Patents by Inventor Volker K. Kestler

Volker K. Kestler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for encapsulating an electronic component
    Patent number: 12119422
    Abstract: A method of encapsulating an electronic component. The method includes applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate. The applicator roll comprises an outer surface and is spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component. The gap controls the thickness of the first layer of encapsulating composition. The first layer of encapsulating composition encapsulates the electronic component on the substrate. An interface between the surface of the electronic component and the encapsulating composition being substantially free of voids.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: October 15, 2024
    Assignee: H.B. Fuller Company
    Inventors: Peter Remmers, Volker K. Kestler, Thomas F. Kauffman
  • SYSTEMS AND METHODS FOR ENCAPSULATING AN ELECTRONIC COMPONENT
    Publication number: 20220181511
    Abstract: A method of encapsulating an electronic component. The method includes applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate. The applicator roll comprises an outer surface and is spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component. The gap controls the thickness of the first layer of encapsulating composition. The first layer of encapsulating composition encapsulates the electronic component on the substrate. An interface between the surface of the electronic component and the encapsulating composition being substantially free of voids.
    Type: Application
    Filed: March 6, 2020
    Publication date: June 9, 2022
    Inventors: Peter Remmers, Volker K. Kestler, Thomas F. Kauffman