Patents by Inventor Vladimir Stojanovic
Vladimir Stojanovic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11394465Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.Type: GrantFiled: August 18, 2020Date of Patent: July 19, 2022Assignee: Ayar Labs, Inc.Inventors: Chen Sun, Roy Edward Meade, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Derek Van Orden, Michael Davenport
-
Publication number: 20220224433Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module.Type: ApplicationFiled: January 24, 2022Publication date: July 14, 2022Inventors: Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade, Roy Edward Meade
-
Publication number: 20220182158Abstract: Described are methods and circuits for margin testing digital receivers. These methods and circuits prevent margins from collapsing in response to erroneously received data and can thus be used in receivers that employ historical data to reduce intersymbol interference (ISI). Some embodiments detect receive errors for input data streams of unknown patterns and can thus be used for in-system margin testing. Such systems can be adapted to dynamically alter system parameters during device operation to maintain adequate margins despite fluctuations in the system noise environment due to e.g. temperature and supply-voltage changes. Also described are methods of plotting and interpreting filtered and unfiltered error data generated by the disclosed methods and circuits. Some embodiments filter error data to facilitate pattern-specific margin testing.Type: ApplicationFiled: December 21, 2021Publication date: June 9, 2022Inventors: Andrew Ho, Vladimir Stojanovic, Bruno W. Garlepp, Fred F. Chen
-
Publication number: 20220171142Abstract: An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.Type: ApplicationFiled: February 14, 2022Publication date: June 2, 2022Inventors: Alexandra Wright, Mark Wade, Chen Sun, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Roy Edward Meade, Derek Van Orden
-
Publication number: 20220166533Abstract: A network switch system-in-package includes a carrier substrate with a network switch chip and a plurality of photonic input/output modules disposed on the carrier substrate. Each of the plurality of photonic input/output modules includes a module substrate and a plurality of photonic chip pods disposed on the module substrate. Each photonic chip pod includes a pod substrate with a photonic input/output chiplet and a gearbox chiplet attached to the pod substrate. The photonic input/output chiplet includes a parallel electrical interface, a photonic interface, and a plurality of optical macros implemented between the photonic interface and the parallel electrical interface. The gearbox chiplet electrically connects with the parallel electrical interface of the photonic input/output chiplet and a serial electrical interface of the network switch chip.Type: ApplicationFiled: November 16, 2021Publication date: May 26, 2022Inventors: Vladimir Stojanovic, Hugo Saleh, Roy Edward Meade
-
Publication number: 20220149582Abstract: A laser light generator is configured to generate one or more wavelengths of continuous wave laser light. The laser light generator is configured to collectively and simultaneously transmit each of the wavelengths of continuous wave laser light through an optical output of the laser light generator as a laser light supply. An optical fiber is connected to receive the laser light supply from the optical output of the laser light generator. An optical distribution network has an optical input connected to receive the laser light supply from the optical fiber. The optical distribution network is configured to transmit the laser light supply to each of one or more optical transceivers and/or optical sensors. The laser light generator is physically separate from each of the one or more optical transceivers and/or optical sensors.Type: ApplicationFiled: January 24, 2022Publication date: May 12, 2022Inventors: Milos Popovic, Rajeev Ram, Vladimir Stojanovic, Chen Sun, Mark Taylor Wade, Alexandra Carroll Wright
-
Publication number: 20220148627Abstract: A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.Type: ApplicationFiled: January 25, 2022Publication date: May 12, 2022Inventors: Roy Edward Meade, Vladimir Stojanovic, Chen Sun, Mark Wade, Hugo Saleh, Charles Wuischpard
-
Patent number: 11322629Abstract: Method and structural embodiments are described which provide an integrated structure using polysilicon material having different optical properties in different regions of the structure.Type: GrantFiled: January 9, 2021Date of Patent: May 3, 2022Assignee: Micron Technology, Inc.Inventors: Roy Meade, Karan Mehta, Efraim Megged, Jason Orcutt, Milos Popovic, Rajeev Ram, Jeffrey Shainline, Zvi Sternberg, Vladimir Stojanovic, Ofer Tehar-Zahav
-
Publication number: 20220103405Abstract: A signaling system includes a pre-emphasizing transmitter and an equalizing receiver coupled to one another via a high-speed signal path. The receiver measures the quality of data conveyed from the transmitter. A controller uses this information and other information to adaptively establish appropriate transmit pre-emphasis and receive equalization settings, e.g. to select the lowest power setting for which the signaling system provides some minimum communication bandwidth without exceeding a desired bit-error rate.Type: ApplicationFiled: October 15, 2021Publication date: March 31, 2022Inventors: Jared L. Zerbe, Fred F. Chen, Andrew Ho, Ramin Farjad-Rad, John W. Poulton, Kevin S. Donnelly, Brian S. Leibowitz, Vladimir Stojanovic
-
Patent number: 11249260Abstract: An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.Type: GrantFiled: July 23, 2020Date of Patent: February 15, 2022Assignee: Ayar Labs, Inc.Inventors: Alexandra Wright, Mark Wade, Chen Sun, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Roy Edward Meade, Derek Van Orden
-
Publication number: 20220045780Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module.Type: ApplicationFiled: August 24, 2021Publication date: February 10, 2022Inventors: Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade, Roy Edward Meade
-
Patent number: 11233589Abstract: Described are methods and circuits for margin testing digital receivers. These methods and circuits prevent margins from collapsing in response to erroneously received data and can thus be used in receivers that employ historical data to reduce intersymbol interference (ISI). Some embodiments detect receive errors for input data streams of unknown patterns and can thus be used for in-system margin testing. Such systems can be adapted to dynamically alter system parameters during device operation to maintain adequate margins despite fluctuations in the system noise environment due to e.g. temperature and supply-voltage changes. Also described are methods of plotting and interpreting filtered and unfiltered error data generated by the disclosed methods and circuits. Some embodiments filter error data to facilitate pattern-specific margin testing.Type: GrantFiled: November 24, 2020Date of Patent: January 25, 2022Assignee: Rambus Inc.Inventors: Andrew Ho, Vladimir Stojanovic, Bruno W. Garlepp, Fred F. Chen
-
Patent number: 11233371Abstract: A laser light generator is configured to generate one or more wavelengths of continuous wave laser light. The laser light generator is configured to collectively and simultaneously transmit each of the wavelengths of continuous wave laser light through an optical output of the laser light generator as a laser light supply. An optical fiber is connected to receive the laser light supply from the optical output of the laser light generator. An optical distribution network has an optical input connected to receive the laser light supply from the optical fiber. The optical distribution network is configured to transmit the laser light supply to each of one or more optical transceivers and/or optical sensors. The laser light generator is physically separate from each of the one or more optical transceivers and/or optical sensors.Type: GrantFiled: January 30, 2020Date of Patent: January 25, 2022Assignee: Ayar Labs, Inc.Inventors: Milos Popovic, Rajeev Ram, Vladimir Stojanovic, Chen Sun, Mark Taylor Wade, Alexandra Carroll Wright
-
Patent number: 11233596Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module.Type: GrantFiled: July 12, 2019Date of Patent: January 25, 2022Assignee: Ayar Labs, Inc.Inventors: Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade, Roy Edward Meade
-
Patent number: 11233580Abstract: A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.Type: GrantFiled: February 14, 2021Date of Patent: January 25, 2022Assignee: Ayar Labs, Inc.Inventors: Roy Edward Meade, Vladimir Stojanovic, Chen Sun, Mark Wade, Hugo Saleh, Charles Wuischpard
-
Patent number: 11165613Abstract: A signaling system includes a pre-emphasizing transmitter and an equalizing receiver coupled to one another via a high-speed signal path. The receiver measures the quality of data conveyed from the transmitter. A controller uses this information and other information to adaptively establish appropriate transmit pre-emphasis and receive equalization settings, e.g. to select the lowest power setting for which the signaling system provides some minimum communication bandwidth without exceeding a desired bit-error rate.Type: GrantFiled: January 24, 2019Date of Patent: November 2, 2021Assignee: Rambus Inc.Inventors: Jared L. Zerbe, Fred F. Chen, Andrew Ho, Ramin Farjad-Rad, John W. Poulton, Kevin S. Donnelly, Brian S. Leibowitz, Vladimir Stojanovic
-
Publication number: 20210286129Abstract: An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.Type: ApplicationFiled: February 24, 2021Publication date: September 16, 2021Inventors: John Fini, Vladimir Stojanovic, Chen Sun, Derek van Orden, Mark Taylor Wade
-
Patent number: 11101912Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module.Type: GrantFiled: July 12, 2019Date of Patent: August 24, 2021Assignee: Ayar Labs, Inc.Inventors: Vladimir Stojanovic, Alexandra Wright, Chen Sun, Mark Wade, Roy Edward Meade
-
Publication number: 20210258078Abstract: A remote memory system includes a substrate of a multi-chip package, an integrated circuit chip connected to the substrate, and an electro-optical chip connected to the substrate. The integrated circuit chip includes a high-bandwidth memory interface. An electrical interface of the electro-optical chip is electrically connected to the high-bandwidth memory interface. A photonic interface of the electro-optical chip is configured to optically connect with an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals received through the electrical interface from the high-bandwidth interface into outgoing optical data signals. The optical macro transmits the outgoing optical data signals through the photonic interface to the optical link. The optical macro also converts incoming optical data signals received through the photonic interface into incoming electrical data signals.Type: ApplicationFiled: February 14, 2021Publication date: August 19, 2021Inventors: Roy Edward Meade, Vladimir Stojanovic, Chen Sun, Mark Wade, Hugo Saleh, Charles Wuischpard
-
Publication number: 20210257021Abstract: A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.Type: ApplicationFiled: February 14, 2021Publication date: August 19, 2021Inventors: Roy Edward Meade, Vladimir Stojanovic, Chen Sun, Mark Wade, Hugo Saleh, Charles Wuischpard