Patents by Inventor Vincent J. Nizzo

Vincent J. Nizzo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a multilayer printed circuit board and product thereof
    Patent number: 6110643
    Abstract: In a process for fabricating a multilayer printed circuit board with permanent innerlayers of photoresist, the photo-imageable composition used to form the hard permanent layer comprises a polymerizable acrylate monomer; an oligomer formed by the reaction of an epoxy resin and an acrylic or methacrylic acid; a photosensitive, free radical generating initiator for polymerization of the acrylic monomer and oligomer; a curable epoxy resin; a curing agent for the epoxy resin; and, optionally, a crosslinking agent reactive with hydroxyl groups. After exposure and development of a layer of the photoimageable composition and etching of the underlying metal layer on a board, the resultant photoresist is left on the circuitry traces. The innerlayers of photoresist are stacked in a press where it initially conforms under heat and pressure to fill voids between the innerlayers and then cures to permanence.
    Type: Grant
    Filed: November 13, 1997
    Date of Patent: August 29, 2000
    Assignee: Morton International Inc
    Inventors: James Rath, William Luong-Gia Tran, Kathy M. Flynn, Vinai Ming Tara, Thomas A. Koes, Vincent J. Nizzo
  • Method of forming a multilayer printed circuit board and product thereof
    Patent number: 5928839
    Abstract: In a process for fabricating a multilayer printed circuit board with permanent innerlayers of photoresist, the photoimageable composition used to form the hard permanent layer comprises a polymerizable acrylate monomer; an oligomer formed by the reaction of an epoxy resin and an acrylic or methacrylic acid; a photosensitive, free radical generating initiator for polymerization of the acrylic monomer and oligomer; a curable epoxy resin; a curing agent for the epoxy resin; and, optionally, a crosslinking agent reactive with hydroxyl groups. After exposure and development of a layer of the photoimageable composition and etching of the underlying metal layer on a board, the resultant photoresist is left on the circuitry traces. The innerlayers of photoresist are stacked in a press where it initially conforms under heat and pressure to fill voids between the innerlayers and then cures to permanence.
    Type: Grant
    Filed: February 21, 1996
    Date of Patent: July 27, 1999
    Assignee: Morton International, Inc.
    Inventors: James Rath, William Luong-Gia Tran, Kathy M. Flynn, Vinai Ming Tara, Thomas A. Koes, Vincent J. Nizzo
  • Method of forming a multilayer printed circuit board and product thereof
    Patent number: 5700607
    Abstract: In a process for fabricating a multilayer printed circuit board with permanent innerlayers of photoresist, the photoimageable composition used to form the hard permanent layer comprises a polymerizable acrylate monomer; an oligomer formed by the reaction of an epoxy resin and an acrylic or methacrylic acid; a photosensitive, free radical generating initiator for polymerization of the acrylic monomer and oligomer; a curable epoxy resin; a curing agent for the epoxy resin; and, optionally, a crosslinking agent reactive with hydroxyl groups. After exposure and development of a layer of the photoimageable composition and etching of the underlying metal layer on a board, the resultant photoresist is left on the circuitry traces. The innerlayers of photoresist are stacked in a press where it initially conforms under heat and pressure to fill voids between the innerlayers and then cures to permanence.
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: December 23, 1997
    Assignee: Morton International, Inc.
    Inventors: James Rath, William Luong-Gia Tran, Kathy M. Flynn, Vinai Ming Tara, Thomas A. Koes, Vincent J. Nizzo