Patents by Inventor Volker Strutz

Volker Strutz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210302474
    Abstract: A sensor apparatus comprises an electrically conductive chip carrier comprising a busbar, a first connection and a second connection, and a differential magnetic field sensor chip which is arranged on the chip carrier and has two sensor elements. The form of the busbar is such that a measurement current path running from the first connection to the second connection through the busbar comprises a main current path and a bypass current path, wherein the main current path and the bypass current path run parallel to one another, and a bypass current flowing through the bypass current path is less than a main current flowing through the main current path. The magnetic field sensor chip is configured to capture a magnetic field induced by the bypass current.
    Type: Application
    Filed: March 30, 2021
    Publication date: September 30, 2021
    Inventors: Klaus ELIAN, Rainer Markus SCHALLER, Volker STRUTZ
  • Patent number: 11094619
    Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: August 17, 2021
    Assignee: Infineon Technologies AG
    Inventors: Manfred Schindler, Franz-Peter Kalz, Volker Strutz
  • Publication number: 20210088600
    Abstract: A sensor device comprises a busbar, a dielectric arranged on the busbar, and a sensor chip arranged on the dielectric, wherein the sensor chip is designed to measure a magnetic field induced by an electric current flowing through the busbar, wherein the surface of the dielectric facing toward the busbar is spaced from the busbar in an area along the entire periphery of the dielectric.
    Type: Application
    Filed: September 14, 2020
    Publication date: March 25, 2021
    Inventors: Juergen HOEGERL, Rainer Markus SCHALLER, Volker STRUTZ
  • Publication number: 20210063445
    Abstract: A sensor device comprises a dielectric substrate, a busbar mechanically connected to the dielectric substrate, a cavity formed in the dielectric substrate, and a sensor chip arranged in the cavity, wherein the sensor chip is designed to detect a magnetic field induced by an electric current flowing through the busbar, wherein in an orthogonal projection of the sensor chip onto the busbar, the sensor chip at least partly overlaps the busbar.
    Type: Application
    Filed: August 24, 2020
    Publication date: March 4, 2021
    Inventors: Rainer Markus SCHALLER, Juergen HOEGERL, Volker STRUTZ
  • Publication number: 20210011095
    Abstract: A sensor device comprises an electrically conductive chip carrier, wherein the chip carrier comprises an auxiliary structure, wherein the auxiliary structure comprises a first precalibration current terminal and a second precalibration current terminal, a magnetic field sensor chip arranged on a mounting surface of the chip carrier, wherein the magnetic field sensor chip comprises a sensor element, wherein the shape of the auxiliary structure is embodied such that an electrical precalibration current flowing from the first precalibration current terminal to the second precalibration current terminal through the auxiliary structure induces a predefined precalibration magnetic field at the location of the sensor element, wherein during measurement operation of the precalibrated sensor device, no precalibration current flows between the first precalibration current terminal and the second precalibration current terminal.
    Type: Application
    Filed: July 8, 2020
    Publication date: January 14, 2021
    Inventors: Gernot BINDER, Riccardo DAPRETTO, Diego LUNARDINI, Mario MOTZ, Volker STRUTZ
  • Publication number: 20200056910
    Abstract: A sensor package including a metal carrier and a sensor chip arranged on the metal carrier and having a first sensor element. In an orthogonal projection of the sensor chip onto a surface of the metal carrier, at least two edge sections of the sensor chip are free of overlap with the surface of the metal carrier. The sensor chip is designed to detect a magnetic field induced by an electric current flowing through a current conductor.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 20, 2020
    Inventors: Volker Strutz, Rainer Markus Schaller
  • Publication number: 20200043836
    Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.
    Type: Application
    Filed: October 8, 2019
    Publication date: February 6, 2020
    Applicant: Infineon Technologies AG
    Inventors: Manfred Schindler, Franz-Peter Kalz, Volker Strutz
  • Patent number: 10515879
    Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: December 24, 2019
    Assignee: Infineon Technologies AG
    Inventors: Manfred Schindler, Klaus Elian, Volker Strutz, Horst Theuss, Michael Weber
  • Publication number: 20190386206
    Abstract: A current sensor package, comprises a current path and a sensing device. The sensing device is spaced from the current path, and the sensing device is configured for sensing a magnetic field generated by a current flowing through the current path. Further, the sensing device comprises a sensor element. The sensing device is electrically connected to a conductive trace. An encapsulant extends continuously between the current path and the sensing device.
    Type: Application
    Filed: June 14, 2019
    Publication date: December 19, 2019
    Applicant: Infineon Technologies AG
    Inventors: Rainer Markus Schaller, Volker Strutz
  • Patent number: 10505102
    Abstract: A semiconductor device includes a substrate, a semiconductor die attached to the substrate, and an encapsulation material. The semiconductor die includes a sensing element. The encapsulation material encapsulates the semiconductor die and a portion of the substrate. The encapsulation material defines a through-hole to receive a conductive element. The sensing element may include a magnetic field sensor to sense a magnetic field generated by the conductive element.
    Type: Grant
    Filed: April 4, 2016
    Date of Patent: December 10, 2019
    Assignee: Infineon Technologies AG
    Inventors: Volker Strutz, Klaus Elian, Cyrus Ghahremani, Rainer Markus Schaller
  • Patent number: 10438878
    Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: October 8, 2019
    Assignee: Infineon Technologies AG
    Inventors: Manfred Schindler, Franz-Peter Kalz, Volker Strutz
  • Patent number: 10304795
    Abstract: A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 ?·cm and 1010 ?·cm.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: May 28, 2019
    Assignee: Infineon Technologies AG
    Inventors: Volker Strutz, Rainer Markus Schaller, Franz-Peter Kalz
  • Publication number: 20180350727
    Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.
    Type: Application
    Filed: May 30, 2018
    Publication date: December 6, 2018
    Applicant: Infineon Technologies AG
    Inventors: Manfred Schindler, Klaus Elian, Volker Strutz, Horst Theuss, Michael Weber
  • Publication number: 20180294210
    Abstract: A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.
    Type: Application
    Filed: April 10, 2018
    Publication date: October 11, 2018
    Applicant: Infineon Technologies AG
    Inventors: Manfred Schindler, Franz-Peter Kalz, Volker Strutz
  • Publication number: 20170352638
    Abstract: A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 ?·cm and 1010 ?·cm.
    Type: Application
    Filed: August 22, 2017
    Publication date: December 7, 2017
    Applicant: Infineon Technologies AG
    Inventors: Volker Strutz, Rainer Markus Schaller, Franz-Peter Kalz
  • Publication number: 20170288130
    Abstract: A semiconductor device includes a substrate, a semiconductor die attached to the substrate, and an encapsulation material. The semiconductor die includes a sensing element. The encapsulation material encapsulates the semiconductor die and a portion of the substrate. The encapsulation material defines a through-hole to receive a conductive element. The sensing element may include a magnetic field sensor to sense a magnetic field generated by the conductive element.
    Type: Application
    Filed: April 4, 2016
    Publication date: October 5, 2017
    Applicant: Infineon Technologies AG
    Inventors: Volker Strutz, Klaus Elian, Cyrus Ghahremani, Rainer Markus Schaller
  • Publication number: 20170256515
    Abstract: A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 ?·cm and 1010 ?·cm.
    Type: Application
    Filed: March 1, 2016
    Publication date: September 7, 2017
    Applicant: Infineon Technologies AG
    Inventors: Volker Strutz, Rainer Markus Schaller, Franz-Peter Kalz
  • Patent number: 9741677
    Abstract: A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 ?·cm and 1010 ?·cm.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: August 22, 2017
    Assignee: Infineon Technologies AG
    Inventors: Volker Strutz, Rainer Markus Schaller, Franz-Peter Kalz
  • Patent number: 9728493
    Abstract: A semiconductor device package includes a leadframe and a semiconductor chip mounted to the leadframe. The semiconductor device package further includes a molded encapsulant configured to cast-in-place the leadframe. A surface area of the leadframe remains exposed by the encapsulant. An electrically insulating covering layer extends over a part of the surface area and is configured to divide the surface area in at least two zones.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: August 8, 2017
    Assignee: Infineon Technologies AG
    Inventors: Volker Strutz, Rainer Schaller
  • Publication number: 20170148981
    Abstract: In one embodiment, a method of forming a current sensor device includes forming a device region comprising a magnetic sensor within and/or over a semiconductor substrate. The device region is formed adjacent a front side of the semiconductor substrate. The back side of the semiconductor substrate is attached over an insulating substrate, where the back side is opposite the front side. Sidewalls of the semiconductor substrate are exposed by dicing the semiconductor substrate from the front side without completely dicing the insulating substrate. An isolation liner is formed over all of the exposed sidewalls of the semiconductor substrate. The isolation liner and the insulating substrate include a different material. The method further includes separating the insulating substrate to form diced chips, removing at least a portion of the isolation liner from over a top surface of the device region, and forming contacts over the top surface of the device region.
    Type: Application
    Filed: February 8, 2017
    Publication date: May 25, 2017
    Inventors: Carsten von Koblinski, Volker Strutz, Manfred Engelhardt