Patents by Inventor Vlasta A. Brusic

Vlasta A. Brusic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9343330
    Abstract: The invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition comprises an oxidizing agent, calcium ion, an organic carboxylic acid, and water, wherein the polishing composition has a pH of about 1.5 to about 7. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: May 17, 2016
    Assignee: Cabot Microelectronics Corporation
    Inventors: Vlasta Brusic, Renjie Zhou, Paul Feeney, Christopher Thompson
  • Patent number: 8623767
    Abstract: The invention provides compositions and methods for planarizing or polishing a substrate. The composition comprises an abrasive consisting of alumina particles optionally treated with a polymer, an ?-hydroxycarboxylic acid, an oxidizing agent that oxidizes at least one metal, polyacrylic acid, optionally, a calcium-containing compound, optionally, a biocide, optionally, a pH adjusting agent, and water. The method uses the composition to chemically-mechanically polish a substrate.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: January 7, 2014
    Assignee: Cabot Microelectronics Corporation
    Inventors: Vlasta Brusic, Christopher Thompson, Jeffrey Dysard
  • Patent number: 8435421
    Abstract: The present invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing copper- and/or silver-containing substrates. The compositions of the present invention comprise a particulate abrasive, a primary film-forming metal-complexing agent, and a secondary film-forming metal-passivating agent in an aqueous carrier. Methods of polishing a substrate with the compositions of the invention are also disclosed.
    Type: Grant
    Filed: January 11, 2011
    Date of Patent: May 7, 2013
    Assignee: Cabot Microelectronics Corporation
    Inventors: Jason Keleher, Pankaj Singh, Vlasta Brusic
  • Patent number: 8425797
    Abstract: The invention provides compositions and methods for planarizing or polishing a substrate. The composition comprises an abrasive consisting of alumina particles optionally treated with a polymer, an ?-hydroxycarboxylic acid, an oxidizing agent that oxidizes at least one metal, polyacrylic acid, optionally, a calcium-containing compound, optionally, a biocide, optionally, a pH adjusting agent, and water. The method uses the composition to chemically-mechanically polish a substrate.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: April 23, 2013
    Assignee: Cabot Microelectronics Corporation
    Inventors: Vlasta Brusic, Christopher Thompson, Jeffrey Dysard
  • Patent number: 8251777
    Abstract: The invention is directed to a method of polishing a surface of an object that includes aluminum. The method includes the step of contacting the surface of the object with a soft polishing pad and a polishing composition. The polishing composition includes abrasive particles, an agent that oxidizes aluminum, and a liquid carrier to polish the surface of the object. The polishing composition includes the abrasive particles suspended in the liquid carrier, and is applied at a pH above about 7.
    Type: Grant
    Filed: February 11, 2008
    Date of Patent: August 28, 2012
    Assignee: Cabot Microelectronics Corporation
    Inventors: Kevin Moeggenborg, John Clark, Jeffrey Gilliland, Stanley Lesiak, Susan Wilson, Vlasta Brusic
  • Patent number: 8101093
    Abstract: The invention provides methods of polishing a noble metal-containing substrate with one of two chemical-mechanical polishing compositions. The first chemical-mechanical polishing composition comprises (a) an abrasive comprising ?-alumina, (b) about 0.05 to about 50 mmol/kg of ions of calcium, strontium, barium, or mixtures thereof, and (c) a liquid carrier comprising water. The second chemical-mechanical polishing composition comprises (a) an abrasive selected from the group consisting of ?-alumina, ?-alumina, ?-alumina, ?-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of calcium, strontium, barium, magnesium, zinc, or mixtures thereof, and (c) a liquid carrier comprising water.
    Type: Grant
    Filed: February 26, 2009
    Date of Patent: January 24, 2012
    Assignee: Cabot Microelectronics Corporation
    Inventors: Francesco de Rege Thesauro, Kevin J. Moeggenborg, Vlasta Brusic, Benjamin P. Bayer
  • Patent number: 8062096
    Abstract: The invention is directed to a method of polishing a surface of a substrate comprising aluminum, comprising contacting a surface of the substrate with a polishing pad and a polishing composition comprising an abrasive, an agent that oxidizes aluminum, and a liquid carrier, and abrading at least a portion of the surface to remove at least some aluminum from the substrate and to polish the surface of the substrate, wherein the abrasive is in particulate form and is suspended in the liquid carrier.
    Type: Grant
    Filed: June 30, 2005
    Date of Patent: November 22, 2011
    Assignee: Cabot Microelectronics Corporation
    Inventors: Vlasta Brusic, Richard Jon Jenkins, Christopher C. Thompson
  • Patent number: 7998335
    Abstract: The invention relates to a method of polishing a substrate comprising at least one metal layer by applying an electrochemical potential between the substrate and at least one electrode in contact with a polishing composition comprising a reducing agent or an oxidizing agent.
    Type: Grant
    Filed: June 13, 2005
    Date of Patent: August 16, 2011
    Assignee: Cabot Microelectronics Corporation
    Inventors: Paul M. Feeney, Vlasta Brusic
  • Publication number: 20110100956
    Abstract: The present invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing copper- and/or silver-containing substrates. The compositions of the present invention comprise a particulate abrasive, a primary film-forming metal-complexing agent, and a secondary film-forming metal-passivating agent in an aqueous carrier. Methods of polishing a substrate with the compositions of the invention are also disclosed.
    Type: Application
    Filed: January 11, 2011
    Publication date: May 5, 2011
    Inventors: Jason KELEHER, Pankaj Singh, Vlasta Brusic
  • Publication number: 20090236559
    Abstract: The invention provides compositions and methods for planarizing or polishing a substrate. The composition comprises an abrasive consisting of alumina particles optionally treated with a polymer, an ?-hydroxycarboxylic acid, an oxidizing agent that oxidizes at least one metal, polyacrylic acid, optionally, a calcium-containing compound, optionally, a biocide, optionally, a pH adjusting agent, and water. The method uses the composition to chemically-mechanically polish a substrate.
    Type: Application
    Filed: March 21, 2008
    Publication date: September 24, 2009
    Applicant: Cabot Microelectronics Corporation
    Inventors: Vlasta Brusic, Christopher Thompson, Jeffrey Dysard
  • Publication number: 20090152240
    Abstract: The invention provides methods of polishing a noble metal-containing substrate with one of two chemical-mechanical polishing compositions. The first chemical-mechanical polishing composition comprises (a) an abrasive comprising ?-alumina, (b) about 0.05 to about 50 mmol/kg of ions of calcium, strontium, barium, or mixtures thereof, and (c) a liquid carrier comprising water. The second chemical-mechanical polishing composition comprises (a) an abrasive selected from the group consisting of ?-alumina, ?-alumina, ?-alumina, ?-alumina, diamond, boron carbide, silicon carbide, tungsten carbide, titanium nitride, and mixtures thereof, (b) about 0.05 to about 3.5 mmol/kg of ions of calcium, strontium, barium, magnesium, zinc, or mixtures thereof, and (c) a liquid carrier comprising water.
    Type: Application
    Filed: February 26, 2009
    Publication date: June 18, 2009
    Applicant: Cabot Microelectronics Corporation
    Inventors: Francesco de Rege Thesauro, Kevin J. Moeggenborg, Vlasta Brusic, Benjamin P. Bayer
  • Publication number: 20080200098
    Abstract: The invention is directed to a method of polishing a surface of an object that includes aluminum. The method includes the step of contacting the surface of the object with a soft polishing pad and a polishing composition. The polishing composition includes abrasive particles, an agent that oxidizes aluminum, and a liquid carrier to polish the surface of the object. The polishing composition includes the abrasive particles suspended in the liquid carrier, and is applied at a pH above about 7.
    Type: Application
    Filed: February 11, 2008
    Publication date: August 21, 2008
    Inventors: Kevin Moeggenborg, John Clark, Jeffrey Gilliland, Stanley Lesiak, Susan Wilson, Vlasta Brusic
  • Publication number: 20080156774
    Abstract: The invention provides a method of chemically-mechanically polishing a gold-containing surface of a substrate with a cyanide-free chemical-mechanical polishing (CMP) composition.
    Type: Application
    Filed: March 7, 2008
    Publication date: July 3, 2008
    Inventors: Vlasta Brusic, Renjie Zhou, Christopher Thompson
  • Publication number: 20080134585
    Abstract: The invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition comprises an oxidizing agent, calcium ion, an organic carboxylic acid, and water, wherein the polishing composition has a pH of about 1.5 to about 7. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition.
    Type: Application
    Filed: December 6, 2006
    Publication date: June 12, 2008
    Applicant: Cabot Microelectronics Corporation
    Inventors: Vlasta Brusic, Renjie Zhou, Paul Feeney, Christopher Thompson
  • Patent number: 7381648
    Abstract: A chemical mechanical polishing slurry comprising an oxidizing agent, a complexing agent, an abrasive, and an optional surfactant, as well as a method for using the chemical mechanical polishing slurry to remove copper alloy, titanium, titanium nitride, tantalum and tantalum nitride containing layers from a substrate. The slurry does not include a separate film-forming agent.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: June 3, 2008
    Assignee: Cabot Microelectronics Corporation
    Inventors: Vlasta Brusic Kaufman, Rodney C. Kistler, Shumin Wang
  • Publication number: 20080105652
    Abstract: The invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition comprises an abrasive, an oxidizing agent, an amphiphilic nonionic surfactant, calcium ion or magnesium ion, a corrosion inhibitor for copper, and water, wherein the pH of the polishing composition is about 6 to about 12. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition.
    Type: Application
    Filed: November 2, 2006
    Publication date: May 8, 2008
    Applicant: Cabot Microelectronics Corporation
    Inventors: Vlasta Brusic, Renjie Zhou, Christopher C. Thompson, Paul M. Feeney
  • Patent number: 7368066
    Abstract: The invention provides a cyanide-free chemical-mechanical polishing (CMP) composition useful for polishing a gold-containing surface of a substrate. The CMP composition comprises an abrasive, a gold-oxidizing agent, a cyanide-free gold-solubilizing agent, and an aqueous carrier therefor. The invention further provides a method of chemically-mechanically polishing a gold-containing surface of a substrate with the aforementioned polishing composition.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: May 6, 2008
    Assignee: Cabot Microelectronics Corporation
    Inventors: Vlasta Brusic, Renjie Zhou, Christopher Thompson
  • Patent number: 7354530
    Abstract: Alpha-amino acid containing chemical mechanical polishing compositions and slurries that are useful for polishing substrates including multiple layers of metals, or metals and dielectrics.
    Type: Grant
    Filed: January 10, 2005
    Date of Patent: April 8, 2008
    Inventors: Shumin Wang, Vlasta Brusic Kaufman
  • Publication number: 20070278184
    Abstract: The invention provides a cyanide-free chemical-mechanical polishing (CMP) composition useful for polishing a gold-containing surface of a substrate. The CMP composition comprises an abrasive, a gold-oxidizing agent, a cyanide-free gold-solubilizing agent, and an aqueous carrier therefor. The invention further provides a method of chemically-mechanically polishing a gold-containing surface of a substrate with the aforementioned polishing composition.
    Type: Application
    Filed: May 31, 2006
    Publication date: December 6, 2007
    Inventors: Vlasta Brusic, Renjie Zhou, Christopher Thompson
  • Patent number: 7288021
    Abstract: The invention provides a method for polishing a substrate comprising a metal in an oxidized form, the method comprising the steps of: (a) providing a substrate comprising a metal in an oxidized form, (b) contacting a portion of the substrate with a chemical-mechanical polishing system comprising: (i) a polishing component, (ii) a reducing agent, and (iii) a liquid carrier, and (c) abrading at least a portion of the metal in an oxidized form to polish the substrate. The reducing agent can be selected from the group consisting of 3-hydroxy-4-pyrones, ?-hydroxy-?-butyrolactones, ascorbic acid, borane, borohydrides, dialkylamine boranes, formaldehyde, formic acid, hydrogen, hydroquinones, hydroxylamine, hypophosphorous acid, phosphorous acid, a metal or metal ions in an oxidation state having a standard redox potential that is less than the standard redox potential of the metal in an oxidized form, trihydroxybenzenes, solvated electrons, sulfurous acid, salts thereof, and mixtures thereof.
    Type: Grant
    Filed: January 7, 2004
    Date of Patent: October 30, 2007
    Assignee: Cabot Microelectronics Corporation
    Inventors: Francesco De Rege Thesauro, Vlasta Brusic, Benjamin P. Bayer