Patents by Inventor Viren KALSEKAR

Viren KALSEKAR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210013069
    Abstract: Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a first lid plate seated on the chamber body along a first surface of the first lid plate and defining a plurality of apertures through the plate. The first lid plate may also define a recessed ledge about each aperture. The systems may include a plurality of lid stacks equal to a number of apertures of the plurality of apertures. Each lid stack may be seated on the first lid plate on a separate recessed ledge of the first lid plate. The plurality of lid stacks may at least partially define a plurality of processing regions vertically offset from the transfer region. The systems may also include a second lid plate coupled with the plurality of lid stacks.
    Type: Application
    Filed: July 7, 2020
    Publication date: January 14, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Viren Kalsekar, Vinay Prabhakar
  • Publication number: 20200373132
    Abstract: A substrate pedestal includes a thermally conductive substrate support including a mesh, a thermally conductive shaft including a plurality of conductive rods therein, each conductive rod having a first end and a second end, and a sensor. The first end of each conductive rod is electrically coupled to the mesh, and the sensor is disposed between the first and second ends of each conductive rod and configured to detect current flow through each conductive rod.
    Type: Application
    Filed: March 10, 2020
    Publication date: November 26, 2020
    Inventors: Viren KALSEKAR, Vinay K. PRABHAKAR, Venkata Sharat Chandra PARIMI
  • Publication number: 20200362457
    Abstract: The present disclosure relates to systems and methods for reducing the formation of hardware residue and minimizing secondary plasma formation during substrate processing in a process chamber. The process chamber may include a gas distribution member configured to flow a first gas into a process volume and generate a plasma therefrom. A second gas is supplied into a lower region of the process volume. Further, an exhaust port is disposed in the lower region to remove excess gases or by-products from the process volume during or after processing.
    Type: Application
    Filed: April 24, 2020
    Publication date: November 19, 2020
    Inventors: Liangfa HU, Prashant Kumar KULSHRESHTHA, Anjana M. PATEL, Abdul Aziz KHAJA, Viren KALSEKAR, Vinay K. PRABHAKAR, Satya Teja Babu THOKACHICHU, Byung Seok KWON, Ratsamee LIMDULPAIBOON, Kwangduk Douglas LEE, Ganesh BALASUBRAMANIAN
  • Publication number: 20190341227
    Abstract: One or more embodiments described herein generally relate to selective deposition of substrates in semiconductor processes. In these embodiments, a precursor is delivered to a process region of a process chamber. A plasma is generated by delivering RF power to an electrode within a substrate support surface of a substrate support disposed in the process region of the process chamber. In embodiments described herein, delivering the RF power at a high power range, such as greater than 4.5 kW, advantageously leads to greater plasma coupling to the electrode, resulting in selective deposition to the substrate, eliminating deposition on other process chamber areas such as the process chamber side walls. As such, less process chamber cleans are necessary, leading to less time between depositions, increasing throughput and making the process more cost-effective.
    Type: Application
    Filed: May 3, 2019
    Publication date: November 7, 2019
    Inventors: Satya THOKACHICHU, Edward P. HAMMOND, IV, Viren KALSEKAR, Zheng John YE, Sarah Michelle BOBEK, Abdul Aziz KHAJA, Vinay K. PRABHAKAR, Venkata Sharat Chandra PARIMI, Prashant Kumar KULSHRESHTHA, Kwangduk Douglas LEE
  • Publication number: 20190341232
    Abstract: Embodiments of the present disclosure generally relate to substrate supports for process chambers and RF grounding configurations for use therewith. Methods of grounding RF current are also described. A chamber body at least partially defines a process volume therein. A first electrode is disposed in the process volume. A pedestal is disposed opposite the first electrode. A second electrode is disposed in the pedestal. An RF filter is coupled to the second electrode through a conductive rod. The RF filter includes a first capacitor coupled to the conductive rod and to ground. The RF filter also includes a first inductor coupled to a feedthrough box. The feedthrough box includes a second capacitor and a second inductor coupled in series. A direct current (DC) power supply for the second electrode is coupled between the second capacitor and the second inductor.
    Type: Application
    Filed: April 23, 2019
    Publication date: November 7, 2019
    Inventors: Satya THOKACHICHU, Edward P. HAMMOND, IV, Viren KALSEKAR, Zheng John YE, Abdul Aziz KHAJA, Vinay K. PRABHAKAR