Patents by Inventor Volker Strutz

Volker Strutz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200056910
    Abstract: A sensor package including a metal carrier and a sensor chip arranged on the metal carrier and having a first sensor element. In an orthogonal projection of the sensor chip onto a surface of the metal carrier, at least two edge sections of the sensor chip are free of overlap with the surface of the metal carrier. The sensor chip is designed to detect a magnetic field induced by an electric current flowing through a current conductor.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 20, 2020
    Inventors: Volker Strutz, Rainer Markus Schaller
  • Publication number: 20200043836
    Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.
    Type: Application
    Filed: October 8, 2019
    Publication date: February 6, 2020
    Applicant: Infineon Technologies AG
    Inventors: Manfred Schindler, Franz-Peter Kalz, Volker Strutz
  • Patent number: 10515879
    Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: December 24, 2019
    Assignee: Infineon Technologies AG
    Inventors: Manfred Schindler, Klaus Elian, Volker Strutz, Horst Theuss, Michael Weber
  • Publication number: 20190386206
    Abstract: A current sensor package, comprises a current path and a sensing device. The sensing device is spaced from the current path, and the sensing device is configured for sensing a magnetic field generated by a current flowing through the current path. Further, the sensing device comprises a sensor element. The sensing device is electrically connected to a conductive trace. An encapsulant extends continuously between the current path and the sensing device.
    Type: Application
    Filed: June 14, 2019
    Publication date: December 19, 2019
    Applicant: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Volker Strutz
  • Patent number: 10505102
    Abstract: A semiconductor device includes a substrate, a semiconductor die attached to the substrate, and an encapsulation material. The semiconductor die includes a sensing element. The encapsulation material encapsulates the semiconductor die and a portion of the substrate. The encapsulation material defines a through-hole to receive a conductive element. The sensing element may include a magnetic field sensor to sense a magnetic field generated by the conductive element.
    Type: Grant
    Filed: April 4, 2016
    Date of Patent: December 10, 2019
    Assignee: Infineon Technologies AG
    Inventors: Volker Strutz, Klaus Elian, Cyrus Ghahremani, Rainer Markus Schaller
  • Patent number: 10438878
    Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: October 8, 2019
    Assignee: Infineon Technologies AG
    Inventors: Manfred Schindler, Franz-Peter Kalz, Volker Strutz
  • Patent number: 10304795
    Abstract: A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 ?·cm and 1010 ?·cm.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: May 28, 2019
    Assignee: Infineon Technologies AG
    Inventors: Volker Strutz, Rainer Markus Schaller, Franz-Peter Kalz
  • Publication number: 20180350727
    Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 6, 2018
    Applicant: Infineon Technologies AG
    Inventors: Manfred Schindler, Klaus Elian, Volker Strutz, Horst Theuss, Michael Weber
  • Publication number: 20180294210
    Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.
    Type: Application
    Filed: April 10, 2018
    Publication date: October 11, 2018
    Applicant: Infineon Technologies AG
    Inventors: Manfred Schindler, Franz-Peter Kalz, Volker Strutz
  • Publication number: 20170352638
    Abstract: A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 ?·cm and 1010 ?·cm.
    Type: Application
    Filed: August 22, 2017
    Publication date: December 7, 2017
    Applicant: Infineon Technologies AG
    Inventors: Volker Strutz, Rainer Markus Schaller, Franz-Peter Kalz
  • Publication number: 20170288130
    Abstract: A semiconductor device includes a substrate, a semiconductor die attached to the substrate, and an encapsulation material. The semiconductor die includes a sensing element. The encapsulation material encapsulates the semiconductor die and a portion of the substrate. The encapsulation material defines a through-hole to receive a conductive element. The sensing element may include a magnetic field sensor to sense a magnetic field generated by the conductive element.
    Type: Application
    Filed: April 4, 2016
    Publication date: October 5, 2017
    Applicant: Infineon Technologies AG
    Inventors: Volker Strutz, Klaus Elian, Cyrus Ghahremani, Rainer Markus Schaller
  • Publication number: 20170256515
    Abstract: A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 ?·cm and 1010 ?·cm.
    Type: Application
    Filed: March 1, 2016
    Publication date: September 7, 2017
    Applicant: Infineon Technologies AG
    Inventors: Volker Strutz, Rainer Markus Schaller, Franz-Peter Kalz
  • Patent number: 9741677
    Abstract: A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 ?·cm and 1010 ?·cm.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: August 22, 2017
    Assignee: Infineon Technologies AG
    Inventors: Volker Strutz, Rainer Markus Schaller, Franz-Peter Kalz
  • Patent number: 9728493
    Abstract: A semiconductor device package includes a leadframe and a semiconductor chip mounted to the leadframe. The semiconductor device package further includes a molded encapsulant configured to cast-in-place the leadframe. A surface area of the leadframe remains exposed by the encapsulant. An electrically insulating covering layer extends over a part of the surface area and is configured to divide the surface area in at least two zones.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: August 8, 2017
    Assignee: Infineon Technologies AG
    Inventors: Volker Strutz, Rainer Schaller
  • Publication number: 20170148981
    Abstract: In one embodiment, a method of forming a current sensor device includes forming a device region comprising a magnetic sensor within and/or over a semiconductor substrate. The device region is formed adjacent a front side of the semiconductor substrate. The back side of the semiconductor substrate is attached over an insulating substrate, where the back side is opposite the front side. Sidewalls of the semiconductor substrate are exposed by dicing the semiconductor substrate from the front side without completely dicing the insulating substrate. An isolation liner is formed over all of the exposed sidewalls of the semiconductor substrate. The isolation liner and the insulating substrate include a different material. The method further includes separating the insulating substrate to form diced chips, removing at least a portion of the isolation liner from over a top surface of the device region, and forming contacts over the top surface of the device region.
    Type: Application
    Filed: February 8, 2017
    Publication date: May 25, 2017
    Inventors: Carsten von Koblinski, Volker Strutz, Manfred Engelhardt
  • Patent number: 9658296
    Abstract: A current sensor device includes a casing having a cavity and a conductor fixedly mounted to the casing. A semiconductor chip configured to sense a magnetic field is arranged in the cavity. An electrically insulating medium is configured to at least partially fill the cavity of the casing.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: May 23, 2017
    Assignee: Infineon Technologies AG
    Inventors: Udo Ausserlechner, Volker Strutz, Jochen Dangelmaier, Rainer Steiner
  • Patent number: 9608201
    Abstract: In one embodiment, a method of forming a current sensor device includes forming a device region comprising a magnetic sensor within and/or over a semiconductor substrate. The device region is formed adjacent a front side of the semiconductor substrate. The back side of the semiconductor substrate is attached over an insulating substrate, where the back side is opposite the front side. Sidewalls of the semiconductor substrate are exposed by dicing the semiconductor substrate from the front side without completely dicing the insulating substrate. An isolation liner is formed over all of the exposed sidewalls of the semiconductor substrate. The isolation liner and the insulating substrate include a different material. The method further includes separating the insulating substrate to form diced chips, removing at least a portion of the isolation liner from over a top surface of the device region, and forming contacts over the top surface of the device region.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: March 28, 2017
    Assignee: Infineon Technologies AG
    Inventors: Carsten von Koblinski, Volker Strutz, Manfred Engelhardt
  • Publication number: 20170062312
    Abstract: A semiconductor device package includes a leadframe and a semiconductor chip mounted to the leadframe. The semiconductor device package further includes a molded encapsulant configured to cast-in-place the leadframe. A surface area of the leadframe remains exposed by the encapsulant. An electrically insulating covering layer extends over a part of the surface area and is configured to divide the surface area in at least two zones.
    Type: Application
    Filed: August 28, 2015
    Publication date: March 2, 2017
    Inventors: Volker Strutz, Rainer Schaller
  • Patent number: 9553208
    Abstract: A current sensor device for sensing a measuring current includes a semiconductor chip having a magnetic field sensitive element. The current sensor device further includes an encapsulant embedding the semiconductor chip. A conductor configured to carry the measuring current is electrically insulated from the magnetic field sensitive element. A redistribution structure includes a first metal layer having a first structured portion which forms part of the conductor.
    Type: Grant
    Filed: September 16, 2013
    Date of Patent: January 24, 2017
    Assignee: Infineon Technologies AG
    Inventors: Gottfried Beer, Volker Strutz, Horst Theuss
  • Patent number: 9523720
    Abstract: A multiple current sensor device or a multiple current shunt device includes at least two resistive sections comprising a first resistive section and a second resistive section, at least two connecting sections comprising a first connecting section and a second connecting section and a common connecting section. The first resistive section is electrically coupled in between the first connecting section and the common connecting section. The second resistive section is electrically coupled in between the second connecting section and the common connecting section. Using an embodiment may improve a trade-off between an efficient integration, a compact integration, a compact implementation and an accurate determination of at least one value indicative of at least one of multiple currents.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 20, 2016
    Assignee: Infineon Technologies AG
    Inventors: Udo Ausserlechner, Volker Strutz