signal from the distal end (100a) to the proximal end (100b), the optical fiber (50) coupled to the output of the data conversion device (40) for receiving the optical signal, the optical fiber (50) extending from the distal end (100a) to the proximal end (100b) of the instrument (100).
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: August 15, 2017
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Ronald Dekker, Vincent Adrianus Henneken, Antonia Cornelia Van Rens
  • Publication number: 20170209898
    Abstract: An ultrasound transducer arrangement (100) is disclosed comprising a plurality of substrate islands (110, 120, 130) spatially separated and electrically interconnected by a flexible polymer assembly (150) including electrically conductive tracks providing said electrical interconnections, said plurality including a first substrate island (110) comprising a plurality of ultra sound transducer cells (112) and a second substrate island (120) comprising an array of external contacts for connecting the ultrasound sensor arrangement to a flexible tubular body including a coaxial wire assembly (200) comprising a plurality of coaxial wires (220) each having a conductive core (228) covered by an electrically insulating sleeve (226); and an electrically insulating body (210) having a first main surface (211), a second main surface (213) and a plurality of through holes (212) each extending from the first main surface to the second main surface and coated with an electrically conductive member, wherein each coaxial wire
    Type: Application
    Filed: June 25, 2015
    Publication date: July 27, 2017
    Inventors: VINCENT ADRIANUS HENNEKEN, MARCUS CORNELIS LOUWERSE, JOHANNES WILHELMUS WEEKAMP, RONALD DEKKER, MARC GODFRIEDUS MARIE NOTTEN, ANTONIA CORNELIA JEANNET VAN RENS